PIC32MX664F064LT-I/PT Microchip Technology Inc., PIC32MX664F064LT-I/PT Datasheet - Page 42

• Manufacturer Part Number: PIC32MX664F064LT-I/PT
• Description: 100 TQFP 12X12X1MM T/R, 100 PINS, 64KB FLASH, 32KB RAM, 80 MHZ, USB, ETHERNET, 4
• Manufacturer: Microchip Technology Inc.

Specifications of PIC32MX664F064LT-I/PT

• A/d Inputs: 16-Channel, 10-Bit
• Comparators: 2
• Eeprom Memory: 0 Bytes
• Input Output: 85
• Interface: I2C/SPI/UART/USB
• Memory Type: Flash
• Number Of Bits: 32
• Package Type: 100-pin TQFP
• Programmable Memory: 64K Bytes
• Ram Size: 32K Bytes
• Speed: 80 MHz
• Temperature Range: –40 to +85 °C
• Timers: 5-16-bit
• Voltage, Range: 2.3-3.6 V
• Lead Free Status / Rohs Status: RoHS Compliant part

PIC32MX5XX/6XX/7XX
FIGURE 2-1:
2.2.1
The use of a bulk capacitor is recommended to improve
power supply stability. Typical values range from 4.7 µF
to 47 µF. This capacitor should be located as close to
the device as possible.
2.3
2.3.1
A low-ESR (1 ohm) capacitor is required on the
V
voltage regulator output. The V
be connected to V
tor, with at least a 6V rating, connected to ground. The
type can be ceramic or tantalum. Refer to
“Electrical Characteristics”
on C
DS61156F-page 42
CAP
0.1 µF
Ceramic
C
V
BP
DD
EFC
R
/V
C
CORE
R1
Capacitor on Internal Voltage
Regulator (V
specifications.
BULK CAPACITORS
INTERNAL REGULATOR MODE
10 Ω
pin, which is used to stabilize the internal
MCLR
V
V
SS
DD
DD
, and must have a C
RECOMMENDED
MINIMUM CONNECTION
C
CAP
EFC
PIC32
0.1 µF
Ceramic
C
BP
for additional information
/V
CAP
CORE
/V
CORE
)
V
V
DD
Section 31.0
SS
0.1 µF
Ceramic
C
0.1 µF
Ceramic
C
pin must not
BP
EFC
BP
0.1 µF
Ceramic
C
BP
capaci-
2.4
The MCLR pin provides for two specific device
functions:
• Device Reset
• Device programming and debugging
Pulling The MCLR pin low generates a device Reset.
Figure 2-2
device programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR pin. Consequently, specific voltage
levels (V
not be adversely affected. Therefore, specific values
of R and C will need to be adjusted based on the
application and PCB requirements.
For example, as illustrated in
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components illustrated in
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
Note 1: R ≤ 10 kΩ is recommended. A suggested start-
2: R1 ≤ 470Ω will limit any current flowing into
3: The capacitor can be sized to prevent uninten-
Master Clear (MCLR) Pin
IH
illustrates a typical MCLR circuit. During
ing value is 10 kΩ. Ensure that the MCLR pin
V
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
V
tional Resets from brief glitches or to extend
the device Reset period during POR.
and V
V
IH
IH
DD
R
and V
and V
JP
C
IL
) and fast signal transitions must
IL
IL
specifications are met.
specifications are met.
EXAMPLE OF MCLR PIN
CONNECTIONS
R1
© 2010 Microchip Technology Inc.
MCLR
PIC32
Figure
Figure 2-2
2-2, it is
within