ISL83085EIU Intersil, ISL83085EIU Datasheet - Page 17

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ISL83085EIU

Manufacturer Part Number
ISL83085EIU
Description
IC TXRX RS485/422 5V ESD 8-MSOP
Manufacturer
Intersil
Type
Transceiverr
Datasheet

Specifications of ISL83085EIU

Number Of Drivers/receivers
1/1
Protocol
RS422, RS485
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Mini Small Outline Plastic Packages (MSOP)
NOTES:
A
10. Datums
11. Controlling dimension: MILLIMETER. Converted inch dimen-
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E1” does not include interlead flash or protrusions
5. Formed leads shall be planar with respect to one another within
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
A1
INDEX
AREA
JEDEC MO-187BA.
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
and are measured at Datum Plane.
protrusions shall not exceed 0.15mm (0.006 inch) per side.
0.10mm (.004) at seating Plane.
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
sions are for reference only
A2
- H -
ISL83080E, ISL83082E, ISL83083E, ISL83084E, ISL83085E, ISL83086E, ISL83088E
-H-
.
SIDE VIEW
TOP VIEW
-A -
N
1 2
e
D
b
and
- B -
E1
SEATING
-A-
PLANE
0.10 (0.004)
0.20 (0.008)
GAUGE
PLANE
-B-
0.20 (0.008)
to be determined at Datum plane
17
E
0.20 (0.008)
-C-
(0.010)
0.25
C
C
- H -
a
A B C
SEATING
PLANE
C D
Interlead flash and
4X θ
END VIEW
4X θ
E
L1
C L
1
C
L
R1
-B-
R
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A2
E1
R1
L1
D
N
R
α
A
b
e
E
L
c
θ
0.037
0.002
0.030
0.007
0.004
0.116
0.116
0.187
0.016
0.003
0.003
MIN
5
0
0.020 BSC
0.037 REF
o
o
INCHES
10
MAX
0.043
0.006
0.037
0.011
0.008
0.120
0.120
0.199
0.028
15
6
-
-
o
o
0.94
0.05
0.75
0.18
0.09
2.95
2.95
4.75
0.40
0.07
0.07
MILLIMETERS
MIN
5
0
o
o
0.50 BSC
0.95 REF
10
MAX
1.10
0.15
0.95
0.27
0.20
3.05
3.05
5.05
0.70
15
6
-
-
o
o
Rev. 0 12/02
April 22, 2008
NOTES
FN6085.9
9
3
4
6
7
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