MADP-017015-13140P M/A-COM Technology, MADP-017015-13140P Datasheet

MADP-017015-13140P

Manufacturer Part Number

MADP-017015-13140P

Description

PIN Diodes 1-6000MHz .32pF -55C +125C

Manufacturer

M/A-COM Technology

Datasheet

1.MADP-017015-13140P.pdf (4 pages)

Specifications of MADP-017015-13140P

Configuration

Single

Reverse Voltage

- 115 V

Forward Continuous Current

500 mA

Termination Style

SMD/SMT

Package / Case

0603

Carrier Life

1.3 us

Forward Voltage Drop

0.74 V

Maximum Diode Capacitance

0.31 pF

Maximum Operating Temperature

+ 125 C

Maximum Series Resistance @ Maximum If

0.72 Ohms

Maximum Series Resistance @ Minimum If

0.51 Ohms

Minimum Operating Temperature

- 55 C

Lead Free Status / Rohs Status

Details

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SURMOUNT™ 15μM PIN Diodes

RoHS Compliant

Features

♦

This device is a silicon, glass PIN diode surmount chip

fabricated with M/A-COM Technology Solutions patented

HMIC

tals embedded in a low loss, low dispersion glass. The

diode is formed on the top of one pedestal and connec-

tions to the backside of the device are facilitated by mak-

ing the pedestal sidewalls electrically conductive. Selective

backside metallization is applied producing a surface

mount device. This vertical topology provides for excep-

tional heat transfer. The

with silicon nitride and has an additional polymer layer for

scratch and impact protection. These protective coatings

prevent damage to the junction and the anode air-bridge

during handling and assembly.

These packageless devices are suitable for usage in

moderate incident power, ≤ 50dBm/C.W. or where the

peak power is ≤ 75dBm, pulse width is ≤ 1μS, and duty

cycle is ≤ 0.01%. Their low parasitic inductance, 0.4 nH,

and excellent RC constant, make these devices a superior

choice for higher frequency switch elements when

compared to their plastic package counterparts

1) Exceeding these limits may cause in permanent damage

MADP-017015-1314

MADP-030015-1314

ADVANCED: Data Sheets contain information regarding a product MA-COM Technical

Solutions is considering for development. Performance is based on target specifications,

simulated results, and/or prototype measurements. Commitment to develop is not guaran-

teed.

PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical

Solutions has under development. Performance is based on engineering tests. Specifica-

tions are typical. Mechanical outline has been fixed. Engineering samples and/or test data

may be available. Commitment to produce in volume is not guaranteed.

Absolute Maximum Ratings

Forward Current

Reverse Voltage

Operating Temperature

Storage Temperature

Junction Temperature

C.W. Incident Power

Mounting Temperature

0603 Outline

Surface Mount

15µm I-Region Length Devices

No Wirebonds Required

Silicon Nitride Passivation

Polymer Scratch Protection

Low Parasitic Capacitance and Inductance

High Average and Peak Power Handling

process. This device features two silicon pedes-

Parameter

(unless otherwise specified)

Applications

Description

topside is fully encapsulated

+280°C for 30 seconds

Absolute Maximum

-55 °C to +150°C

-55°C to +125°C

500 mA

+175°C

- 115 V

50dBm

AMB

= +25°C

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s)

or information contained herein without notice.

Notes:

1) Backside metal: 0.1microns thick.

2) Yellow area with hatch lines indicate backside ohmic gold

3) Both devices have same outline dimensions ( A to G).

DIM

contacts.

0.060

0.031

0.004

0.019

0.029

Min

Case Style ODS 1314

Chip Dimensions

INCHES

0.062

0.032

0.008

0.021

0.031

Max

1.525

0.775

0.102

0.475

0.725

Min

Rev. V6

1.575

0.825

0.203

0.525

0.775

Max

Related parts for MADP-017015-13140P

MADP-017015-13140P Summary of contents

Page 1

... MADP-017015-1314 MADP-030015-1314 SURMOUNT™ 15μM PIN Diodes RoHS Compliant Features ♦ 0603 Outline ♦ Surface Mount ♦ 15µm I-Region Length Devices ♦ No Wirebonds Required ♦ Silicon Nitride Passivation ♦ Polymer Scratch Protection ♦ Low Parasitic Capacitance and Inductance ♦ High Average and Peak Power Handling ...

Page 2

... Solutions has under development. Performance is based on engineering tests. Specifica- tions are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. = 25°C (unless otherwise noted) A Conditions Units Min MADP-017015 1,3 - MHz pF 1,3 -40V, 1 GHz pF 1,3 - GHz ...

Page 3

... India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Rev vs. I MADP-017015 MADP-030015 0.01 Current (A) Ls vs. Freq. MADP-17015 MADP-30015 0.2 ...

Page 4

... Ordering Information Gel Pack MADP-017015-13140G MADP-030015-13140G • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice ...

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