CL21B105KOFNNNG SAMSUNG, CL21B105KOFNNNG Datasheet - Page 20

• Manufacturer Part Number: CL21B105KOFNNNG
• Manufacturer: SAMSUNG

▶ Cooling
Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the
temperature difference(△T) must be less than 100℃
▶ Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in
the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This
means that the cleaning fluid must be carefully selected, and should always be new.
▶ Notes for Separating Multiple, Shared PC Boards.
If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors.
Carefully choose a separation method that minimizes the bending often circuit board.
▶ Recommended Soldering Profile
A multi-PC board is separated into many individual circuit boards after soldering has been completed.
Soldering
Temp.(℃ )
200℃
150℃
Pre-heating
Reflow
260+0/-5℃
10sec.max.
Gradual cooling
in the air
Time(sec)