24LC16B/SN Microchip Technology Inc., 24LC16B/SN Datasheet - Page 4

• Manufacturer Part Number: 24LC16B/SN
• Description: 16K, 2K X 8 2.5V SERIAL EE
• Manufacturer: Microchip Technology Inc.

Specifications of 24LC16B/SN

• Capacitance, Input: 10 pF
• Capacitance, Output: 10 pF
• Current, Input, Leakage: ±1 μA
• Current, Operating: 0.01 mA (Read), 3 mA (Write)
• Current, Output, Leakage: ±1
• Data Retention: >200 yrs.
• Density: 16K
• Interface: 2-Wire
• Memory Type: Serial EEPROM
• Organization: 256×8
• Package Type: SOIC
• Temperature, Operating: -40 to +85 °C
• Time, Access: 900 ns
• Time, Fall: 300 ns
• Time, Rise: 300 ns
• Voltage, Esd: ≥4 kV
• Voltage, Input, High: 1.75 V
• Voltage, Input, Low: 0.75 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 2.5 to 5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

© 2007 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
A2
A1
E1
φ
L1
N
A
E
D
α
e
h
L
φ
c
b
β
1.25
0.10
0.25
0.40
0.17
0.31
MIN
h
L
L1
0°
5°
5°
–
24AA16/24LC16B
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-057B
α
β
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
c
DS21703G-page 15