FSUSB23L10X Fairchild Semiconductor, FSUSB23L10X Datasheet

FSUSB23L10X

Manufacturer Part Number

FSUSB23L10X

Description

IC USB SWITCH 2X2 10MICROPAK

Manufacturer

Fairchild Semiconductor

Datasheet

1.FSUSB23L10X.pdf (10 pages)

Specifications of FSUSB23L10X

Function

USB Switch

Circuit

1 x 2:2

On-state Resistance

10 Ohm

Voltage Supply Source

Single Supply

Voltage - Supply, Single/dual (±)

3 V ~ 3.6 V

Current - Supply

1µA

Operating Temperature

-40°C ~ 85°C

Mounting Type

Surface Mount

Package / Case

10-MicroPak™

Switch Configuration

SPDT

On Resistance (max)

7 Ohms (Typ) @ 3 V

On Time (max)

10 ns (Typ) @ 3.3 V

Off Time (max)

8 ns (Typ) @ 3.3 V

Supply Voltage (max)

3.6 V

Supply Voltage (min)

3 V

Maximum Operating Temperature

+ 85 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 40 C

Propagation Delay Time

0.25 ns (Typ) @ 3.3 V

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

FSUSB23L10X

Manufacturer:

SEMTECH

Quantity:

15 700

Company:

H&T Electronics

Part Number:

FSUSB23L10X

Quantity:

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Leng, HooiChin

E-mail: HooiChin.Leng@notes.fairchildsemi.com

Phone: 604-8502370

Implementation of change:

Expected 1st Device Shipment Date: 2009/01/02

Earliest Year/Work Week of Changed Product: 0901

Change Type Description: Die Attach Material, Mold Compound

Description of Change (From): Fairchild's Micropak packages currently assembled at

Hana-Ayutthaya using non-green mold compound and substrate materials.

Description of Change (To): Green, Halogen Free RoHS compliant packages. The Micropak

packages assembled at Hana-Ayutthaya will be Green with the changes to mold compound and

the substrate. (Note: Two mold compounds have been qualified to support the change to green

materials and based on performance, can be interchanged.) Also refer to the tables below for

comparisons of this change.

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. The reference material changes have been made to

provide a Full Green (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at:

http://www.fairchildsemi.com/company/green/index.html. Package outline drawings of the

Micropak packages will remain unchanged. Green products will be fully compliant to all

published datasheet specifications and will be interchangeable with current non-green product.

Quality and Reliability will remain at the highest standards already demonstrated with Fairchild

existing products.

Qual/REL Plan Numbers : Q20070331

Qualification :

Attached are the Reliability Test results to qualify the Green conversion of the Micropak

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: Leng, HooiChin

E-mail: HooiChin.Leng@notes.fairchildsemi.com

Phone: 604-8502370

Date Issued On : 2008/10/03

Date Created : 2008/08/05

PCN# : Q3083202

Pg. 1

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FSUSB23L10X Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Hana-Ayutthaya. Change From Change To Results/Discussion for Qual Plan Number - Q20070331 Test: (Autoclave) | Conditions: 100%RH, 121C | Standard: JESD22-A102 Lot Device Q20070331AAACLVB FSA2257L10X Q20070331BAACLVB NC7SZ125L6X Q20070331CAACLVB FHP3131IL6X Q20070331DAACLVB NC7SZ74L8X Test: (C Scanning Acoustical Microscope) | ...

Page 3

... Device Q20070331AATMCL1B FSA2257L10X Q20070331BATMCL1B NC7SZ125L6X Q20070331DATMCL1B NC7SZ74L8X Product Id Description : This change notification covers Fairchild Semiconductor Micropak 6-Lead, 8-Lead and 10-lead Micropak packages assembled at Hana. Please refer to the Affected FSID listing below for specific part numbers. Affected FSIDs : FHP3131IL6X FSA1156L6X FSA1157L6X_F087 FSA1257AL8X ...

Page 4

... NC7SV19L6X NC7SV32L6X_F115 NC7SV57L6X NC7SV58L6X_F087 NC7SV86L6X NC7SZ02L6X NC7SZ05L6X NC7SZ10L6X NC7SZ125L6X NC7SZ126L6X_F087 NC7SZ157L6X NC7SZ175L6X_F115 NC7SZ19L6X_F065 NC7SZ32L6X_F087 NC7SZ373L6X NC7SZ38L6X NC7SZ57L6X_F065 FSA4157L6X_F065 FSA5157L6X FSUSB20L10X FSUSB23L10X_F087 FSUSB30L10X_F096 FSUSB40L10X FXL2T245L10X FXL2TD245L10X FXLP34L6X_F065 NC7NP14L8X NC7NZ14L8X NC7NZU04L8X NC7S04L6X NC7S32L6X NC7SP00L6X NC7SP02L6X_F087 NC7SP05L6X NC7SP125L6X NC7SP157L6X NC7SP17L6X NC7SP34L6X NC7SP58L6X NC7SP86L6X NC7ST02L6X ...

Page 5

NC7SZ58L6X_F087 NC7SZ74L8X_F087 NC7WB66L8X NC7WP02L8X NC7WP125L8X NC7WP32L8X NC7WV07L6X_F065 NC7WV17L6X NC7WZ02L8X NC7WZ07L6X NC7WZ08L8X_F087 NC7WZ126L8X NC7WZ14L6X_F065 NC7WZ16L6X_F065 NC7WZ17L6X_F065 NC7WZ241L8X NC7WZ86L8X NC7WZU04L6X_F065 NC7SZ66L6X NC7SZ86L6X NC7WB66L8X_F087 NC7WP02L8X_F087 NC7WP14L6X NC7WV04L6X NC7WV14L6X NC7WZ00L8X NC7WZ04L6X NC7WZ07L6X_F065 NC7WZ125L8X NC7WZ132L8X NC7WZ14L6X_F087 NC7WZ16L6X_F087 NC7WZ17L6X_F087 NC7WZ32L8X NC7WZ86L8X_F087 NC7SZ74L8X NC7SZU04L6X NC7WP00L8X NC7WP08L8X NC7WP240L8X ...

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