HEF40175BT NXP Semiconductors, HEF40175BT Datasheet
HEF40175BT
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HEF40175BT Summary of contents
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... All types operate from 40 C to +85 C. Type number Package Name HEF40175BP DIP16 HEF40175BT SO16 HEF40175BTT TSSOP16 DD Description plastic dual in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body width 3.9 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm power supply range referenced another input ...
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... NXP Semiconductors 5. Functional diagram Fig 1. Functional diagram CP MR Fig 2. Logic diagram HEF40175B Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 14 December 2010 HEF40175B Quad D-type flip-flop 001aae569 001aae571 Q3 © NXP B.V. 2010. All rights reserved ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning HEF40175B 001aae570 Fig 3. Pin configuration SOT38-4 and SOT109-1 6.2 Pin description Table 2. Pin description Symbol Pin Functional description [1] Table 3. Function table Input CP Dn H L HIGH voltage level LOW voltage level don’t care; = positive-going transition; = negative-going transition. ...
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... NXP Semiconductors 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD I input clamping current IK V input voltage I I output clamping current OK I input/output current I/O I supply current DD T storage temperature stg ...
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... NXP Semiconductors 10. Static characteristics Table 6. Static characteristics unless otherwise specified Symbol Parameter V HIGH-level input voltage IH V LOW-level input voltage IL HIGH-level output voltage LOW-level output voltage HIGH-level output current OH I LOW-level output current OL I input leakage current I I supply current ...
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... NXP Semiconductors Table 7. Dynamic characteristics = 25 C; for test circuit see amb Symbol Parameter Conditions t LOW to HIGH Qn; PLH propagation delay see MR to Qn; see t transition time see t t set-up time Dn to CP; su see t hold time Dn to CP; h see t pulse width; CP input LOW; W minimum pulse ...
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... NXP Semiconductors 12. Waveforms input input input PLH output and Propagation delays and Qn transition times CP input Dn input MR input b. Minimum pulse widths for CP and MR recovery time, and set-up and hold time for and V are typical output voltage levels that occur with the output load. ...
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... NXP Semiconductors a. Input waveforms b. Test circuit Test and measurement data is given in Definitions test circuit: DUT = Device Under Test Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance. L Fig 6. Test circuit for measuring switching times Table 9. Measurement points and test data ...
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... NXP Semiconductors 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. 1.73 mm 4.2 0.51 3.2 1.30 0.068 inches 0.17 0.02 0.13 0.051 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 14. Revision history Table 10. Revision history Document ID Release date HEF40175B v.6 20101214 • Modifications: Added type number HEF40175BTT (SOT403-1 package). HEF40175B v.5 20100105 • Modifications: Section 2 “Features and benefits” HEF40175B v.4 20090813 HEF40175B_CNV v.3 19950101 HEF40175B_CNV v.2 19950101 HEF40175B ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16. Contact information For more information, please visit: For sales office addresses, please send an email to: HEF40175B Product data sheet 15 ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Package outline ...