PCA9671D,118 NXP Semiconductors, PCA9671D,118 Datasheet

IC I/O EXPANDER I2C 16B 24SOIC

PCA9671D,118

Manufacturer Part Number
PCA9671D,118
Description
IC I/O EXPANDER I2C 16B 24SOIC
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCA9671D,118

Interface
I²C
Number Of I /o
16
Interrupt Output
No
Frequency - Clock
1MHz
Voltage - Supply
2.3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-SOIC (7.5mm Width)
Includes
POR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4192-2
935283551118
PCA9671D-T
1. General description
2. Features and benefits
The PCA9671 provides general purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I
(Fm+) family.
The PCA9671 is a drop in upgrade for the PCF8575 providing higher I
(1 MHz versus 400 kHz) so that the output can support PWM dimming of LEDs, higher
I
the need for bus buffers, higher total package sink capacity (400 mA versus 100 mA) that
supports having all 25 mA LEDs on at the same time and more device addresses
(64 versus 8) to allow many more devices on the bus without address conflicts.
The difference between the PCA9671 and the PCF8575 is that the interrupt output on the
PCF8575 is replaced by a RESET input on the PCA9671.
The device consists of a 16-bit quasi-bidirectional port and an I
PCA9671 has a low current consumption and includes latched outputs with 25 mA high
current drive capability for directly driving LEDs. The internal Power-On Reset (POR),
hardware reset pin (RESET) or software reset sequence initializes the I/Os as inputs.
2
C-bus drive (30 mA versus 3 mA) so that many more devices can be on the bus without
PCA9671
Remote 16-bit I/O expander for Fm+ I
Rev. 2 — 29 July 2010
1 MHz I
Compliant with the I
SDA with 30 mA sink capability for 4000 pF buses
2.3 V to 5.5 V operation with 5.5 V tolerant I/Os
16-bit remote I/O pins that default to inputs at power-up
Latched outputs with 25 mA sink capability for directly driving LEDs
Total package sink capability of 400 mA
Active LOW reset input
64 programmable slave addresses using 3 address pins
Readable device ID (manufacturer, device type, and revision)
Low standby current
−40 °C to +85 °C operation
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
Packages offered: SO24, SSOP24, QSOP24, TSSOP24, HVQFN24, DHVQFN24
2
C-bus interface
2
C-bus Fast-mode and Standard-mode
2
C-bus) and is a part of the Fast-mode Plus
2
C-bus with reset
2
C-bus interface. The
Product data sheet
2
C-bus speeds

Related parts for PCA9671D,118

PCA9671D,118 Summary of contents

Page 1

PCA9671 Remote 16-bit I/O expander for Fm+ I Rev. 2 — 29 July 2010 1. General description The PCA9671 provides general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional bus (I (Fm+) family. The PCA9671 is ...

Page 2

... NXP Semiconductors 3. Applications LED signs and displays Servers Industrial control Medical equipment PLCs Cellular telephones Gaming machines Instrumentation and test measurement 4. Ordering information Table 1. Ordering information Type Topside Package number mark Name PCA9671D PCA9671D SO24 PCA9671DB PCA9671DB SSOP24 PCA9671DK PCA9671 SSOP24 ...

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... NXP Semiconductors 5. Block diagram AD0 AD1 AD2 SCL SDA RESET V V Fig 1. data from Shift Register data to Shift Register Fig 2. PCA9671 Product data sheet Remote 16-bit I/O expander for Fm+ I PCA9671 2 INPUT I C-BUS FILTER CONTROL POWER-ON RESET DD SS Block diagram of PCA9671 ...

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... NXP Semiconductors 6. Pinning information 6.1 Pinning RESET Fig 3. RESET Fig 5. PCA9671 Product data sheet Remote 16-bit I/O expander for Fm AD1 2 23 SDA 3 22 AD2 SCL 4 21 P00 AD0 P01 5 20 P17 P02 6 19 P16 PCA9671D P03 7 18 P15 8 17 P04 P14 ...

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... NXP Semiconductors terminal 1 index area Fig 7. 6.2 Pin description Table 2. Symbol RESET AD1 AD2 P00 P01 P02 P03 P04 P05 P06 P07 V SS P10 P11 P12 P13 P14 P15 P16 P17 PCA9671 Product data sheet Remote 16-bit I/O expander for Fm P00 ...

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... NXP Semiconductors Table 2. Symbol AD0 SCL SDA V DD [1] HVQFN and DHVQFN package die supply ground is connected to both the V pad. The V electrical, and board-level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias need to be incorporated in the PCB in the thermal pad region ...

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... NXP Semiconductors 7.1.1 Address maps Table 3. AD2 PCA9671 Product data sheet Remote 16-bit I/O expander for Fm+ I PCA9671 address map AD1 AD0 SCL SCL SDA SDA SCL SCL SDA SDA SCL SCL SCL SDA SDA SCL SDA SDA SCL SCL SCL ...

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... NXP Semiconductors Table 3. AD2 SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA PCA9671 Product data sheet Remote 16-bit I/O expander for Fm+ I PCA9671 address map … ...

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... NXP Semiconductors 7.2 Software Reset call, and device ID addresses Two other different addresses can be sent to the PCA9671. • General Call address: allows to reset the PCA9671 through the I reception of the right I information. • Device ID address: allows to read ID information from the device (manufacturer, part identification, revision) ...

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... The Device ID field is a 3-byte read-only (24 bits) word giving the following information: • 8 bits with the manufacturer name, unique per manufacturer (for example, NXP Semiconductors). • 13 bits with the part identification, assigned by manufacturer, the 7 MSBs with the category ID and the 6 LSBs with the feature ID (for example, PCA9671 16-bit quasi-output I/O expander). • ...

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... NXP Semiconductors Remark: The reading of the Device ID can be stopped anytime by sending a NACK command. Remark: If the master continues to ACK the bytes after the third byte, the PCA9671 rolls back to the first byte and keeps sending the Device ID sequence until a NACK has been detected. ...

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... NXP Semiconductors 8. I/O programming 8.1 Quasi-bidirectional I/O architecture The PCA9671’s 16 ports (see as input or output ports. Input data is transferred from the ports to the microcontroller in the Read mode (see (see Figure Every data transmission from the PCA9671 must consist of an even number of bytes, the first byte will be referred to as P07 to P00, and the second byte as P17 to P10 ...

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... NXP Semiconductors SCL slave address SDA START condition write to port data output from port P05 output voltage P05 pull-up ouput current P16 output voltage P16 pull-up ouput current Fig 16. Write mode (output) 8.3 Reading from a port (Input mode) All ports programmed as input should be set to logic 1. To read, the master (microcontroller) first addresses the slave device after it receives the interrupt ...

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SCL P0x SDA DATA 00 START condition R/W acknowledge from slave read from port 0 data into port 0 DATA 00 ...

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SCL P0x SDA DATA 00 START condition R/W acknowledge from slave read from port 0 t h(D) data into port 0 ...

Page 16

... NXP Semiconductors 8.4 Power-on reset When power is applied reset condition until V and the PCA9671 registers and I states. Thereafter V 8.5 RESET input A reset can be accomplished by holding the RESET pin LOW for a minimum of t PCA9671 registers and I RESET input is once again HIGH. 9. Characteristics of the I ...

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... NXP Semiconductors SDA SCL Fig 20. Definition of START and STOP conditions 9.2 System configuration A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see ...

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... NXP Semiconductors Fig 22. Acknowledgement on the I 10. Application design-in information 10.1 Bidirectional I/O expander applications In the 8-bit I/O expander application shown in to P07 are outputs. When used in this configuration, during a write, the input (P00 and P01) must be written as HIGH so the external devices fully control the input ports. The desired HIGH or LOW logic levels may be written to the I/Os used as outputs (P02 to P07) ...

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... NXP Semiconductors 10.2 High current-drive load applications The GPIO has a maximum sinking current per bit. In applications requiring additional drive, two port pins in the same octal may be connected together to sink current. Both bits must then always be turned on or off together pins (one octal) can be connected together to drive 200 mA ...

Page 20

... NXP Semiconductors 12. Static characteristics Table 5. Static characteristics Symbol Parameter Supplies V supply voltage DD I supply current DD I standby current stb V power-on reset voltage POR Input SCL; input/output SDA V LOW-level input voltage IL V HIGH-level input voltage IH I LOW-level output current OL I leakage current ...

Page 21

... NXP Semiconductors 13. Dynamic characteristics Table 6. Dynamic characteristics Symbol Parameter f SCL clock frequency SCL t bus free time between a BUF STOP and START condition t hold time (repeated) HD;STA START condition t set-up time for a repeated SU;STA START condition t set-up time for STOP SU;STO ...

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... NXP Semiconductors [5] The maximum t for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage t f 250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without ...

Page 23

... NXP Semiconductors 14. Package outline SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

Page 24

... NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT340-1 Fig 28. Package outline SOT340-1 (SSOP24) ...

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... NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) A UNIT max. 0.25 1.55 mm 1.73 0.25 0.10 1.40 0.0098 0.061 inches 0.068 0.01 0.0040 0.055 Note 1 ...

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... NXP Semiconductors TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

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... NXP Semiconductors DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...

Page 28

... NXP Semiconductors HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 0.85 mm terminal 1 index area terminal 1 24 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...

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... NXP Semiconductors 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “ ...

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... NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • ...

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... NXP Semiconductors Fig 33. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Abbreviations Table 9. Acronym CDM CMOS ESD GPIO HBM 2 I C-bus I LED LSB MM MSB PLC PWM RAID ...

Page 32

... NXP Semiconductors 18. Revision history Table 10. Revision history Document ID Release date PCA9671 v.2 20100729 • Modifications: Table 5 “Static I specification OH PCA9671 v.1 20061220 PCA9671 Product data sheet Remote 16-bit I/O expander for Fm+ I Data sheet status Product data sheet characteristics”, sub-section “Input RESET” is corrected by removing Product data sheet All information provided in this document is subject to legal disclaimers ...

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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

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... PCA9671 Product data sheet Remote 16-bit I/O expander for Fm+ I own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. ...

Page 35

... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Functional description . . . . . . . . . . . . . . . . . . . 6 7.1 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.1.1 Address maps 7.2 Software Reset call, and device ID addresses . 9 7 ...

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