PRODUCT SUMMARY
V
(V)
DS
R
(Ω)
V
= 10 V
DS(on)
GS
Q
(Max.) (nC)
g
Q
(nC)
gs
Q
(nC)
gd
Configuration
HVMDIP
G
S
G
D
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
a
Pulsed Drain Current
Linear Derating Factor
b
Single Pulse Avalanche Energy
Maximum Power Dissipation
c
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
= 25 V, starting T
= 25 °C, L = 52 mH, R
DD
J
≤ 10 A, dI/dt ≤ 90 A/µs, V
≤ V
c. I
, T
SD
DD
DS
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91125
S09-1829-Rev. B, 21-Sep-09
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
60
• For Automatic Insertion
0.20
• End Stackable
11
• 175 °C Operating Temperature
3.1
• Fast Switching
5.8
Single
• Ease of Paralleling
• Simple Drive Requirements
• Compliant to RoHS Directive 2002/95/EC
D
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
The 4 pin DIP package is a low cost machine-insertable case
S
style which can be stacked in multiple combinations on
standard 0.1" pin centers. The dual drain serves as a thermal
N-Channel MOSFET
link to the mounting surface for power dissipation levels up to
1 W.
HVMDIP
IRFD014PbF
SiHFD014-E3
IRFD014
SiHFD014
= 25 °C, unless otherwise noted
C
T
= 25 °C
C
V
at 10 V
GS
T
= 100 °C
C
T
= 25 °C
C
for 10 s
= 25 Ω, I
= 1.7 A (see fig. 12).
g
AS
≤ 175 °C.
J
IRFD014, SiHFD014
Vishay Siliconix
device
design,
low
on-resistance
SYMBOL
LIMIT
V
60
DS
V
± 20
GS
1.7
I
D
1.2
I
14
DM
0.0083
E
130
AS
P
1.3
D
dV/dt
4.5
T
, T
- 55 to + 175
J
stg
d
300
www.vishay.com
Available
RoHS*
COMPLIANT
and
UNIT
V
A
W/°C
mJ
W
V/ns
°C
1