FIN1022MX Fairchild Semiconductor, FIN1022MX Datasheet

IC CROSSPOINT SWITCH 2X2 16SOIC

FIN1022MX

Manufacturer Part Number
FIN1022MX
Description
IC CROSSPOINT SWITCH 2X2 16SOIC
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of FIN1022MX

Function
Crosspoint Switch
Circuit
1 x 2:2
On-state Resistance
75 Ohm
Voltage Supply Source
Single Supply
Voltage - Supply, Single/dual (±)
3 V ~ 3.6 V
Current - Supply
35mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.154", 3.90mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FIN1022MXTR
FIN1022MX_NL
FIN1022MX_NLTR
FIN1022MX_NLTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FIN1022MX
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
© 2001 Fairchild Semiconductor Corporation
FIN1022M
FIN1022MTC
FIN1022
2 X 2 LVDS High Speed Crosspoint Switch
General Description
This non-blocking 2x2 crosspoint switch has a fully differ-
ential input to output data path for low noise generation and
low pulse width distortion. The device can be used as a
high speed crosspoint switch, 2:1 multiplexer, 1:2 demulti-
plexer or 1:2 signal splitter. The inputs can directly interface
with LVDS and LVPECL levels.
Ordering Code:
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
Order Number
Package Number
MTC16
M16A
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
DS500653
Features
Low jitter, 800 Mbps full differential data path
Worst case jitter of 190ps
with PRBS
Rail-to-rail common mode range is 0.5V to 3.25V
Worst case power dissipation is less than 126 mW
Open-circuit fail safe protection
Fast switch time of 1.1 ns typical
35 ps typical pin channel to channel skew
3.3V power supply operation
Non-blocking switch
LVDS receiver inputs accept LVPECL signals directly
7.5 kV HBM ESD protection
16-lead SOIC package and TSSOP package
Inter-operates with TIA/EIA 644-1995 specification
See the Fairchild Interface Solutions web page for cross
reference information:
www.fairchildsemi.com/products/interface/lvds.html
Package Description
2
23
1 data pattern at 800 Mbps
September 2001
Revised December 2001
www.fairchildsemi.com

Related parts for FIN1022MX

FIN1022MX Summary of contents

Page 1

... Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Logic Symbol © 2001 Fairchild Semiconductor Corporation Features Low jitter, 800 Mbps full differential data path ...

Page 2

Connection Diagram Function Table Inputs SEL SEL ...

Page 3

Absolute Maximum Ratings Supply Voltage ( Input Voltage ( Output Voltage (V ) OUT Driver Short Circuit Current (I ) OSD Storage Temperature Range (T ) STG Max Junction Temperature ( Lead ...

Page 4

AC Electrical Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified Symbol Parameter t Differential Output Propagation Delay PLHD LOW-to-HIGH t Differential Output Propagation Delay PHLD HIGH-to-LOW t Differential Output Rise Time (20% to 80%) TLHD t Differential ...

Page 5

Required Specifications 1. When the true and complement LVDS outputs (having a 75 connected between outputs) are connected to 3.75 k resistors and the common point of those 3.75 k resistors are connected to a voltage source that sweeps from ...

Page 6

Required Specifications (Continued) FIGURE 3. LVDS Driver DC Test Circuit FIGURE 5. LVDS Input to LVDS Output AC Waveforms www.fairchildsemi.com Note A: All input pulses have frequency 50 MHz Note B: C includes all probe and jig capacitances ...

Page 7

Required Specifications (Continued) FIGURE 7. LVTTL Input to LVDS Output AC Waveforms FIGURE 9. Enable and Disable AC Waveforms Note A: All input pulses have frequency 10MHz Note B: C includes all probe and jig capacitances. ...

Page 8

Required Specifications (Continued) FIGURE 10. Set-up and Hold Time Specification www.fairchildsemi.com 8 ...

Page 9

Physical Dimensions inches (millimeters) unless otherwise noted 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Package Number M16A 9 www.fairchildsemi.com ...

Page 10

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves ...

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