MC68HC711KS2MFN4 Freescale Semiconductor, MC68HC711KS2MFN4 Datasheet - Page 279

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MC68HC711KS2MFN4

Manufacturer Part Number
MC68HC711KS2MFN4
Description
32K EPROM - SLOW MODE
Manufacturer
Freescale Semiconductor
Datasheet

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Part Number
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Part Number:
MC68HC711KS2MFN4
Manufacturer:
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Quantity:
300
13.7 68-Pin Plastic Leaded Chip Carrier (Case 779)
M68HC11K Family
MOTOROLA
-L-
C
Z
K1
K
VIEW S
0.010
68
G
S
F
H
G1
T
A
R
L-M
0.007
0.007
1
-N-
S
N
M
M
S
T
T
L-M
L-M
S
VIEW S
V
0.007
S
0.007
Y
J
N
E
-M-
N
BRK
W
S
S
M
M
D
D
Mechanical Data
T
-T-
T
L-M
L-M
0.004
SEATING
PLANE
S
S
N
N
DIM
G1 0.910
K1 0.040
W
A
B
C
E
G
H
K
R
U
V
X
Y
F
J
Z
S
S
0.985
0.985
0.165
0.090
0.013
0.026
0.020
0.025
0.950
0.950
0.042
0.042
0.042
MIN
0.050 BSC
2
INCHES
---
0.995
0.995
0.180
0.019
0.032
0.956
0.956
0.048
0.048
0.056
0.020
0.930
0.110
MAX
68-Pin Plastic Leaded Chip Carrier (Case 779)
10
B
---
---
---
Z
U
0.007
X
VIEW D-D
NOTES:
1.
2.
3.
4.
5.
6.
7.
0.007
DATUMS L, M, AND N DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM T, SEATING PLANE.
DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 PER
SIDE.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012.
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC
BODY EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD FLASH,
BUT INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037. THE
DAMBAR INTRUSION(S) SHALL NOT CAUSE THE
H DIMENSION TO BE SMALLER THAN 0.025.
M
T
M
L-M
T
L-M
S
0.010
G1
N
S
S
N
S
S
T
Mechanical Data
L-M
Technical Data
S
N
S
279

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