PCA9672D,512 NXP Semiconductors, PCA9672D,512 Datasheet - Page 23

IC I/O EXPANDER I2C 8B 16SOIC

PCA9672D,512

Manufacturer Part Number
PCA9672D,512
Description
IC I/O EXPANDER I2C 8B 16SOIC
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCA9672D,512

Interface
I²C
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
1MHz
Voltage - Supply
2.3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.300", 7.5mm Width)
Includes
POR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935282746512
PCA9672D
PCA9672D
NXP Semiconductors
PCA9672_2
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 7.
Table 8.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
2.5
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
8
Remote 8-bit I/O expander for Fm+ I
26.
Rev. 02 — 6 July 2007
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
26) than a PbSn process, thus
2
C-bus with interrupt and reset
220
220
350
> 2000
260
245
245
PCA9672
© NXP B.V. 2007. All rights reserved.
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