GE28F320C3BD70 Intel, GE28F320C3BD70 Datasheet - Page 8

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GE28F320C3BD70

Manufacturer Part Number
GE28F320C3BD70
Description
Manufacturer
Intel
Datasheet

Specifications of GE28F320C3BD70

Density
32Mb
Access Time (max)
70ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
21b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
VFBGA
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
2M
Supply Current
18mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
1.2
Datasheet
8
Conventions
The terms pin and signal are often used interchangeably to refer to the external signal
connections on the package; for chip scale package (CSP) the term ball is used.
Group Membership Brackets: Square brackets will be used to designate group
membership or to define a group of signals with similar function (i.e. A[21:1], SR[4:1])
Set: When referring to registers, the term set means the bit is a logical 1.
Clear: When referring to registers, the term clear means the bit is a logical 0.
Block: A group of bits (or words) that erase simultaneously with one block erase
instruction.
Main Block: A block that contains 32 Kwords.
Parameter Block: A block that contains 4 Kwords.
C3 Discrete
March 2008
290645-24

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