24C02C/SN Microchip Technology Inc., 24C02C/SN Datasheet - Page 6

• Manufacturer Part Number: 24C02C/SN
• Description: 2K, 256 X 8 SERIAL EE
• Manufacturer: Microchip Technology Inc.

Specifications of 24C02C/SN

• Capacitance, Input: 10 pF
• Capacitance, Output: 10 pF
• Current, Input, Leakage: ±1 μA
• Current, Operating: 1 mA (Read), 3 mA (Write)
• Current, Output, Leakage: ±1
• Data Retention: >200 yrs.
• Density: 2K
• Interface: 2-Wire
• Memory Type: Serial EEPROM
• Organization: 256×8
• Package Type: SOIC
• Time, Access: 900 ns
• Time, Fall: 300 ns
• Time, Rise: 1000 ns
• Voltage, Esd: ≥4 kV
• Voltage, Input, High: 3.15 V
• Voltage, Input, Low: 1.35 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 4.5 to 5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2008 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Note 1: “Y” indicates a Nickel, Palladium, Gold (NiPdAu) finish.
PART NO.
Device
Temperature
24C02C: 2K I
24C02CT: 2K I
I
E
P
SN
ST
MS
MC
MNY
Range
(1)
X
= -40°C to
= -40°C to +125°C
= Plastic DIP (300 mil Body), 8-lead
= Plastic SOIC, (3.90 mm Body), 8-lead
= TSSOP (4.4 mm Body), 8-lead
= Plastic Micro Small Outline (MSOP), 8-lead
= Plastic Dual Flat (DFN), No lead package,
= Plastic Dual Flat (TDFN), No lead package,
2x3 mm body, 8-lead
2x3 mm body, 8-lead
2
2
C™ Serial EEPROM
C™ Serial EEPROM (Tape and Reel)
Package
/XX
+85°C
Examples:
a)
b)
c)
24C02C-I/P:
PDIP Package
24C02C-E/SN: Extended Temperature,
SOIC Package
24C02C-I/MNY: Industrial Temperature,
2x3 TDFN Package
.
Industrial
24C02C
DS21202J-page 27
Temperature,