BU2008-E3/51 General Semiconductor / Vishay, BU2008-E3/51 Datasheet
BU2008-E3/51
Manufacturer Part Number
BU2008-E3/51
Description
Bridge Rectifier, Single-Phase; 20A, 800V, BU 4-Pin Inline Pkg., RoHS
Manufacturer
General Semiconductor / Vishay
Datasheet
1.BU2010-E351.pdf
(4 pages)
Specifications of BU2008-E3/51
Capacitance, Junction
95 pF
Configuration
Single Phase
Current Squared Time Rating
239
Current, Forward
20 A
Current, Reverse
110 μA
Current, Surge
240 A
Package Type
BU
Primary Type
Bridge Rectifier
Resistance, Thermal, Junction To Case
2.4 °C/W
Speed, Switching
Standard
Temperature, Junction, Maximum
+150 °C
Temperature, Operating
-55 to +150 °C
Voltage, Forward
0.85 V
Voltage, Reverse
800 V
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
* Tested to UL standard for safety electrically isolated semiconductor
devices. UL 1557 4th edition.
Dielectric tested to maximum case, storage and junction
temperature to 150 °C to withstand 1500 V.
Epoxy meets UL 94V-0 flammability rating.
Notes:
(1) With 60 W air cooled heatsink
(2) Without heatsink, free air
PRIMARY CHARACTERISTICS
MAXIMUM RATINGS (T
PARAMETER
Maximum repetitive peak reverse voltage
Average rectified forward current (Fig. 1, 2)
Non-repetitive peak forward surge current
8.3 ms single sine-wave, T
Rating for fusing (t < 8.3 ms) T
Operating junction and storage temperature range
V
F
at I
T
V
I
J
I
F(AV)
FSM
RRM
I
F
max.
R
= 10 A
+
PowerBridge
~
+
Case Style BU
~
J
-
~
= 25 °C
J
= 25 °C
Enhanced Power Bridge Rectifiers
~
A
= 25 °C unless otherwise noted)
600 V, 800 V, 1000 V
TM
-
150 °C
0.85 V
240 A
20 A
5 µA
T
T
A
-
C
= 25 °C
= 61 °C
~
~
+
(2)
(1)
SYMBOL
T
J
V
I
, T
FSM
RRM
FEATURES
TYPICAL APPLICATIONS
General purpose use in ac-to-dc bridge full wave
rectification for switching power supply, home
appliances and white-goods applications.
MECHANICAL DATA
Case: BU
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD22-B102
E3 suffix for consumer grade, meets JESD 201 class
1A whisker test
Polarity: As marked on body
Mounting Torque: 10 cm-kg (8.8 inches-lbs) max.
Recommended Torque: 5.7 cm-kg (5 inches-lbs)
I
I
2
• UL recognition file number E309391
• Thin single in-line package
• Available for BU-5S lead forming option
• Superior thermal conductivity
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC
O
t
STG
(QQQX2) UL 1557 (see *)
(part number with “5S” suffix, e.g.
BU20065S)
and WEEE 2002/96/EC
BU2006
Vishay General Semiconductor
600
BU2006 thru BU2010
- 55 to + 150
BU2008
800
240
239
3.5
20
BU2010
1000
UNIT
A
°C
V
A
A
2
s
1
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BU2008-E3/51 Summary of contents
Page 1
... Polarity: As marked on body 0.85 V Mounting Torque: 10 cm-kg (8.8 inches-lbs) max. 150 °C Recommended Torque: 5.7 cm-kg (5 inches-lbs) SYMBOL BU2006 V RRM ( ° ( ° FSM STG BU2006 thru BU2010 BU2008 BU2010 600 800 1000 20 3.5 240 239 - 150 UNIT °C 1 ...
Page 2
... PREFERRED PACKAGE CODE 125 150 TYP. MAX. 0.95 1.05 0.85 0.95 - 5.0 110 350 95 - BU2008 BU2010 2.4 20 BASE QUANTITY DELIVERY MODE 20 Tube 250 Paper tray 20 Tube Without Heatsink Sine-Wave, R-Load Free Air 100 125 Ambient Temperature (°C) Figure 2. Forward Current Derating Curve ...
Page 3
BU2006 thru BU2010 Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) Case Type BU 0.125 (3.2) x 45° Chamfer 0.075 0.080 (2.03) (1.9) R 0.060 (1.52) + 0.050 (1.27) 0.040 (1.02) Polarity shown on front side of case, positive ...
Page 4
FORMING SPECIFICATION: BU-5S in inches (millimeters) 0.125 (3.2) x 45° Chamfer 0.075 (1. 0.080 (2.03) 0.060 (1.52) 0.050 (1.27) 0.040 (1.02) 0.213 (5.40) 0.173 (4.40) 0.417 (10.60) 0.370 (9.40) APPLICATION NOTE (1) Device UL approved for safety use ...