GE28F320C3BD70 Intel, GE28F320C3BD70 Datasheet - Page 5

• Manufacturer Part Number: GE28F320C3BD70
• Manufacturer: Intel

Specifications of GE28F320C3BD70

• Density: 32Mb
• Access Time (max): 70ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 21b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: VFBGA
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 2M
• Supply Current: 18mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

C3 Discrete
Revision History
March 2008
290645-24
Revision
05/12/98
07/21/98
10/03/98
12/04/98
12/31/98
02/24/99
06/10/99
03/20/00
04/24/00
10/12/00
10/02/01
Date of
7/20/01
2/05/02
4/05/02
3/06/03
Version
-001
-002
-003
-004
-005
-006
-007
-008
-009
-010
-011
-012
-013
-014
-016
Original version
48-Lead TSOP package diagram change
μBGA package diagrams change
32-Mbit ordering information change (Section 6)
CFI Query Structure Output Table Change (Table C2)
CFI Primary-Vendor Specific Extended Query Table Change for Optional Features and
Command Support change (Table C8)
Protection Register Address Change
I
μBGA package top side mark information clarification (Section 6)
Byte-Wide Protection Register Address change
V
V
I
Added Command Sequence Error Note (Table 7)
Datasheet renamed from 3 Volt Advanced Boot Block, 8-, 16-, 32-Mbit Flash Memory
Family.
Added t
Programming the Protection Register clarification (Section 3.4.2)
Removed all references to x8 configurations
Removed reference to 40-Lead TSOP from front page
Added Easy BGA package (Section 1.2)
Removed 1.8 V I/O references
Locking Operations Flowchart changed (Appendix B)
Added t
CFI Primary Vendor-Specific Extended Query changed (Appendix C)
Max I
Table 10, added note indicating V
Added specifications for 0.18 micron product offerings throughout document Added 64-
Mbit density
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the faster product
offering.
Changed VccMax=3.3V reference to indicate that the affected product is the 0.25μm
32Mbit device.
Minor text edits throughout document.
Added 1.8v I/O operation documentation where applicable
Added TSOP PCN ‘Pin-1’ indicator information
Changed references in 8 x 8 BGA pinout diagrams from ‘GND’ to ‘Vssq’
Added ‘Vssq’ to Pin Descriptions Information
Removed 0.4 µm references in DC characteristics table
Corrected 64Mb package Ordering Information from 48-uBGA to 48-VFBGA
Corrected ‘bottom’ parameter block sizes to on 8Mb device to 8 x 4KWords
Minor text edits throughout document
Added specifications for 0.13 micron product offerings throughout document
Corrected Iccw / Ippw / Icces /Ippes values.
Added mechanicals for 16Mb and 64Mb
Minor text edits throughout document.
Updated 64Mb product offerings.
Updated 16Mb product offerings.
Revised and corrected DC Characteristics Table.
Added mechanicals for Easy BGA.
Minor text edits throughout document.
Complete technical update.
PPD
CCS
IH
IL
Maximum Specification change (Section 4.3)
Specification change (Section 4.3)
test conditions clarification (Section 4.3)
test conditions clarification (Section 4.3)
CCD
BHWH
WHGL
changed to 25 µA
/t
(Section 4.6)
BHEH
and t
QVBL
(Section 4.6)
CC
Max = 3.3 V for 32-Mbit device
Description
Datasheet
5