MT16HTF25664AZ-800H1 Micron Technology Inc, MT16HTF25664AZ-800H1 Datasheet

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MT16HTF25664AZ-800H1

Manufacturer Part Number
MT16HTF25664AZ-800H1
Description
MODULE DDR2 SDRAM 2GB 240UDIMM
Manufacturer
Micron Technology Inc
Series
-r
Datasheet

Specifications of MT16HTF25664AZ-800H1

Memory Type
DDR2 SDRAM
Memory Size
2GB
Speed
800MT/s
Features
-
Package / Case
240-UDIMM
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
DDR2 SDRAM SODIMM
MT16HTF12864HZ – 1GB
MT16HTF25664HZ – 2GB
MT16HTF51264HZ – 4GB
Features
• 200-pin, small-outline dual in-line memory module
• Fast data transfer rates: PC2-3200, PC2-4200,
• 1GB (128 Meg x 64), 2GB (256 Meg x 64) or 4GB (512
• V
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Multiple internal device banks for concurrent
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Halogen-free
• Serial presence detect (SPD) with EEPROM
• Gold edge contacts
• Dual rank
Table 1: Key Timing Parameters
PDF: 09005aef8339ef97
htf16c128_256_512x64hz.pdf - Rev. C 9/10 EN
(SODIMM)
PC2-5300, or PC2-6400
Meg x 64)
operation
Speed
Grade
-1GA
-80E
-800
-667
-53E
-40E
DD
DDSPD
= V
DDQ
= 1.7–3.6V
Nomenclature
= 1.8V
Products and specifications discussed herein are subject to change by Micron without notice.
Industry
PC2-8500
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
CL = 7
1066
t
CK
1GB, 2GB, 4GB (x64, DR) 200-Pin DDR2 SDRAM SODIMM
CL = 6
800
800
800
Data Rate (MT/s)
CL = 5
667
800
667
667
1
Figure 1: 200-Pin SODIMM (MO-224 R/C E)
Module Height: 30mm (1.181 in.)
Options
• Operating temperature
• Package
• Frequency/CL
Notes:
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 200-pin DIMM (halogen-free)
– 1.87ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3ns @ CL = 5 (DDR2-667)
CL = 4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
533
533
533
553
553
400
1. Contact Micron for industrial temperature
2. CL = CAS (READ) latency.
3. Not recommended for new designs.
module offerings.
CL = 3
400
400
400
400
400
400
2
A
13.125
A
t
(ns)
12.5
RCD
≤ +85°C)
≤ +70°C)
15
15
15
15
© 2008 Micron Technology, Inc. All rights reserved.
1
13.125
(ns)
12.5
t
15
15
15
15
RP
Features
Marking
None
-1GA
-80E
-800
-667
58.125
(ns)
57.5
t
Z
I
60
60
55
55
RC

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MT16HTF25664AZ-800H1 Summary of contents

Page 1

DDR2 SDRAM SODIMM MT16HTF12864HZ – 1GB MT16HTF25664HZ – 2GB MT16HTF51264HZ – 4GB Features • 200-pin, small-outline dual in-line memory module (SODIMM) • Fast data transfer rates: PC2-3200, PC2-4200, PC2-5300, or PC2-6400 • 1GB (128 Meg x 64), 2GB (256 Meg ...

Page 2

... Table 4: Part Numbers and Timing Parameters – 2GB Modules 1 Base device: MT47H128M8, 1Gb DDR2 SDRAM Module 2 Part Number Density MT16HTF25664H(I)Z-1GA__ MT16HTF25664H(I)Z-80E__ MT16HTF25664H(I)Z-800__ MT16HTF25664H(I)Z-667__ Table 5: Part Numbers and Timing Parameters – 2GB Modules 1 Base device: MT47H256M8, 2Gb DDR2 SDRAM Module 2 Part Number Density MT16HTF51264H(I)Z-1GA__ MT16HTF51264H(I)Z-80E__ MT16HTF51264H(I)Z-800__ MT16HTF51264H(I)Z-667__ 1. The data sheet for the base device can be found on Micron’ ...

Page 3

Pin Assignments Table 6: Pin Assignments 200-Pin DDR2 SODIMM Front Pin Symbol Pin Symbol Pin DQS2 101 REF 103 DQ0 55 DQ18 105 7 DQ1 57 DQ19 107 9 V ...

Page 4

... Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR2 modules. All pins listed may not be supported on this module. See Pin Assignments for information specific to this module. Table 7: Pin Descriptions Symbol Type Ax Input BAx Input ...

Page 5

Table 7: Pin Descriptions (Continued) Symbol Type SDA I/O RDQSx, Output RDQS#x Err_Out# Output (open drain Supply DD DDQ V Supply DDSPD V Supply REF V Supply SS – NC – NF – NU – RFU PDF: 09005aef8339ef97 ...

Page 6

Functional Block Diagram – 1GB, 2GB Figure 2: Functional Block Diagram – 1GB, 2GB S1# S0# DQS0# DQS0 DM0 DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQ DQS1# DQS1 DM1 DQ8 DQ ...

Page 7

Functional Block Diagram – 4GB Figure 3: Functional Block Diagram – 4GB S1# S0# DQS0# DQS0 DM0 DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQ DQS1# DQS1 DM1 DQ8 DQ DQ9 DQ ...

Page 8

... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR2 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...

Page 9

Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in the device data ...

Page 10

... Design Considerations Simulations Micron memory modules are designed to optimize signal integrity through carefully de- signed terminations, controlled board impedances, routing topologies, trace length matching, and decoupling. However, good signal integrity starts at the system level. Mi- cron encourages designers to simulate the signal characteristics of the system's memo- ry bus to ensure adequate signal integrity of the entire memory system ...

Page 11

IDD Specifications Table 10: DDR2 I Specifications and Conditions – 1GB DD Values shown for MT47H64M8 DDR2 SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) component data sheet Parameter Operating one bank active-precharge ...

Page 12

Table 10: DDR2 I Specifications and Conditions – 1GB (Continued) DD Values shown for MT47H64M8 DDR2 SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) component data sheet Parameter Operating bank interleave read current: ...

Page 13

Table 11: DDR2 I Specifications and Conditions – 2GB (Die Revision E and G) (Continued) DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet ...

Page 14

Table 12: DDR2 I Specifications and Conditions – 2GB (Die Revision H) (Continued) DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet Parameter Active ...

Page 15

Table 13: DDR2 I Specifications and Conditions – 4GB (Die Revision A) (Continued) DD Values shown for MT47H256M8 DDR2 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) com- ponent data sheet Parameter Precharge ...

Page 16

Serial Presence-Detect For the latest SPD data, refer to Micron's SPD page: www.micron.com/SPD. Table 14: SPD EEPROM Operating Conditions Parameter/Condition Supply voltage Input high voltage: logic 1; All inputs Input low voltage: logic 0; All inputs Output low voltage: I ...

Page 17

Module Dimensions – 1GB, 2GB Figure 4: 200-Pin DDR2 SODIMM – 1GB, 2GB 2.0 (0.079 (2X) 1.80 (0.071) (2X) U6 6.0 (0.236) TYP Pin 1 2.0 (0.079) TYP 16.25 (0.64) TYP U10 U15 3.5 (0.138) TYP Pin 200 ...

Page 18

Module Dimensions – 4GB Figure 5: 200-Pin DDR2 SODIMM – 4GB 2.0 (0.079 (2X) 1.80 (0.071) (2X) U7 6.0 (0.236) TYP PIN 1 2.0 (0.079) TYP 16.25 (0.64) TYP 45° 4X U11 U15 3.5 (0.138) TYP PIN 200 ...

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