ISP1105WTM ST-Ericsson Inc, ISP1105WTM Datasheet

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IMPORTANT NOTICE Dear customer from August 2 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless result, the following changes are applicable to the attached document. ● Company name - Philips ...

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General description The ISP1105/1106 range of Universal Serial Bus (USB) transceivers are compliant with the Universal Serial Bus Specification Rev. 2.0 . They can transmit and receive serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) data ...

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Philips Semiconductors 3. Applications 4. Ordering information Table 1: Ordering information Type number Package Name ISP1105BS HVQFN16 ISP1105W HBCC16 ISP1106DH TSSOP16 ISP1106W HBCC16 4.1 Ordering options Table 2: Selection guide Product Package ISP1105 HVQFN16 and HBCC16 supports both single-ended and ...

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Philips Semiconductors 5. Block diagram Fig 1. Block diagram (combined ISP1105 and ISP1106). 9397 750 11231 Product data 3 CC(I/O) SOFTCON OE SPEED (2) VMO/FSE0 (2) VPO/VO (3) MODE LEVEL SUSPND SHIFTER RCV ISP1105 ISP1106 VP VM (1) ...

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Philips Semiconductors 6. Pinning information 6.1 Pinning ISP1105BS RCV 2 GND (exposed diepad Bottom view Fig 2. Pin configuration ISP1105BS (HVQFN). V pu(3.3) 1 SOFTCON ...

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Philips Semiconductors 6.2 Pin description Table 3: Pin description [1] Symbol Pin ISP1105 ISP1106 RCV SUSPND MODE 6 6 ...

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Philips Semiconductors Table 3: Pin description …continued [1] Symbol Pin ISP1105 ISP1106 VPO/ VPO - - VMO/FSE0 VMO - - 14 FSE0 - - - V ...

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Philips Semiconductors 7. Functional description 7.1 Function selection Table 4: SUSPND [1] [2] [3] 7.2 Operating functions Table 5: FSE0 Table 6: VMO Table ...

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Philips Semiconductors 7.3 Power supply configurations The ISP1105/1106 can be used with different power supply configurations, which can be changed dynamically. An overview is given in Normal mode — Both V For 5 V operation, V voltage regulator then produces ...

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Philips Semiconductors Table 9: V CC(5.0) V reg(3.3) Connected Connected Not connected [1] 7.4 Power supply input options The ISP1105/1106 range has two power supply input options. Internal regulator — V used to supply the internal circuitry with 3.3 V ...

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Philips Semiconductors 8. Electrostatic discharge (ESD) 8.1 ESD protection The pins that are connected to the USB connector (D minimum ESD protection. The 12 kV measurement is limited by the test equipment. Capacitors of ...

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Philips Semiconductors 9. Limiting values Table 11: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC(5.0) V I/O supply voltage CC(I/O) V regulated supply voltage reg(3. input voltage ...

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Philips Semiconductors 11. Static characteristics Table 13: Static characteristics: supply pins V = 4 3 reg(3.3) combinations unless otherwise specified. amb Symbol Parameter ...

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Philips Semiconductors Table 14: Static characteristics: digital pins V = 1. CC(I/O) GND Symbol Parameter V = 1.65 to 3.6 V CC(I/O) Input levels V LOW-level input voltage IL V HIGH-level input ...

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Philips Semiconductors Table 15: Static characteristics: analog I/O pins ( 4 3 reg(3.3) Symbol Parameter Input levels Differential receiver V differential input sensitivity DI ...

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Philips Semiconductors 12. Dynamic characteristics Table 16: Dynamic characteristics: analog I/O pins ( 4 3 reg(3.3) combinations unless ...

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Philips Semiconductors Table 16: Dynamic characteristics: analog I/O pins ( 4 3 reg(3.3) combinations unless otherwise specified. amb ...

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Philips Semiconductors 13. Test information Fig 11. Load for enable and disable times. Fig 12. Load for VM, VP and RCV. Fig 13. Load for 9397 750 11231 Product data 33 D.U. ...

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Philips Semiconductors 14. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 0.65 mm terminal 1 index area 1 1 DIMENSIONS (mm are the original ...

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Philips Semiconductors HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the ...

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Philips Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...

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Philips Semiconductors 15. Packaging The ISP1105/1106W (HBCC16 package) is delivered on a type A carrier tape, see Figure The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking ...

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Philips Semiconductors 16. Soldering 16.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

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Philips Semiconductors • • During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive ...

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Philips Semiconductors [3] [4] [5] [6] [7] [8] [9] 9397 750 11231 Product data These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected ...

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Philips Semiconductors 17. Additional soldering information 17.1 (H)BCC packages: footprint The surface material of the terminals on the resin protrusion consists of a 4-layer metal structure (Au, Pd, Ni and Pd). The layer (0.1 m min.) ensures ...

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Philips Semiconductors 18. Revision history Table 19: Revision history Rev Date CPCN Description 08 20040219 - Product data (9397 750 11231); removed ISP1107 related information. Modifications: • • • • • • • • 07 20020329 - Product data (9397 ...

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Philips Semiconductors 19. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

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Philips Semiconductors Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . ...