M29W320DT90N6 Micron Technology Inc, M29W320DT90N6 Datasheet

no-image

M29W320DT90N6

Manufacturer Part Number
M29W320DT90N6
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of M29W320DT90N6

Cell Type
NOR
Density
32Mb
Access Time (max)
90ns
Interface Type
Parallel
Boot Type
Top
Address Bus
22/21Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
2.7 to 3.6/12V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
4M/2M
Supply Current
10mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M29W320DT90N6
Manufacturer:
ST
0
Part Number:
M29W320DT90N6E
Manufacturer:
ST
0
Feature summary
February 2010
Supply Voltage
– V
– V
Access time: 70, 80, and 90 ns
Programming time
– 10µs per Byte/Word typical
67 memory blocks
– 1 Boot Block (Top or Bottom Location)
– 2 Parameter and 64 Main Blocks
Program/Erase controller
– Embedded Byte/Word Program algorithms
Erase Suspend and Resume modes
– Read and Program another Block during
Unlock Bypass Program command
– Faster Production/Batch Programming
V
Temporary Block Unprotection mode
Common Flash Interface
– 64 bit Security code
Low power consumption
– Standby and Automatic Standby
100,000 Program/Erase cycles per block
Electronic Signature
– Manufacturer Code: 0020h
– Top Device Code M29W320DT: 22CAh
– Bottom Device Code M29W320DB: 22CBh
RoHS packages available
Automotive Grade Parts Available
PP
Read
Erase Suspend
/WP pin for Fast Program and Write Protect
CC
PP
= 2.7V to 3.6V for Program, Erase and
=12V for Fast Program (optional)
32 Mbit (4Mbx8 or 2Mbx16, Non-uniform Parameter Blocks,
Boot Block), 3V Supply Flash memory
Rev 12
TFBGA48 (ZE)
TSOP48 (N)
12 x 20mm
FBGA
M29W320DB
M29W320DT
www.numonyx.com
1/56
1

Related parts for M29W320DT90N6

M29W320DT90N6 Summary of contents

Page 1

... Program/Erase cycles per block Electronic Signature – Manufacturer Code: 0020h – Top Device Code M29W320DT: 22CAh – Bottom Device Code M29W320DB: 22CBh RoHS packages available Automotive Grade Parts Available February 2010 Boot Block), 3V Supply Flash memory TSOP48 ( 20mm TFBGA48 (ZE) Rev 12 M29W320DT M29W320DB FBGA 1/56 www ...

Page 2

Contents 1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 3

... Error Bit (DQ5 5.4 Erase Timer Bit (DQ3 5.5 Alternative Toggle Bit (DQ2 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 8 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Appendix A Block Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Appendix B Common Flash Interface (CFI Appendix C Block Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 C.1 Programmer Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 C.2 In-System Technique Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 3/56 ...

Page 4

List of tables Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 5

List of figures Figure 1. Logic Diagram ...

Page 6

Summary description The M29W320D Mbit (4Mb x8 or 2Mb x16) non-volatile memory that can be read, erased and reprogrammed. These operations can be performed using a single low voltage (2.7 to 3.6V) supply. On power-up the ...

Page 7

Figure 1. Logic Diagram A0-A20 BYTE Table 1. Signal Names A0-A20 Address Inputs DQ0-DQ7 Data Inputs/Outputs DQ8-DQ14 Data Inputs/Outputs DQ15A–1 Data Input/Output or Address Input E Chip Enable G Output Enable W Write Enable RP Reset/Block ...

Page 8

Figure 2. TSOP Connections 8/56 A15 1 48 A14 A13 A12 A11 A10 A9 A8 A19 A20 M29W320DT M29W320DB /WP RB A18 A17 ...

Page 9

Figure 3. TFBGA48 Connections (Top view through package A17 A2 A6 A18 A20 ...

Page 10

Figure 4. Block Addresses (x8) M29W320DT Top Boot Block Addresses (x8) 3FFFFFh 16 KByte 3FC000h 3FBFFFh 8 KByte 3FA000h 3F9FFFh 8 KByte 3F8000h 3F7FFFh 32 KByte 3F0000h 3EFFFFh 64 KByte 3E0000h 01FFFFh 64 KByte 010000h 00FFFFh 64 KByte 000000h 1. ...

Page 11

Figure 5. Block Addresses (x16) M29W320DT Top Boot Block Addresses (x16) 1FFFFFh 8 KWord 1FE000h 1FDFFFh 4 KWord 1FD000h 1FCFFFh 4 KWord 1FC000h 1FBFFFh 16 KWord 1F8000h 1F7FFFh 32 KWord 1F0000h 00FFFFh 32 KWord 008000h 007FFFh 32 KWord 000000h 1. ...

Page 12

Signal descriptions See Figure 1: Logic connected to this device. 2.1 Address Inputs (A0-A20) The Address Inputs select the cells in the memory array to access during Bus Read operations. During Bus Write operations they control the commands sent ...

Page 13

Write Enable (W) The Write Enable, W, controls the Bus Write operation of the memory’s Command Interface. 2.8 V Write Protect (V PP/ The V /Write Protect pin provides two functions. The V PP use an external high voltage ...

Page 14

Ready/Busy Output (RB) The Ready/Busy pin is an open-drain output that can be used to identify when the device is performing a Program or Erase operation. During Program or Erase operations Ready/Busy is Low Ready/Busy is high-impedance ...

Page 15

Bus operations There are five standard bus operations that control the device. These are Bus Read, Bus Write, Output Disable, Standby and Automatic Standby. See operations, for a summary. Typically glitches of less than 5ns on Chip Enable or ...

Page 16

Special bus operations Additional bus operations can be performed to read the Electronic Signature and also to apply and remove Block Protection. These bus operations are intended for use by programming equipment and are not usually used in applications. ...

Page 17

Command Interface All Bus Write operations to the memory are interpreted by the Command Interface. Commands consist of one or more sequential Bus Write operations. Failure to observe a valid sequence of Bus Write operations will result in the ...

Page 18

... Read CFI Query command The Read CFI Query Command is used to read data from the Common Flash Interface (CFI) Memory Area. This command is valid when the device is in the Read Array mode, or when the device is in Autoselected mode. One Bus Write cycle is required to issue the Read CFI Query Command. Once the command is issued subsequent Bus Read operations read from the Common Flash Interface Memory Area ...

Page 19

The memory uses the higher voltage on the V Protect pin, to accelerate the Unlock Bypass Program operation. Never raise V /Write Protect memory may be left in an indeterminate state. 4.6 Unlock Bypass ...

Page 20

Block Erase command The Block Erase command can be used to erase a list of one or more blocks. Six Bus Write operations are required to select the first block in the list. Each additional block in the list ...

Page 21

Erase Resume command The Erase Resume command must be used to restart the Program/Erase Controller after an Erase Suspend. The device must be in Read Array mode before the Resume command will be accepted. An erase can be suspended ...

Page 22

Table 4. Commands, 16-bit mode, BYTE = V Command Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data 1 X (3) Read/Reset 3 555 (4) Auto Select 3 555 (5) Program 4 555 (6) Unlock Bypass 3 ...

Page 23

Table 5. Commands, 8-bit mode, BYTE = V Command Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data 1 X (3) Read/Reset 3 AAA (4) Auto Select 3 AAA (5) Program 4 AAA (6) Unlock Bypass 3 ...

Page 24

Table 6. Program, Erase Times and Program, Erase Endurance Cycles Parameter Chip Erase Block Erase (64 KBytes) Erase Suspend Latency Time Program (Byte or Word) Accelerated Program (Byte or Word) Chip Program (Byte by Byte) Chip Program (Word by Word) ...

Page 25

Status Register Bus Read operations from any address always read the Status Register during Program and Erase operations also read during Erase Suspend when an address within a block being erased is accessed. The bits in the ...

Page 26

Error Bit (DQ5) The Error Bit can be used to identify errors detected by the Program/Erase Controller. The Error Bit is set to ’1’ when a Program, Block Erase or Chip Erase operation fails to write the correct data ...

Page 27

Table 7. Status Register Bits Operation Address Program Any Address Program During Erase Any Address Suspend Program Error Any Address Chip Erase Any Address Erasing Block Block Erase before timeout Non-Erasing Block Erasing Block Block Erase Non-Erasing Block Erasing Block ...

Page 28

Figure 7. Data Toggle Flowchart 28/56 START READ DQ6 READ DQ5 & DQ6 DQ6 NO = TOGGLE YES NO DQ5 = 1 YES READ DQ6 TWICE DQ6 NO = TOGGLE YES FAIL PASS AI01370C ...

Page 29

Maximum rating Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. These are stress ratings ...

Page 30

DC and AC parameters This section summarizes the operating measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC characteristics Tables that follow, are derived from tests performed under the Measurement ...

Page 31

Figure 1. AC Measurement Load Circuit V PP 0.1µ includes JIG capacitance Table 10. Device Capacitance Symbol Parameter C Input Capacitance IN C Output Capacitance OUT 1. Sampled only, not 100% tested DEVICE UNDER ...

Page 32

Table 11. DC Characteristics Symbol Parameter I Input Leakage Current LI I Output Leakage Current LO I Supply Current (Read) CC1 I Supply Current (Standby) CC2 Supply Current (1) I CC3 (Program/Erase) V Input Low Voltage IL V Input High ...

Page 33

Figure 9. Read Mode AC Waveforms A0-A20/ A– DQ0-DQ7/ DQ8-DQ15 BYTE tELBL/tELBH Table 12. Read AC Characteristics Symbol Alt t t Address Valid to Next Address Valid AVAV Address Valid to Output Valid AVQV ACC ...

Page 34

Figure 10. Write AC Waveforms, Write Enable Controlled A0-A20/ A–1 E tELWL G tGHWL W DQ0-DQ7/ DQ8-DQ15 V CC tVCHEL RB Table 13. Write AC Characteristics, Write Enable Controlled Symbol Alt t t Address Valid to Next Address Valid AVAV ...

Page 35

Figure 11. Write AC Waveforms, Chip Enable Controlled A0-A20/ A–1 W tWLEL G tGHEL E DQ0-DQ7/ DQ8-DQ15 V CC tVCHWL RB Table 14. Write AC Characteristics, Chip Enable Controlled Symbol Alt t t Address Valid to Next Address Valid AVAV ...

Page 36

Figure 12. Reset/Block Temporary Unprotect AC Waveforms tPLPX RP Table 15. Reset/Block Temporary Unprotect AC Characteristics Symbol Alt (1) t PHWL RP High to Write Enable Low, Chip Enable Low PHEL RH Output Enable ...

Page 37

Package mechanical Figure 14. TSOP48 Lead Plastic Thin Small Outline, 12x20 Mm, Top View Package Outline DIE 1. Drawing not to scale. Table 16. TSOP48 Lead Plastic Thin Small Outline, 12x20 mm, Package Mechanical Data millimeters ...

Page 38

Figure 15. TFBGA48 6x8mm - 6x8 Ball Array, 0.8mm Pitch, Bottom View Package Outline FE BALL "A1" Drawing not to scale. Table 17. TFBGA48 6x8mm - 6x8 Ball Array, 0.8mm Pitch, Package Mechanical Data millimeters Symbol Typ ...

Page 39

Part numbering Table 18. Ordering Information Scheme Example: Device Type M29 Operating Voltage 2.7 to 3.6V CC Device Function 320D = 32 Mbit (x8/x16), Non-Uniform Parameter Blocks, Boot Block Array Matrix T = Top Boot ...

Page 40

Appendix A Block Addresses Table 19. Top Boot Block Addresses, M29W320DT Size # (KByte/KWor d) 66 16/8 65 8/4 64 8/4 63 32/16 62 64/32 61 64/32 60 64/32 59 64/32 58 64/32 57 64/32 56 64/32 55 64/32 54 ...

Page 41

Table 19. Top Boot Block Addresses, M29W320DT (continued) 35 64/32 34 64/32 33 64/32 32 64/32 31 64/32 30 64/32 29 64/32 28 64/32 27 64/32 26 64/32 25 64/32 24 64/32 23 64/32 22 64/32 21 64/32 20 64/32 ...

Page 42

Table 20. Bottom Boot Block Addresses, M29W320DB Size # (KByte/KWord) 66 64/32 65 64/32 64 64/32 63 64/32 62 64/32 61 64/32 60 64/32 59 64/32 58 64/32 57 64/32 56 64/32 55 64/32 54 64/32 53 64/32 52 64/32 ...

Page 43

Table 20. Bottom Boot Block Addresses, M29W320DB (continued) 32 64/32 31 64/32 30 64/32 29 64/32 28 64/32 27 64/32 26 64/32 25 64/32 24 64/32 23 64/32 22 64/32 21 64/32 20 64/32 19 64/32 18 64/32 17 64/32 ...

Page 44

... Common Flash Interface (CFI) The Common Flash Interface is a JEDEC approved, standardized data structure that can be read from the Flash memory device. It allows a system software to query the device to determine various electrical and timing parameters, density information and functions supported by the memory. The system can interface easily with the device, enabling the software to upgrade itself when necessary ...

Page 45

... Maximum timeout for chip erase = 2 Description n Device Size = 2 in number of bytes Flash Device Interface Code description Maximum number of bytes in multi-byte program or page = 2 Number of Erase Block Regions within the device. It specifies the number of regions within the device containing contiguous Erase Blocks of the same size. ...

Page 46

Table 24. Device Geometry Definition (continued) Address Data x16 x8 31h 62h 0001h 32h 64h 0000h 33h 66h 0020h 34h 68h 0000h 35h 6Ah 0000h 36h 6Ch 0000h 37h 6Eh 0080h 38h 70h 0000h 39h 72h 003Eh 3Ah 74h 0000h ...

Page 47

Table 25. Primary Algorithm-Specific Extended Query Table (continued) Address Data x16 x8 4Dh 9Ah 00B5h 4Eh 9Ch 00C5h 4Fh 9Eh 000xh Table 26. Security Code Area Address Data x16 x8 61h C3h, C2h XXXX 62h C5h, C4h XXXX 63h C7h, ...

Page 48

... Block Protection Block protection can be used to prevent any operation from modifying the data stored in the Flash. Each Block can be protected individually. Once protected, Program and Erase operations on the block fail to change the data. There are three techniques that can be used to control Block Protection, these are the Programmer technique, the In-System technique and Temporary Unprotection. Temporary Unprotection is controlled by the Reset/Block Temporary Unprotection pin, RP ...

Page 49

Table 27. Programmer Technique Bus Operations, BYTE = V Operation E G Block Protect Chip Unprotect Block Protection Verify Block Unprotection Verify Address Inputs ...

Page 50

Figure 16. Programmer Equipment Block Protect Flowchart 50/56 START ADDRESS = BLOCK ADDRESS Wait 4µ Wait 100µ ...

Page 51

Figure 17. Programmer Equipment Chip Unprotect Flowchart NO ++n = 1000 FAIL START PROTECT ALL BLOCKS CURRENT BLOCK = 0 A6, A12, A15 = V IH (1) E, ...

Page 52

Figure 18. In-System Equipment Block Protect Flowchart 52/56 START WRITE 60h ADDRESS = BLOCK ADDRESS WRITE 60h ADDRESS = ...

Page 53

Figure 19. In-System Equipment Chip Unprotect Flowchart ++ 1000 ISSUE READ/RESET COMMAND FAIL START PROTECT ALL BLOCKS CURRENT BLOCK = WRITE 60h ANY ADDRESS WITH A0 ...

Page 54

Revision history Table 28. Document revision history Date Revision March-2001 08-Jun-2001 22-Jun-2001 27-Jul-2001 05-Oct-2001 07-Feb-2002 05-Apr-2002 19-Nov-2002 26-May-2003 16-Aug-2005 54/56 -01 First Issue (Brief Data) -02 Document expanded to full Product Preview Minor text corrections to Read/Reset and Read ...

Page 55

Table 28. Document revision history (continued) Date Revision Document title modified. TFBGA63 package removed. ECOPACK text added. RB signal updated in 13-Jun-2006 9 AC Unprotect AC In Program during Erase Suspend and Program Error. 26-Mar-2008 10 Applied Numonyx branding. Added ...

Page 56

... Copies of documents which have an order number and are referenced in this document, or other Numonyx literature may be obtained by visiting Numonyx's website at http://www.numonyx.com. Numonyx StrataFlash is a trademark or registered trademark of Numonyx or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. ...

Related keywords