TJA1041AT/N,112 NXP Semiconductors, TJA1041AT/N,112 Datasheet

IC TXRX CAN 14BIT 27V SOT108-1

TJA1041AT/N,112

Manufacturer Part Number
TJA1041AT/N,112
Description
IC TXRX CAN 14BIT 27V SOT108-1
Manufacturer
NXP Semiconductors
Type
Transceiverr
Datasheet

Specifications of TJA1041AT/N,112

Number Of Drivers/receivers
1/1
Protocol
CAN
Voltage - Supply
4.75 V ~ 5.25 V
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935277288112
TJA1041AT/N
TJA1041AT/N
1. General description
2. Features
2.1 Optimized for in-vehicle high-speed communication
2.2 Low-power management
2.3 Protection and diagnosis (detection and signalling)
The TJA1041A provides an advanced interface between the protocol controller and the
physical bus in a Controller Area Network (CAN) node. The TJA1041A is primarily
intended for automotive high-speed CAN applications (up to 1 Mbit/s). The transceiver
provides differential transmit capability to the bus and differential receive capability to the
CAN controller. The TJA1041A is fully compatible to the ISO 11898 standard, and offers
excellent ElectroMagnetic Compatibility (EMC) performance, very low power
consumption, and passive behavior when supply voltage is off. The advanced features
include:
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TJA1041A
High-speed CAN transceiver
Rev. 04 — 29 July 2008
Fully compatible with the ISO 11898 standard
Communication speed up to 1 Mbit/s
Very low ElectroMagnetic Emission (EME)
Differential receiver with wide common-mode range, offering high
ElectroMagnetic Immunity (EMI)
Passive behavior when supply voltage is off
Automatic I/O-level adaptation to the host controller supply voltage
Recessive bus DC voltage stabilization for further improvement of EME behavior
Listen-only mode for node diagnosis and failure containment
Allows implementation of large networks (more than 110 nodes)
Very low-current in Standby and Sleep mode, with local and remote wake-up
Capability to power down the entire node, still allowing local and remote wake-up
Wake-up source recognition
TXD dominant clamping handler with diagnosis
Low-power management, supporting local and remote wake-up with wake-up source
recognition and the capability to control the power supply in the rest of the node
Several protection and diagnosis functions including short circuits of the bus lines and
first battery connection
Automatic adaptation of the I/O-levels, in line with the supply voltage of the controller
Product data sheet

Related parts for TJA1041AT/N,112

TJA1041AT/N,112 Summary of contents

Page 1

TJA1041A High-speed CAN transceiver Rev. 04 — 29 July 2008 1. General description The TJA1041A provides an advanced interface between the protocol controller and the physical bus in a Controller Area Network (CAN) node. The TJA1041A is primarily intended for ...

Page 2

... NXP Semiconductors I RXD recessive clamping handler with diagnosis I TXD-to-RXD short circuit handler with diagnosis I Overtemperature protection with diagnosis I Undervoltage detection on pins V I Automotive environment transient protected bus pins and pin V I Short circuit proof bus pins and pin SPLIT (to battery and to ground) ...

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... NXP Semiconductors 4. Ordering information Table 2. Ordering information Type number Package Name Description TJA1041AT SO14 plastic small outline package; 14 leads; body width 3.9 mm TJA1041AU - bare die; 1920 5. Block diagram 1 TXD STB V BAT 9 WAKE 8 ERR 4 RXD Fig 1. Block diagram TJA1041A_4 Product data sheet ...

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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. 6.2 Pin description Table 3. Symbol TXD GND V CC RXD V I/O EN INH ERR WAKE V BAT SPLIT CANL CANH STB 7. Functional description The primary function of a CAN transceiver is to provide the CAN physical layer as described in the ISO 11898 standard. In the TJA1041A this primary function is ...

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... NXP Semiconductors 7.1 Operating modes The TJA1041A can be operated in five modes, each with specific features. Control pins STB and EN select the operating mode. Changing between modes also gives access to a number of diagnostics flags, available via pin ERR. The following sections describe the fi ...

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... NXP Semiconductors STB = H and LEGEND flag set flags cleared Fig 3. 7.1.1 Normal mode Normal mode is the mode for normal bidirectional CAN communication. The receiver will convert the differential analog bus signal on pins CANH and CANL into digital data, available for output to pin RXD. The transmitter will convert digital data on pin TXD into a differential analog signal, available for output to the bus pins ...

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... NXP Semiconductors 7.1.3 Standby mode The Standby mode is the first-level power saving mode of the transceiver, offering reduced current consumption. In Standby mode the transceiver is not able to transmit or receive data and the low-power receiver is activated to monitor bus activity. The bus pins are biased at ground level (via R by this pin INH will be active too. Pins RXD and ERR will refl ...

Page 8

... NXP Semiconductors Table 5. Internal flag wake-up source bus failure local failure [1] Pin ERR is an active-LOW output LOW-level indicates a set flag and a HIGH-level indicates a cleared flag. Allow pin ERR to stabilize for at least 8 s after changing operating modes. [2] Allow for a TXD dominant time of at least 4 s per dominant-recessive cycle. ...

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... NXP Semiconductors immediately available on pins ERR and RXD (provided that V The flag is cleared at power-on, or when the UV Normal mode. 7.2.5 Wake-up source flag Wake-up source recognition is provided via the wake-up source flag, which is set when the wake-up flag is set by a local wake-up request via pin WAKE. The wake-up source flag can only be set after the pwon fl ...

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... NXP Semiconductors 7.3.3 TXD-to-RXD short-circuit detection A short circuit between pins RXD and TXD would keep the bus in a permanent dominant state once the bus is driven dominant, because the low-side driver of RXD is typically stronger than the high-side driver of the controller connected to TXD. The TXD-to-RXD short circuit detection prevents such a network lockup by disabling the transmitter. The transmitter remains disabled until the local failure fl ...

Page 11

... NXP Semiconductors followed by an internal pull-down towards GND. To ensure EMI performance in applications not using local wake- recommended to connect pin WAKE to pin pin GND. 8. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter I/O V BAT V TXD ...

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... NXP Semiconductors 9. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-s) 10. Characteristics Table 8. Characteristics I/O specified; all voltages are defined with respect to ground; positive currents flow into the device Symbol Parameter Supplies (pins and V BAT undervoltage detection CC(sleep) CC level for forced Sleep mode ...

Page 13

... NXP Semiconductors Table 8. Characteristics …continued I/O specified; all voltages are defined with respect to ground; positive currents flow into the device Symbol Parameter Receiver data output (pin RXD) I HIGH-level output current OH I LOW-level output current OL Standby and enable control inputs (pins STB and EN) ...

Page 14

... NXP Semiconductors Table 8. Characteristics …continued I/O specified; all voltages are defined with respect to ground; positive currents flow into the device Symbol Parameter V differential receiver dif(th) threshold voltage V differential receiver hys(dif) hysteresis voltage I input leakage current LI R common-mode input ...

Page 15

... NXP Semiconductors Table 8. Characteristics …continued I/O specified; all voltages are defined with respect to ground; positive currents flow into the device Symbol Parameter t dominant time for wake-up BUSdom via bus t recessive time for wake-up BUSrec via bus t minimum wake-up time ...

Page 16

... NXP Semiconductors Fig 5. 12. Test information 5 V (1) The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, Fig 6. TJA1041A_4 Product data sheet V CC TJA1041A 0.5V SPLIT CC in normal mode and pwon/listen-only mode; R otherwise floating GND Stabilization circuitry and application ...

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... NXP Semiconductors Fig 7. Fig 8. TJA1041A_4 Product data sheet V RXD hysteresis 0.5 Hysteresis of the receiver 100 nF 5 TXD STB 14 WAKE 9 Test circuit for timing characteristics Rev. 04 — 29 July 2008 TJA1041A High-speed CAN transceiver HIGH LOW 0.9 V (V) i(dif)(bus) mgs378 I/O CC BAT ...

Page 18

... NXP Semiconductors (1) V Fig 9. 12.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 - Stress test qualification for integrated circuits , and is suitable for use in automotive applications. TJA1041A_4 Product data sheet TXD CANH ...

Page 19

... NXP Semiconductors 13. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

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... NXP Semiconductors 14. Bare die outline (1) The reverse side of the bare die must be connected to ground. Fig 11. Bonding pad locations Table 9. Symbol TXD GND V CC RXD V I/O EN INH ERR WAKE V BAT SPLIT CANL CANH STB [1] All x/y coordinates represent the position of the center of each pad (in m) with respect to the left hand bottom corner of the top aluminium layer ...

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... NXP Semiconductors 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...

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... NXP Semiconductors 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...

Page 23

... NXP Semiconductors Fig 12. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 16. Revision history Table 12. Revision history Document ID Release date TJA1041A_4 20080729 • Modifications: Table ...

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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 Optimized for in-vehicle high-speed communication . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Low-power management . . . . . . . . . . . . . . . . . 1 2.3 Protection and diagnosis (detection and signalling Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 4 7 ...

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