TJA1051T,118 NXP Semiconductors, TJA1051T,118 Datasheet

IC CAN TXRX HI-SPEED 8-SOIC

TJA1051T,118

Manufacturer Part Number
TJA1051T,118
Description
IC CAN TXRX HI-SPEED 8-SOIC
Manufacturer
NXP Semiconductors
Type
Transceiverr
Datasheet

Specifications of TJA1051T,118

Package / Case
8-SOIC (3.9mm Width)
Number Of Drivers/receivers
1/1
Protocol
CAN
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Surface Mount
Product
Controller Area Network (CAN)
Number Of Transceivers
1
Data Rate
1 Mbps
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.8 V or 4.5 V
Supply Current (max)
0.5 mA or 70 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935285281118
1. General description
2. Features and benefits
2.1 General
2.2 Low-power management
The TJA1051 is a high-speed CAN transceiver that provides an interface between a
Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.
The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in the
automotive industry, providing differential transmit and receive capability to (a
microcontroller with) a CAN protocol controller.
The TJA1051 belongs to the third generation of high-speed CAN transceivers from NXP
Semiconductors, offering significant improvements over first- and second-generation
devices such as the TJA1050. It offers improved ElectroMagnetic Compatibility (EMC)
and ElectroStatic Discharge (ESD) performance, and also features:
These features make the TJA1051 an excellent choice for all types of HS-CAN networks,
in nodes that do not require a standby mode with wake-up capability via the bus.
TJA1051
High-speed CAN transceiver
Rev. 6 — 25 March 2011
Fully ISO 11898-2 compliant
Suitable for 12 V and 24 V systems
Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
V
microcontrollers (available in SO8 and very small HVSON8 packages respectively)
EN input on TJA1051T/E allows the microcontroller to switch the transceiver to a very
low-current Off mode
Available in SO8 and HVSON8 packages
Leadless HVSON8 package (3.0 mm × 3.0 mm) with improved Automated Optical
Inspection (AOI) capability
Dark green product (halogen free and Restriction of Hazardous Substances (RoHS)
compliant)
Functional behavior predictable under all supply conditions
Transceiver disengages from the bus when not powered up (zero load)
Ideal passive behavior to the CAN bus when the supply voltage is off
TJA1051T/3 and TJA1051TK/3 can be interfaced directly to microcontrollers with
supply voltages from 3 V to 5 V
IO
input on TJA1051T/3 and TJA1051TK/3 allows for direct interfacing with 3 V to 5 V
Product data sheet

Related parts for TJA1051T,118

TJA1051T,118 Summary of contents

Page 1

TJA1051 High-speed CAN transceiver Rev. 6 — 25 March 2011 1. General description The TJA1051 is a high-speed CAN transceiver that provides an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus. The transceiver ...

Page 2

... NXP Semiconductors 2.3 Protection High ElectroStatic Discharge (ESD) handling capability on the bus pins Bus pins protected against transients in automotive environments Transmit Data (TXD) dominant time-out function Undervoltage detection on pins V Thermally protected 3. Quick reference data Table 1. Symbol uvd(VCC ESD V CANH V CANL ...

Page 3

... NXP Semiconductors 5. Block diagram TXD (2) EN RXD ( transceiver without a V (2) Only present in the TJA1051T/E. Fig 1. TJA1051 Product data sheet V IO TEMPERATURE PROTECTION (1) V I/O 1 TIME-OUT 8 S MODE CONTROL 5 4 DRIVER pin, the V IO Block diagram All information provided in this document is subject to legal disclaimers. ...

Page 4

... NXP Semiconductors 6. Pinning information 6.1 Pinning a. TJA1051T: SO8 c. TJA1051T/3: SO8 Fig 2. 6.2 Pin description Table 3. Symbol TXD GND V CC RXD n. CANL CANH S TJA1051 Product data sheet 1 8 TXD S GND 2 7 CANH TJA1051T CANL CC RXD 4 5 n.c. 015aaa225 TXD GND CANH TJA1051T/3 ...

Page 5

... NXP Semiconductors 7. Functional description The TJA1051 is a high-speed CAN stand-alone transceiver with Silent mode. It combines the functionality of the TJA1050 transceiver with improved EMC and ESD handling capability. Improved slope control and high DC handling capability on the bus pins provides additional application flexibility. ...

Page 6

... NXP Semiconductors 7.1.3 Off mode A LOW level on pin EN of TJA1051T/E selects Off mode. In Off mode the entire transceiver is disabled, allowing the microcontroller to save power when CAN communication is not required. The bus pins are floating in Off mode, making the transceiver invisible to the rest of the network. ...

Page 7

... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter V voltage on pin transient voltage trt V electrostatic discharge voltage ESD T virtual junction temperature vj T storage temperature stg [1] Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a, 3a and 3b. IEC 61000-4-2 (150 pF, 330 Ω ...

Page 8

... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics − ° ° +150 4 5 defined with respect to ground; Positive currents flow into the IC Symbol Parameter Supply; pin supply voltage CC I supply current CC V undervoltage detection uvd(VCC) voltage on pin V CC I/O level adapter supply; pin V ...

Page 9

... NXP Semiconductors Table 7. Static characteristics − ° ° +150 4 5 defined with respect to ground; Positive currents flow into the IC Symbol Parameter V bus differential output voltage V O(dif)bus V recessive output voltage O(rec) V differential receiver threshold th(RX)dif voltage V differential receiver hysteresis hys(RX)dif voltage I dominant output current ...

Page 10

... NXP Semiconductors Table 8. Dynamic characteristics − ° ° +150 4 5 defined with respect to ground. Positive currents flow into the IC. Symbol Parameter t delay time from bus dominant to RXD d(busdom-RXD) t delay time from bus recessive to RXD Normal and Silent modes d(busrec-RXD) t propagation delay from TXD to RXD ...

Page 11

... NXP Semiconductors TXD CANH CANL V O(dif)(bus) RXD t d(TXD-busdom) Fig 4. 12. Application information Fig 5. TJA1051 Product data sheet 0. d(busdom-RXD) t PD(TXD-RXD) CAN transceiver timing diagram 5 V BAT CANH CANH TJA1051T/E CANL CANL Typical application of the TJA1051T/E All information provided in this document is subject to legal disclaimers. ...

Page 12

... NXP Semiconductors Fig 6. 13. Test information 13.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. TJA1051 Product data sheet BAT CANH CANH TJA1051T/3 TJA1051TK/3 CANL CANL Typical application of the TJA1051T/3 or TJA1051TK/3. ...

Page 13

... NXP Semiconductors 14. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

Page 14

... NXP Semiconductors HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 index area Dimensions (1) Unit max 1.00 0.05 0.35 mm nom 0.85 0.03 0.30 0.2 min 0.80 0.00 0.25 Note 1. Plastic or metal protrusions of 0.075 maximum per side are not included. ...

Page 15

... NXP Semiconductors 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “ ...

Page 16

... NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • ...

Page 17

... NXP Semiconductors Fig 9. For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Soldering of HVSON packages Section 16 Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON leadless package ICs can found in the following application notes: • ...

Page 18

... NXP Semiconductors 18. Revision history Table 11. Revision history Document ID Release date TJA1051 v.6 20110325 • Modifications Section • Table 5: parameter T TJA1051 v.5 20101229 TJA1051 v.4 20091020 TJA1051 v.3 20090825 TJA1051 v.2 20090701 TJA1051 v.1 20090309 TJA1051 Product data sheet Data sheet status Product data sheet 2 ...

Page 19

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 20

... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding ...

Page 21

... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Low-power management . . . . . . . . . . . . . . . . . 1 2.3 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5 7.1.1 Normal mode ...

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