M30626FHPGP Renesas Electronics America, M30626FHPGP Datasheet - Page 51

• Manufacturer Part Number: M30626FHPGP
• Manufacturer: Renesas Electronics America

Specifications of M30626FHPGP

• Cpu Family: M16C
• Device Core Size: 16/32Bit
• Frequency (max): 24MHz
• Interface Type: I2C/IEBus/UART
• Program Memory Type: Flash
• Program Memory Size: 384KB
• Total Internal Ram Size: 31KB
• # I/os (max): 87
• Number Of Timers - General Purpose: 11
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 3.3V
• On-chip Adc: 26-chx10-bit
• On-chip Dac: 2-chx8-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -20C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / Rohs Status: Compliant

M16C/62P Group (M16C/62P, M16C/62PT)
Rev.2.41
REJ03B0001-0241
Table 5.12
NOTES:
I
I
I
Symbol
CC
det4
det3
1. Referenced to V
2. With one timer operated using fC32.
3. This indicates the memory in which the program to be executed exists.
4. I
specified.
det
I
I
Jan 10, 2006
det4
det3
Power Supply Current
(V
Low Voltage Detection Dissipation Current
Reset Area Detection Dissipation Current
is dissipation current when the following bit is set to “1” (detection circuit enabled).
CC1
: VC27 bit in the VCR2 register
: VC26 bit in the VCR2 register
=V
Electrical Characteristics (2)
CC2
=4.0V to 5.5V)
CC1
=V
Parameter
Page 49 of 96
CC2
=4.2 to 5.5V, V
In single-chip
mode, the output
pins are open and
other pins are V
SS
= 0V at T
(4)
(4)
SS
(1)
Mask ROM
Flash
Memory
Flash Memory
Program
Flash Memory
Erase
Mask ROM
Flash Memory
Mask ROM
Flash Memory
opr
= − 20 to 85 ° C / − 40 to 85 ° C, f(BCLK)=24MHz unless otherwise
Measuring Condition
f(BCLK)=24MHz
No division, PLL operation
No division,
On-chip oscillation
f(BCLK)=24MHz,
No division, PLL operation
No division,
On-chip oscillation
f(BCLK)=10MHz,
VCC1=5.0V
f(BCLK)=10MHz,
VCC1=5.0V
f(XCIN)=32kHz
Low power dissipation
mode, ROM
f(BCLK)=32kHz
Low power dissipation
mode, RAM
f(BCLK)=32kHz
Low power dissipation
mode, Flash Memory
On-chip oscillation,
Wait mode
f(BCLK)=32kHz
Wait mode
Oscillation capability High
f(BCLK)=32kHz
Wait mode
Oscillation capability Low
Stop mode
Topr =25°C
(2)
(2)
(3)
(3)
,
,
(3)
5. Electrical Characteristics
Min.
Standard
Typ.
420
1.8
7.5
2.0
0.8
0.7
1.2
14
18
15
25
25
25
50
1
Max.
3.0
20
27
4
8
Unit
mA
mA
mA
mA
mA
mA
µ A
µ A
µ A
µ A
µ A
µ A
µ A
µ A
µ A