MT18JSF51272PDZ-1G6M1 Micron Technology Inc, MT18JSF51272PDZ-1G6M1 Datasheet

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MT18JSF51272PDZ-1G6M1

Manufacturer Part Number
MT18JSF51272PDZ-1G6M1
Description
MODULE DDR3 SDRAM 4GB 240RDIMM
Manufacturer
Micron Technology Inc
Series
-r
Datasheet

Specifications of MT18JSF51272PDZ-1G6M1

Memory Type
DDR3 SDRAM
Memory Size
4GB
Speed
1600MT/s
Features
-
Package / Case
240-RDIMM
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
DDR3 SDRAM RDIMM
MT18JS(Z)F25672PDZ – 2GB
MT18JS(Z)F51272PDZ – 4GB
Features
• DDR3 functionality and operations supported as
• 240-pin, registered dual in-line memory module
• Fast data transfer rates: PC3-12800, PC3-10600,
• 2GB (256 Meg x 72), 4GB (512 Meg x 72)
• V
• V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
• Dual rank
• On-board I
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
PDF: 09005aef83d9afa1
js-z-f18c256_512x72pdz.pdf – Rev. D 9/10 EN
Speed
Grade
defined in the component data sheet
(RDIMM)
PC3-8500, or PC3-6400
data, strobe, and mask signals
serial presence-detect (SPD) EEPROM
via the mode register set (MRS)
-1G6
-1G4
-1G1
-1G0
-80B
DD
DDSPD
= 1.5V ±0.075V
= 3.0–3.6V
Nomenclature
PC3-12800
PC3-10600
2
Industry
PC3-8500
PC3-8500
PC3-6400
C temperature sensor with integrated
Products and specifications discussed herein are subject to change by Micron without notice.
CL = 11 CL = 10
1600
1333
1333
2GB, 4GB (x72, ECC, DR) 240-Pin DDR3 SDRAM RDIMM
CL = 9
1333
1333
Data Rate (MT/s)
CL = 8
1066
1066
1066
1066
1
Figure 1: 240-Pin RDIMM (MO-269 R/C B)
Module height: 30mm (1.18in)
Options
• Heat spreader options
• Operating temperature
• Package
• Frequency/CAS latency
– Without heat spreader
– With heat spreader
– Commercial (0°C ≤ T
– 240-pin DIMM (halogen-free)
– 1.25ns @ CL = 11 (DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
CL = 7
1066
1066
1066
Micron Technology, Inc. reserves the right to change products or specifications without notice.
CL = 6
800
800
800
800
800
CL = 5
667
667
667
667
667
A
≤ +70°C)
© 2010 Micron Technology, Inc. All rights reserved.
13.125
13.125
13.125
t
(ns)
RCD
15
15
13.125
13.125
13.125
(ns)
t
15
15
RP
Marking
Features
None
-1G6
-1G4
-1G1
JSZF
JSF
Z
48.125
49.125
50.625
(ns)
52.5
52.5
t
RC

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MT18JSF51272PDZ-1G6M1 Summary of contents

Page 1

DDR3 SDRAM RDIMM MT18JS(Z)F25672PDZ – 2GB MT18JS(Z)F51272PDZ – 4GB Features • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, registered dual in-line memory module (RDIMM) • Fast data transfer rates: PC3-12800, PC3-10600, PC3-8500, or ...

Page 2

... MT18JS(Z)F51272PDZ-1G4__ MT18JS(Z)F51272PDZ-1G1__ 1. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Note: Consult factory for current revision codes. Example: MT18JSF51272PDZ-1G1D1. PDF: 09005aef83d9afa1 js-z-f18c256_512x72pdz.pdf – Rev. D 9/10 EN 2GB, 4GB (x72, ECC, DR) 240-Pin DDR3 SDRAM RDIMM 2GB ...

Page 3

Pin Assignments Table 5: Pin Assignments 240-Pin DDR3 RDIMM Front Pin Symbol Pin Symbol Pin DQ25 61 REFDQ DQ0 33 DQS3 DQ1 34 DQS3 ...

Page 4

... Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR3 modules. All pins listed may not be supported on this module. See Pin Assignments for information specific to this module. Table 6: Pin Descriptions Symbol Type Ax Input BAx Input ...

Page 5

Table 6: Pin Descriptions (Continued) Symbol Type SDA I/O TDQSx, Output TDQSx# Err_Out# Output (open drain) EVENT# Output (open drain) V Supply DD V Supply DDSPD V Supply REFCA V Supply REFDQ V Supply SS V Supply TT – NC ...

Page 6

DQ Map Table 7: Component-to-Module DQ Map Component Reference Component Number DQ Module ...

Page 7

Table 7: Component-to-Module DQ Map (Continued) Component Reference Component Number DQ Module DQ U11 U13 U15 ...

Page 8

Table 7: Component-to-Module DQ Map (Continued) Component Reference Component Number DQ Module DQ U20 PDF: 09005aef83d9afa1 js-z-f18c256_512x72pdz.pdf – Rev. D 9/10 EN 2GB, 4GB (x72, ECC, DR) 240-Pin DDR3 SDRAM RDIMM Component ...

Page 9

Functional Block Diagram Figure 2: Functional Block Diagram RS1# RS1# RS0# RS0# DQS0 DQS0 DQS0# DQS0# DM0/TDQS9 DM0/TDQS9 NC/TDQS9# NC/TDQS9# DM/ DM/ NU/ CS# DQS DQS# NU/ CS# DQS DQS# DM/ DM/ NU/ CS# DQS DQS# NU/ CS# DQS DQS# ...

Page 10

... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...

Page 11

... TSE2002av, Serial Presence Detect with Temperature Sensor." Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE- DEC standard JC-45, "Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Modules." ...

Page 12

Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device's data ...

Page 13

... Design Considerations Simulations Micron memory modules are designed to optimize signal integrity through carefully de- signed terminations, controlled board impedances, routing topologies, trace length matching, and decoupling. However, good signal integrity starts at the system level. Micron encourages designers to simulate the signal characteristics of the system's mem- ory bus to ensure adequate signal integrity of the entire memory system ...

Page 14

I Specifications DD Table 11: DDR3 I Specifications and Conditions – 2GB DD Values are for the MT41J128M8 DDR3 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) component data sheet Parameter Operating current ...

Page 15

Table 12: DDR3 I Specifications and Conditions – 4GB DD Values are for the MT41J256M8 DDR3 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) component data sheet Parameter Operating current 0: One bank ...

Page 16

Registering Clock Driver Specifications Table 13: Registering Clock Driver Electrical Characteristics SSTE32882 devices or equivalent Parameter Symbol DC supply voltage reference voltage V REF DC termination V TT voltage AC high-level input V IH(AC) voltage AC low-level ...

Page 17

Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module's temperature and can be read back at any time over the I Serial Presence-Detect For the latest SPD data, refer to Micron's SPD page: www.micron.com/SPD. Table 14: ...

Page 18

EVENT# Pin The temperature sensor also adds the EVENT# pin (open-drain). Not used by the SPD EEPROM, EVENT temperature sensor output used to flag critical events that can be set up in the sensor’s configuration register. EVENT# has ...

Page 19

Module Dimensions Figure 3: 240-Pin DDR3 RDIMM 0.9 (0.035) TYP 0.5 (0.02) R (4X 0.75 (0.03) R (8X) 2.5 (0.098) D (2X) 2.3 (0.091) TYP Pin 1 2.2 (0.087) TYP 1.45 (0.057) TYP 54.68 (2.15) 15.0 (0.59) TYP ...

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