CL21B105KOFNNNG SAMSUNG, CL21B105KOFNNNG Datasheet - Page 19

• Manufacturer Part Number: CL21B105KOFNNNG
• Manufacturer: SAMSUNG

▶ Manual Soldering
▶ Amount of Solder
▶ Bending Stress
the crack occur to the ready-installed MLCCs by the bending stress.
board. When the MLCCs are mounted onto the other side,
it is important to support the board as shown in the illustration. If the circuit board is not supported,
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side of the
The hot soldering iron tip comes into direct contact with the end terminations, and operator's
carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic
body of the capacitor.
Therefore the soldering iron must be handled carefully, and close attention must be paid
to the selection of the soldering iron tip and to temperature control of the tip.
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors.
N ot eno ug h
Too m uc h
Goo d
S olde r
S olde r
nozzle
force
support pin
C rac k s tend to oc c ur due
to larg e s tres s
W eak hold ing forc e m ay
c aus e bad c onne c tions or
detac h ing of the c apac itor