C0603X104K5RACTU/BKN Kemet, C0603X104K5RACTU/BKN Datasheet
C0603X104K5RACTU/BKN
Specifications of C0603X104K5RACTU/BKN
Related parts for C0603X104K5RACTU/BKN
C0603X104K5RACTU/BKN Summary of contents
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... S The FT-CAP is a surface mount multi-layer ceramic capacitor that incorporates a unique and flexible termi- nation system. Integrated with KEMET's standard termination materials, a conductive epoxy is utilized between the conductive metallization and nickel barrier finish in order to establish pliability while maintain- ing terminal strength, solderability and electrical performance. This technology directs board flex stress away from the ceramic body and into the termination area result, this termination system mitigates the risk of low-IR or short-circuit failures associated with board flex. The FT-CAP complements our current " ...
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... K,M,J 2,700,000 275 K,M,J 3,300,000 335 K,M,J 3,900,000 395 K,M,J 4,700,000 475 K,M,J 5,600,000 565 K,M,J 6,800,000 685 K,M,J 8,200,000 825 K,M,J 10,000,000 106 K,M,J © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C0805 ...
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... Volts 3.5% 6.3/10 Volts 5.0% Soldering Process All parts incorporate the standard KEMET barrier layer of pure nickel, with an overplate of pure tin to pro- vide excellent solderability as well as resistance to leaching. The recommended techniques are as follows: • 1210 case size - Solder Reflow • 0603/0805/1206 case sizes – Solder Wave/Solder Reflow Marking These chips will be supplied unmarked ...