24LC32AT-I/MC Microchip Technology Inc., 24LC32AT-I/MC Datasheet - Page 4

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24LC32AT-I/MC

Manufacturer Part Number
24LC32AT-I/MC
Description
32K, 4K X 8, 2.5V SER EE IND
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of 24LC32AT-I/MC

Capacitance, Input
10 pF
Capacitance, Output
10 pF
Current, Input, Leakage
±1 μA
Current, Operating
0.05 μA (Read), 0.1 mA (Write)
Current, Output, Leakage
±1
Data Retention
>200 yrs.
Density
32K
Interface
2-Wire
Memory Type
Serial EEPROM
Organization
4K×8
Package Type
DFN
Temperature, Operating
-40 to +85 °C
Time, Access
900 ns
Time, Fall
300 ns
Time, Rise
300 ns
Voltage, Esd
≥4 kV
Voltage, Input, High
1.75 V
Voltage, Input, Low
0.75 V
Voltage, Output, Low
0.4 V
Voltage, Supply
2.5 to 5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
24LC32AT-I/MC
Manufacturer:
MICROCHIP
Quantity:
12 000
© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
E
A
NOTE 2
EXPOSED PAD
Units
A1
A3
D2
E2
N
D
A
E
K
e
b
L
L
K
MIN
0.80
0.00
1.30
1.50
0.18
0.30
0.20
24AA32A/24LC32A
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
0.90
0.02
0.25
0.40
8
Microchip Technology Drawing C04-123B
D2
2
e
1
N
MAX
1.00
0.05
1.75
1.90
0.30
0.50
E2
NOTE 1
DS21713H-page 19

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