TJA1041T/H/V,512 NXP Semiconductors, TJA1041T/H/V,512 Datasheet
TJA1041T/H/V,512
Specifications of TJA1041T/H/V,512
TJA1041T/H/V
TJA1041T/H/V
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TJA1041T/H/V,512 Summary of contents
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TJA1041 High speed CAN transceiver Rev. 06 — 5 December 2007 1. General description The TJA1041 provides an advanced interface between the protocol controller and the physical bus in a Controller Area Network (CAN) node. The TJA1041 is primarily intended ...
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... NXP Semiconductors 2.3 Protection and diagnosis (detection and signalling) I TXD dominant clamping handler with diagnosis I RXD recessive clamping handler with diagnosis I TXD-to-RXD short-circuit handler with diagnosis I Overtemperature protection with diagnosis I Undervoltage detection on pins V I Automotive environment transient protected bus pins and pin V ...
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... NXP Semiconductors 5. Block diagram 1 TXD STB V BAT 9 WAKE 8 ERR 4 RXD Fig 1. Block diagram TJA1041_6 Product data sheet V I/O 5 TIME-OUT LEVEL ADAPTOR WAKE COMPARATOR MODE CONTROL V + I/O FAILURE DETECTOR + WAKE-UP DETECTOR RXD RECESSIVE V DETECTION I/O 2 GND Rev. 06 — 5 December 2007 TJA1041 High speed CAN transceiver ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Pin configuration 6.2 Pin description Table 3. Symbol TXD GND V CC RXD V I/O EN INH ERR WAKE V BAT SPLIT CANL CANH STB TJA1041_6 Product data sheet TXD 1 GND TJA1041T RXD I INH 7 Pin description Pin Description ...
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... NXP Semiconductors 7. Functional description The primary function of a CAN transceiver is to provide the CAN physical layer as described in the ISO 11898 standard. In the TJA1041 this primary function is complemented with a number of operating modes, fail-safe features and diagnosis features, which offer enhanced system reliability and advanced power management functionality ...
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... NXP Semiconductors STB = H and LEGEND flag set flags cleared Fig 3. Mode transitions when V 7.1.1 Normal mode Normal mode is the mode for normal bidirectional CAN communication. The receiver will convert the differential analog bus signal on pins CANH and CANL into digital data, available for output to pin RXD ...
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... NXP Semiconductors 7.1.3 Standby mode The Standby mode is the first-level power saving mode of the transceiver, offering reduced current consumption. In Standby mode the transceiver is not able to transmit or receive data and the low-power receiver is activated to monitor bus activity. The bus pins are biased at ground level (via R by this pin INH will be active too. Pins RXD and ERR will refl ...
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... NXP Semiconductors Table 5. Internal flag wake-up source bus failure local failure [1] Pin ERR is an active-LOW output LOW level indicates a set flag and a HIGH level indicates a cleared flag. Allow pin ERR to stabilize for at least 8 s after changing operating modes. [2] Allow for a TXD dominant time of at least 4 s per dominant-recessive cycle. ...
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... NXP Semiconductors cleared. The wake-up flag is immediately available on pins ERR and RXD (provided that V and V I/O or the transceiver enters normal mode. 7.2.5 Wake-up source flag Wake-up source recognition is provided via the wake-up source flag, which is set when the wake-up flag is set by a local wake-up request via pin WAKE. The wake-up source flag can only be set after the pwon fl ...
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... NXP Semiconductors 7.3.3 TXD-to-RXD short-circuit detection A short-circuit between pins RXD and TXD would keep the bus in a permanent dominant state once the bus is driven dominant, because the low-side driver of RXD is typically stronger than the high-side driver of the controller connected to TXD. The TXD-to-RXD short-circuit detection prevents such a network lock-up by disabling the transmitter. The transmitter remains disabled until the local failure fl ...
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... NXP Semiconductors followed by an internal pull-down towards GND. To ensure EMI performance in applications not using local wake- recommended to connect pin WAKE to pin pin GND. 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V DC voltage on pin V ...
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... NXP Semiconductors 9. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-s) 10. Characteristics Table 8. Characteristics I/O otherwise; all voltages are defined with respect to ground; positive currents flow into the device. Symbol Parameter Supplies (pins and V BAT undervoltage detection CC(sleep) CC level for forced Sleep mode ...
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... NXP Semiconductors Table 8. Characteristics …continued I/O otherwise; all voltages are defined with respect to ground; positive currents flow into the device. Symbol Parameter I LOW-level input current IL C input capacitance i Receiver data output (pin RXD) I HIGH-level output current OH I LOW-level output current ...
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... NXP Semiconductors Table 8. Characteristics …continued I/O otherwise; all voltages are defined with respect to ground; positive currents flow into the device. Symbol Parameter V differential receiver threshold dif(th) voltage V differential receiver hysteresis hys(dif) voltage I input leakage current LI R common-mode input i(cm) ...
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... NXP Semiconductors Table 8. Characteristics …continued I/O otherwise; all voltages are defined with respect to ground; positive currents flow into the device. Symbol Parameter t dominant time for wake-up via BUS bus t minimum wake-up time after wake receiving a falling or rising edge Thermal shutdown ...
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... NXP Semiconductors Fig 5. Stabilization circuitry and application +5 V Fig 6. Test circuit for automotive transients TJA1041_6 Product data sheet 0.5V SPLIT CC in normal mode and pwon/listen-only mode; R otherwise floating GND 47 F 100 nF V I/O 5 TXD STB 14 WAKE TJA1041 9 500 kHz The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b and 7. Rev. 06 — ...
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... NXP Semiconductors Fig 7. Hysteresis of the receiver Fig 8. Test circuit for timing characteristics TJA1041_6 Product data sheet V RXD hysteresis 0 i(dif)(bus) CANH CANL + 100 nF TXD STB 14 WAKE 9 Rev. 06 — 5 December 2007 High speed CAN transceiver HIGH LOW 0.9 V (V) i(dif)(bus) mgs378 ...
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... NXP Semiconductors (1) V Fig 9. Timing diagram 12. Test information 12.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 - Stress test qualification for integrated circuits , and is suitable for use in automotive applications. TJA1041_6 Product data sheet ...
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... NXP Semiconductors 13. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.01 0.069 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 14. Bare die outline Fig 11. Bonding pad locations Table 9. Symbol TXD GND V CC RXD V I/O EN INH ERR WAKE V BAT SPLIT CANL CANH STB [1] All x/y coordinates represent the position of the center of each pad (in m) with respect to the left hand bottom corner of the top aluminium layer. ...
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... NXP Semiconductors 15. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 12. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . TJA1041_6 Product data sheet maximum peak temperature = MSL limit, damage level temperature minimum peak temperature ...
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... NXP Semiconductors 16. Revision history Table 12. Revision history Document ID Release date TJA1041_6 20071205 • Modifications: Table 1 TJA1041_5 20070831 TJA1041_4 20031014 TJA1041_3 20030213 TJA1041_N_2 20021223 TJA1041_1 20011218 TJA1041_6 Product data sheet Data sheet status Product data sheet and Table 6: changed conditions electrostatic discharge voltage Product data sheet Product specifi ...
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... Bare die — All die are tested on compliance with all related technical specifications as stated in this data sheet up to the point of wafer sawing for a period of ninety (90) days from the date of delivery by NXP Semiconductors. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 Optimized for in-vehicle high speed communication . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Low-power management . . . . . . . . . . . . . . . . . 1 2.3 Protection and diagnosis (detection and signalling Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description ...