PIC16F684-I/ML Microchip Technology Inc., PIC16F684-I/ML Datasheet - Page 177

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PIC16F684-I/ML

Manufacturer Part Number
PIC16F684-I/ML
Description
MCU, 8-Bit, 2KW Flash, 128 RAM, 12 I/O, QFN-16
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC16F684-I/ML

A/d Inputs
8-Channel, 10-Bit
Comparators
2
Cpu Speed
5 MIPS
Eeprom Memory
256 Bytes
Input Output
12
Memory Type
Flash
Number Of Bits
8
Package Type
16-pin QFN
Programmable Memory
3.5K Bytes
Ram Size
128 Bytes
Speed
20 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device
© 2007 Microchip Technology Inc.
14-Lead Plastic Small Outline (SL or OD) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2
b
3
D
Dimension Limits
e
Units
A2
A1
E1
L1
E1
N
A
E
D
α
e
h
L
φ
c
b
β
A2
E
MIN
1.25
0.10
0.25
0.40
0.17
0.31
φ
L
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
8.65 BSC
1.04 REF
L1
NOM
14
Microchip Technology Drawing C04-065B
h
PIC16F684
MAX
β
1.75
0.25
0.50
1.27
0.51
0.25
15°
15°
DS41202F-page 175
α
c

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