GE28F320C3BD70 Intel, GE28F320C3BD70 Datasheet - Page 69
GE28F320C3BD70
Manufacturer Part Number
GE28F320C3BD70
Description
Manufacturer
Intel
Datasheet
1.GE28F320C3BD70.pdf
(70 pages)
Specifications of GE28F320C3BD70
Density
32Mb
Access Time (max)
70ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
21b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
VFBGA
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
2M
Supply Current
18mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
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C3 Discrete
Appendix E Ordering Information
Figure 23: Component Ordering Information
March 2008
290645-24
Package
TE = 48- Lead TSOP
GT = 48- Ball µBGA * CSP
GE = VF BGA CSP
RC = Easy BGA
PC = Pb Free Easy BGA
PH = Pb Free VFBGA
JS = Pb Free TSOP
Device Density
640 = x16 (64 Mbit)
320 = x16 (32 Mbit)
160 = x16 (16 Mbit)
800 = x16 (8 Mbit)
Product line designator
for all Intel
®
Flash products
T E 2 8 F 3 2 0 C 3 T C 7 0
Access Speed (ns)
(70, 80 , 90, 100 , 110 )
T = Top Blocking
B = Bottom Blocking
Product Family
C3 = 3 Volt Advanced+ Boot Block
V
V
CC
PP
Lithography
A = 0.25 µm
C = 0.18 µm
D = 0.13 µm
= 2 .7 V–3 .6 V or
= 2.7 V–3.6 V
11 . 4 V–12 .6 V
Datasheet
69
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