NTE2398

Manufacturer Part NumberNTE2398
DescriptionMOSFET; N-Ch; VDSS 500V; RDS(ON) 1.5 Ohms; ID 4.5A; TO-220; PD 74W; VGS +/-20V; Qg 38nC
ManufacturerNTE Electronics, Inc.
NTE2398 datasheets

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Specifications of NTE2398

Channel TypeN-ChannelCurrent, Drain4.5 A
Fall Time16 ns (Typ.)Gate Charge, Total38 nC
Mounting And Package TypeM3 Screw MountingOperating And Storage Temperature-55 to +150 °C
Package TypeTO-220PolarizationN-Channel
Power Dissipation74 WResistance, Drain To Source On1.5 Ohms
Resistance, Thermal, Junction To Case1.7 °C⁄WTemperature, Operating, Maximum+150 °C
Temperature, Operating, Minimum-55 °CThermal Resistance, Junction To Ambient62 °C⁄W
Time, Rise16 ns (Typ.)Time, Turn-off Delay42 ns
Time, Turn-on Delay8.2 nsTransconductance, Forward2.5 Mhos
Voltage, Breakdown, Drain To Source500 VVoltage, Forward, Diode1.6 V
Voltage, Gate To Source±20 V  
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Features:
D Dynamic dv/dt Rating
D Repetitive Avalanche Rated
D Fast Switching
D Ease of Paralleling
D Simple Drive Requirements
Absolute Maximum Ratings:
Continuous Drain Current (V
T
= +25 C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C
T
= +100 C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C
Pulsed Drain Current (Note 1), I
Power Dissipation (T
= +25 C), P
C
Derate Linearly Above 25 C
Gate–to–Source Voltage, V
Single Pulse Avalanche Energy (Note 2), E
Avalanche Current (Note 1), I
Repetitive Avalanche Energy (Note 1), E
Peak Diode Recovery dv/dt (Note 3), dv/dt
Operating Junction Temperature Range, T
Storage Temperature Range, T
Lead Temperature (During Soldering, 1.6mm from case for 10sec), T
Mounting Torque (6–32 or M3 Screw)
Thermal Resistance, Junction–to–Case, R
Thermal Resistance, Junction–to–Ambient, R
Typical Thermal Resistance, Case–to–Sink (Flat, Greased Surface), R
Note 1. Repetitive rating; pulse width limited by maximum junction temperature.
Note 2. V
= 50V, starting T
DD
Note 3. I
4.5A, di/dt
75A/ s, V
SD
NTE2398
MOSFET
N–Ch, Enhancement Mode
High Speed Switch
= 10V), I
GS
D
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DM
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
D
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AR
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AR
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
J
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
thJC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
thJA
= +25 C, L = 24mH, R
J
G
V
, T
DD
(BR)DSS
J
–55 to +150 C
–55 to +150 C
. . . . . . . . . . . . . . . . .
L
10 lbfin (1.1Nm)
. . . . . . . . . . . .
thCS
= 25 , I
= 4.5A
AS
+150 C
4.5A
2.9A
18A
74W
0.59W/ C
20V
280mJ
4.5A
7.4mJ
3.5V/ns
+300 C
1.7 C/W
62 C/W
0.5 C/W

NTE2398 Summary of contents

  • Page 1

    ... Thermal Resistance, Junction–to–Ambient, R Typical Thermal Resistance, Case–to–Sink (Flat, Greased Surface), R Note 1. Repetitive rating; pulse width limited by maximum junction temperature. Note 50V, starting T DD Note 3. I 4.5A, di/dt 75A NTE2398 MOSFET N–Ch, Enhancement Mode High Speed Switch = 10V ...

  • Page 2

    Electrical Characteristics: (T Parameter Drain–to–Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain–to–Source On–Resistance Gate Threshold Voltage Forward Transconductance Drain–to–Source Leakage Current Gate–to–Source Forward Leakage Gate–to–Source Reverse Leakage Total Gate Charge Gate–to–Source Charge Gate–to–Drain (“Miller”) Charge Turn–On Delay Time Rise ...

  • Page 3

    Dia Max .070 (1.78) Max Gate .100 (2.54) .420 (10.67) Max .110 (2.79) .500 (12.7) Max .250 (6.35) Max .500 (12.7) Min Source Drain/Tab ...