HEF4557BP NXP Semiconductors, HEF4557BP Datasheet
HEF4557BP
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HEF4557BP Summary of contents
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... Table 1. Ordering information − ° All types operate from +85 Type number Package Name Description HEF4557BP DIP16 plastic dual in-line package; 16 leads (300 mil) HEF4557BT SO16 plastic small outline package; 16 leads; body width 3.9 mm power supply range referenced ° C Product data sheet ...
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A FF1 CP1 CP0 MR FF60 FF57 Fig 1. Logic diagram L32 L16 FF32 FF33 ...
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... NXP Semiconductors 9 A CP1 5 CP0 4 Fig 2. Functional diagram 6. Pinning information 6.1 Pinning Fig 3. Pin configuration 6.2 Pin description Table 2. Pin description table Symbol Pin L1, L2, L4, L8, L16, L32 2, 1, 15, 14, 13 CP0 4 CP1 5 DA A/B 9 HEF4557B_5 Product data sheet 1-to-64 bit variable length shift register ...
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... NXP Semiconductors Table 2. Pin description table …continued Symbol Pin Functional description [1] Table 3. Function table Inputs MR A [1] The moment D appears at Q depends on the bit-length shown don’t care; ↑ = positive-going transition; ↓ = negative-going transition; D Table 4. Bit-length select function table L32 L16 L16 continue to increment in a binary count with L32 LOW ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD I input clamping current IK V input voltage I I output clamping current OK I input/output current I/O I supply current DD T storage temperature stg ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics unless otherwise specified Symbol Parameter V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage OH V LOW-level output voltage OL I HIGH-level output current OH I LOW-level output current OL I input leakage current I I supply current ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics ° for test circuit see SS amb Symbol Parameter Conditions t HIGH to LOW CP0, CP1 PHL propagation delay see Figure see t LOW to HIGH CP0, CP1 PLH propagation delay see Figure see t transition time see Figure set-up time ...
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... NXP Semiconductors Table 8. Dynamic characteristics ° for test circuit see SS amb Symbol Parameter Conditions t recovery time MR input; rec L1 to L32 = LOW; see Figure 5 MR input; L32 = HIGH f maximum see Figure 5 max frequency [1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (C [2] The set-up, hold, and recovery times vary with the minimum number of bits selected ...
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... NXP Semiconductors 12. Waveforms V I CP0 input (CP1 LOW CP1 input (CP0 HIGH input output output V OL For measurement points see Logic levels: V and V are typical output voltage levels that occur with the output load Fig 4. Propagation delays HEF4557B_5 Product data sheet ...
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... NXP Semiconductors V I CP0 input (CP1 = CP1 input (CP0 = DA, DB input A/B input input 0 V Set-up and hold times are shown as positive values but may be specified as negative values. The shaded area indicates where data can change for predictable performance. For measurement points see Fig 5 ...
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... NXP Semiconductors negative positive a. Input waveforms b. Test circuit Test data is given in Table 11. Definitions for test circuit: Device Under Test (DUT Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z T Fig 6. Test circuit for switching times Table 11. ...
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... NXP Semiconductors 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. 1.73 mm 4.2 0.51 3.2 1.30 0.068 inches 0.17 0.02 0.13 0.051 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 14. Revision history Table 12. Revision history Document ID Release date HEF4557B_5 20091216 • Modifications: Section 9 “Recommended operating conditions” HEF4557B_4 20090916 HEF4557B_CNV_3 19950101 HEF4557B_CNV_2 19950101 HEF4557B_5 Product data sheet 1-to-64 bit variable length shift register Data sheet status Change notice Product data sheet - Δ ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 14 Revision history ...