PCA9673PW,112 NXP Semiconductors, PCA9673PW,112 Datasheet

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PCA9673PW,112

Manufacturer Part Number
PCA9673PW,112
Description
IC I/O EXPANDER I2C 16B 24TSSOP
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCA9673PW,112

Interface
I²C
Number Of I /o
16
Interrupt Output
Yes
Frequency - Clock
1MHz
Voltage - Supply
2.3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-TSSOP
Includes
POR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4200-5
935283558112
PCA9673PW
1. General description
2. Features
The PCA9673 provides general purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I
family.
The PCA9673 is a drop in upgrade for the PCF8575 providing higher Fast-mode Plus
(Fm+) I
dimming of LEDs, higher I
can be on the bus without the need for bus buffers, higher total package sink capacity
(400 mA versus 100 mA) that supports having all 25 mA LEDs on at the same time and
more device addresses (16 versus 8) are available to allow many more devices on the bus
without address conflicts.
The difference between the PCA9673 and the PCF8575 is that the A2 address pin is
replaced by a RESET input on the PCA9673.
The device consists of a 16-bit quasi-bidirectional port and an I
PCA9673 has a low current consumption and includes latched outputs with 25 mA high
current drive capability for directly driving LEDs.
It also possesses an interrupt line (INT) which can be connected to the interrupt logic of
the microcontroller. By sending an interrupt signal on this line, the remote I/O can inform
the microcontroller if there is incoming data on its ports without having to communicate via
the I
The internal Power-On Reset (POR), hardware reset pin (RESET) or software reset
sequence initializes the I/Os as inputs.
I
I
I
I
I
I
I
I
I
I
PCA9673
Remote 16-bit I/O expander for Fm+ I
reset
Rev. 01 — 1 February 2007
1 MHz I
Compliant with the I
SDA with 30 mA sink capability for 4000 pF buses
2.3 V to 5.5 V operation with 5.5 V tolerant I/Os
16-bit remote I/O pins that default to inputs at power-up
Latched outputs with 25 mA sink capability for directly driving LEDs
Total package sink capability of 400 mA
Active LOW open-drain interrupt output
16 programmable slave addresses using 2 address pins
Readable device ID (manufacturer, device type, and revision)
2
C-bus.
2
C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWM
2
C-bus interface
2
C-bus Fast and Standard modes
2
C-bus drive (30 mA versus 3 mA) so that many more devices
2
C-bus) and is a part of the Fast-mode Plus
2
C-bus with interrupt and
2
C-bus interface. The
Product data sheet

Related parts for PCA9673PW,112

PCA9673PW,112 Summary of contents

Page 1

PCA9673 Remote 16-bit I/O expander for Fm+ I reset Rev. 01 — 1 February 2007 1. General description The PCA9673 provides general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional bus (I family. The PCA9673 is ...

Page 2

... NXP Semiconductors I Low standby current +85 C operation I ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA I Packages offered: SO24, SSOP24, QSOP24, TSSOP24, HVQFN24, DHVQFN24 3 ...

Page 3

... NXP Semiconductors 5. Block diagram INT AD0 AD1 SCL SDA RESET Fig 1. Block diagram of PCA9673 data from Shift Register data to Shift Register Fig 2. Simplified schematic diagram of P00 to P17 PCA9673_1 Product data sheet Remote 16-bit I/O expander for Fm+ I PCA9673 INTERRUPT LOGIC ...

Page 4

... NXP Semiconductors 6. Pinning information 6.1 Pinning RESET Fig 3. Pin configuration for SO24 RESET Fig 5. Pin configuration for SSOP24 PCA9673_1 Product data sheet Remote 16-bit I/O expander for Fm INT V DD AD1 2 23 SDA 3 22 SCL 4 21 P00 AD0 5 20 P01 ...

Page 5

... NXP Semiconductors terminal 1 index area Fig 7. Pin configuration for HVQFN24 6.2 Pin description Table 2. Symbol INT AD1 RESET P00 P01 P02 P03 P04 P05 P06 P07 V SS P10 P11 P12 P13 P14 P15 P16 P17 AD0 PCA9673_1 Product data sheet ...

Page 6

... NXP Semiconductors Table 2. Symbol SCL SDA V DD [1] HVQFN and DHVQFN package die supply ground is connected to both the V pad. The V electrical, and board-level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias need to be incorporated in the PCB in the thermal pad region ...

Page 7

... NXP Semiconductors 7.1.1 Address maps Table 3. AD1 SCL SCL SDA SDA SCL SCL SDA SDA 7.2 Software Reset call, and Device ID addresses Two other different addresses can be sent to the PCA9673. • General Call address: allows to reset the PCA9673 through the I reception of the right I information. • ...

Page 8

... The Device ID field is a 3-byte read-only (24 bits) word giving the following information: • 8 bits with the manufacturer name, unique per manufacturer (for example, NXP Semiconductors). • 13 bits with the part identification, assigned by manufacturer, the 7 MSBs with the category ID and the 6 LSBs with the feature ID (for example, PCA9673 16-bit quasi-output I/O expander) ...

Page 9

... NXP Semiconductors • 3 bits with the die revision, assigned by manufacturer (for example, Rev X). The Device ID is read-only, hardwired in the device and can be accessed as follows: 1. START command 2. The master sends the Reserved Device ID I bit set to 0 (write). 3. The master sends the I The LSB is a ‘ ...

Page 10

... NXP Semiconductors S 1 START condition M7 manufacturer name = 00000000 Fig 14. Device ID field reading 8. I/O programming 8.1 Quasi-bidirectional I/O architecture The PCA9673’s 16 ports (see as input or output ports. Input data is transferred from the ports to the microcontroller in the Read mode (see (see Figure Every data transmission from the PCA9673 must consist of an even number of bytes, the fi ...

Page 11

... NXP Semiconductors first data byte is acknowledged by the PCA9673, the second data byte P17 to P10 is sent by the master. Once again, the PCA9673 acknowledges the receipt of the data. Each 8-bit data is presented on the port lines after it has been acknowledged by the PCA9673. The number of data bytes that can be sent successively is not limited. After every two bytes, the previous data is overwritten. The fi ...

Page 12

SCL P0x SDA DATA 00 START condition R/W acknowledge from slave read from port 0 data into port 0 DATA 00 ...

Page 13

SCL P0x SDA DATA 00 START condition R/W acknowledge from slave read from port 0 t h(D) data into port 0 ...

Page 14

... NXP Semiconductors 8.4 Power-on reset When power is applied reset condition until V and the PCA9673 registers and I states. Thereafter V 8.5 Interrupt output (INT) The PCA9673 provides an open-drain interrupt (INT) which can be fed to a corresponding input of the microcontroller (see chips a kind of master function which can initiate an action elsewhere in the system. ...

Page 15

... NXP Semiconductors 9. Characteristics of the I 2 The I C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device ...

Page 16

... NXP Semiconductors SDA SCL MASTER TRANSMITTER/ RECEIVER Fig 22. System configuration 9.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse ...

Page 17

... NXP Semiconductors 10. Application design-in information 10.1 Bidirectional I/O expander applications In the 8-bit I/O expander application shown in to P07 are outputs. When used in this configuration, during a write, the input (P00 and P01) must be written as HIGH so the external devices fully control the input ports. The desired HIGH or LOW logic levels may be written to the I/Os used as outputs (P02 to P07) ...

Page 18

... NXP Semiconductors 10.3 Differences between the PCA9673 and the PCF8575 The PCA9673 is a drop in replacement for the PCF8575 and can used without electrical or software modifications, but there is a difference in interrupt output release timing during the read operation. Write operations are identical. At the completion of each 8-bit write sequence the data is stored in its associated 8-bit write register at ACK or NACK. The fi ...

Page 19

... NXP Semiconductors 12. Static characteristics Table 5. Static characteristics Symbol Parameter Supplies V supply voltage DD I supply current DD I standby current stb V power-on reset voltage POR Input SCL; input/output SDA V LOW-level input voltage IL V HIGH-level input voltage IH I LOW-level output current OL I leakage current ...

Page 20

... NXP Semiconductors [1] The power-on reset circuit resets the I [2] Each bit must be limited to a maximum and the total package limited to 400 mA due to internal busing limits. [3] The value is not tested, but verified on sampling basis. 13. Dynamic characteristics Table 6. Dynamic characteristics Symbol Parameter ...

Page 21

... NXP Semiconductors [ time for Acknowledgement signal from SCL LOW to SDA (out) LOW. VD;ACK [ minimum time for SDA data out to be valid following SCL LOW. VD;DAT [ total capacitance of one bus line in pF. b [4] A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the V bridge the undefi ...

Page 22

... NXP Semiconductors 14. Package outline SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 2.65 mm 0.25 0.1 2.25 0.012 0.096 0.1 inches 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

Page 23

... NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT340-1 Fig 29. Package outline SOT340-1 (SSOP24) ...

Page 24

... NXP Semiconductors TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

Page 25

... NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) A UNIT max. 0.25 1.55 mm 1.73 0.25 0.10 1.40 0.0098 0.061 inches 0.068 0.01 0.0040 0.055 Note 1 ...

Page 26

... NXP Semiconductors HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 0.85 mm terminal 1 index area terminal 1 24 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...

Page 27

... NXP Semiconductors DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...

Page 28

... NXP Semiconductors 15. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However completely safe you must take normal precautions appropriate to handling integrated circuits. 16. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” ...

Page 29

... NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • ...

Page 30

... NXP Semiconductors Fig 34. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 17. Abbreviations Table 9. Acronym CDM CMOS ESD GPIO HBM 2 I C-bus ID LED LSB MM MSB PLC ...

Page 31

... NXP Semiconductors 18. Revision history Table 10. Revision history Document ID Release date PCA9673_1 20070201 PCA9673_1 Product data sheet Remote 16-bit I/O expander for Fm+ I Data sheet status Product data sheet Rev. 01 — 1 February 2007 PCA9673 2 C-bus with interrupt and reset Change notice Supersedes ...

Page 32

... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

Page 33

... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Functional description . . . . . . . . . . . . . . . . . . . 6 7.1 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.1.1 Address maps 7.2 Software Reset call, and Device ID addresses. 7 7.2.1 Software Reset . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.2.2 Device ID (PCA9673 ID fi ...

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