FSA1256L8X_NL | |
|---|---|
| Manufacturer Part Number | FSA1256L8X_NL |
| Description | IC SWITCH DUAL SPST 8MICROPAK |
| Manufacturer | Fairchild Semiconductor |
| FSA1256L8X_NL datasheets |
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| Product Change Notification |
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Availability: By request
International delivery:
Warranty: 60 days
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- We provide standard 60-days warranty for all parts. If warranty differs we always mention it beforehand. In case of return we cover shipping costs.
- If you still have any questions - please contact us
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Shipping terms
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- If you still have any questions - please contact us
Specifications of FSA1256L8X_NL | |||
|---|---|---|---|
| Function | Switch | Circuit | 2 x SPST - NO |
| On-state Resistance | 1.15 Ohm | Voltage Supply Source | Single Supply |
| Voltage - Supply, Single/dual (±) | 1.65 V ~ 5.5 V | Current - Supply | 0.5µA |
| Operating Temperature | -40°C ~ 85°C | Mounting Type | Surface Mount |
| Package / Case | 8-MicroPak™ | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Other names | FSA1256L8XCT FSA1256L8X_NLCT FSA1256L8X_NLCT | ||
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DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
Technical Contact:
Name: Leng, HooiChin
E-mail: HooiChin.Leng@notes.fairchildsemi.com
Phone: 604-8502370
PCN Originator:
Name: Leng, HooiChin
E-mail: HooiChin.Leng@notes.fairchildsemi.com
Phone: 604-8502370
Implementation of change:
Expected 1st Device Shipment Date: 2009/01/02
Earliest Year/Work Week of Changed Product: 0901
Change Type Description: Die Attach Material, Mold Compound
Description of Change (From): Fairchild's Micropak packages currently assembled at
Hana-Ayutthaya using non-green mold compound and substrate materials.
Description of Change (To): Green, Halogen Free RoHS compliant packages. The Micropak
packages assembled at Hana-Ayutthaya will be Green with the changes to mold compound and
the substrate. (Note: Two mold compounds have been qualified to support the change to green
materials and based on performance, can be interchanged.) Also refer to the tables below for
comparisons of this change.
Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is
dedicated to being a good corporate citizen. The reference material changes have been made to
provide a Full Green (Halogen Free Flame Retardant) package. For additional details on the
corporate wide green initiative please visit our Web site at:
http://www.fairchildsemi.com/company/green/index.html. Package outline drawings of the
Micropak packages will remain unchanged. Green products will be fully compliant to all
published datasheet specifications and will be interchangeable with current non-green product.
Quality and Reliability will remain at the highest standards already demonstrated with Fairchild
existing products.
Qual/REL Plan Numbers : Q20070331
Qualification :
Attached are the Reliability Test results to qualify the Green conversion of the Micropak
Date Created : 2008/08/05
Date Issued On : 2008/10/03
PCN# : Q3083202
Pg. 1
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FSA1256L8X_NL Summary of contents |
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