FSUSB22QSCX Fairchild Semiconductor, FSUSB22QSCX Datasheet

IC USB SWITCH QUAD 2X1 16QSOP

FSUSB22QSCX

Manufacturer Part Number
FSUSB22QSCX
Description
IC USB SWITCH QUAD 2X1 16QSOP
Manufacturer
Fairchild Semiconductor
Type
Analog Switchr
Datasheet

Specifications of FSUSB22QSCX

Function
USB Switch
Circuit
4 x 2:1
On-state Resistance
6.5 Ohm
Voltage Supply Source
Single Supply
Voltage - Supply, Single/dual (±)
3 V ~ 3.6 V
Current - Supply
1µA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-QSOP
Multiplexer Configuration
Quad SPDT
Number Of Inputs
4
Number Of Outputs
8
Number Of Channels
4
Analog Switch On Resistance
7@3VOhm
Analog Switch Turn On Time
4.5ns
Analog Switch Turn Off Time
2.5ns
Package Type
QSOP W
Power Supply Requirement
Single
Single Supply Voltage (min)
3V
Single Supply Voltage (typ)
3V
Single Supply Voltage (max)
3.6V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Power Dissipation
0.000001W
Mounting
Surface Mount
Pin Count
16
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FSUSB22QSCXTR
FSUSB22QSCX_NL
FSUSB22QSCX_NLTR
FSUSB22QSCX_NLTR
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Lam, HH
E-mail: HH.Lam@fairchildsemi.com
Phone: 604 850 2392
Implementation of change:
Expected 1st Device Shipment Date: 2008/11/14
Earliest Year/Work Week of Changed Product: 0847
Change Type Description: Mold Compound
Description of Change (From): NMSON 8L and NQSOP 16/20/24L packages assembly at all
FSC approved manufacturing locations (Unisem) using non Green mold compound as shown in
table 1.
Description of Change (To): NMSON 8L and NQSOP 16/20/24L packages assembly at all FSC
approved manufacturing locations (Unisem) using Green mold compound as shown in table 2.
Reason for Change : 1. Current mold compound supplier has announce the discontinuance of
LSA mold compound EME6730B. Based on current run rates there is a potential for a mold
compound material shortage if this PCN is not approved within the timeframe noted above. 2.
Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is dedicated to being a
good corporate citizen. All Fairchild Semiconductor products are 2nd level interconnect
lead-free and RoHS compliance. The referenced material changes have been made to provide a
'Full Green' (Halogen Free Flame Retardant) package. For additional details on the corporate
wide green initiative please visit our Web site at :
http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same
assembly facilities producing the current non-green products. Package outline drawings of the
affected products remain un-changed. Green products will be fully compliant to all published
data sheet specifications and will be interchangeable with current non-green product. Quality
and reliability will remain at the highest standards already demonstrated with Fairchild's
existing products.
Qual/REL Plan Numbers : Q20070249
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Technical Contact:
Name: Po, Peter
E-mail: Peter.Po@notes.fairchildsemi.com
Phone: 604 850 2267
Date Issued On : 2008/08/27
Date Created : 2008/07/21
PCN# : Q3083001
Pg. 1

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FSUSB22QSCX Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Qualification : All the reliability tests defined in this qual plan completed with no failures. Therefore Unisem is qualified to assembly NMSON 8L and NQSOP 16/20/24L packages. Change From Change To Results/Discussion for Qual Plan NumberQ20070249 Test: (Autoclave) Lot Device ...

Page 3

... Test: MSL(3), PKG(Small), PeakTemp(260c), Cycles(3) (Precondition) Lot Device Q20070249AAPCNL3AB 74F543PC Product Id Description : This Final PCN covers Fairchild Semiconductor NMSON 8L and NQSOP 16/20/24L packages. For a complete listing of products covered in this PCN release, please refer to the Affected FSID listing. Affected FSIDs : 100EL11MX 100EL16M ...

Page 4

... FST3384QSCX FSUSB22QSCX GTLP1B151M FST3384QSC FSUSB22QSC GTLP2T152MX FST6800QSCX GTLP1B151MX GTLP2T152M Pg. 4 ...

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