LP3927ILQX-AJ National Semiconductor, LP3927ILQX-AJ Datasheet
LP3927ILQX-AJ
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LP3927ILQX-AJ Summary of contents
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... V and V must be tied together externally. Collectively called V DD1 DD2 DD3 © 2005 National Semiconductor Corporation Key Specifications n 3.0V to 5.5V Input Voltage Range n Two 200 mA, Two 150 mA and One 100 mA LDO’s n 100 mV typ Dropout Voltage n 150 mA General-Purpose Open-drain programmable current sink for back light LED ...
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... LP3927 Pin Out Diagram (Top View) Output Current Rating and Voltage Options * denotes the voltage options that are available currently. For other options, please contact the National Semiconductor factory sales office/distributors for availability and specifications. Voltage options in the two tables cannot be mixed and matched. www.national.com ...
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... Ordering Information LP3927 Supplied as LP3927 Supplied as 1000 Units, tape and 4500 Units, tape and reel reel LP3927ILQ-AH LP3927ILQX-AH LP3927ILQ-AJ LP3927ILQX-AJ LP3927ILQ-AP LP3927ILQX-AP LP3927ILQ-AZ LP3927ILQX-AZ For LDO delay options, please refer to Electrical Characteristics Table. Standard Optional VO1 VO2 LDO delay LDO delay ...
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Pin Descriptions Pin Name 1 VO1 150 mA, LDO1 output pin. 2 EN5 LDO5 enable input. 3 EN4 LDO4 enable input. 4 EN3 LDO3 enable input. 5 RST Externally pulled high, open drain output to processor/memory reset. 6 IRQ Externally ...
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Functional Block Diagram 20037903 5 www.national.com ...
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... Absolute Maximum Ratings 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. All pins except LED_PGM, BYP, op amp’s inputs & output OP_AMP_OUT, IN-, IN+ GND to GND SLUG Junction Temperature Storage Information Soldering Temperature ...
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Electrical Characteristics, Digital Interface Symbol Parameter V Logic Low Output OL V Logic High Input IH V Logic Low Input IL I Input Leakage Current LEAKAGE Electrical Characteristics, Error Flag Symbol Parameter V Error Flag High Th-H V Error Flag ...
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Electrical Characteristics, Operational Amplifier Unless otherwise noted, V OP_AMP_VDD appearing in normal type apply for T range for operation, −40˚C to +85˚C. (Note 7) Symbol Parameter C Common-Mode Input Capacitor IN V Output Swing OUT I Supply Current S SR ...
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Typical Performance Characteristics 0.01 µ 0.2V 25˚C, Enable pin is tied OUT A PSRR vs Frequency LDO4 Enable Response (Cout=2.2µF) LDO2 (1.8V Option) Load Transient Unless otherwise specified ...
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Typical Performance Characteristics 0.01 µ 0.2V 25˚C, Enable pin is tied OUT A LDO4 (2.8V Option) Load Transient LDO2 (1.8V Option) Line Transient LDO4 (2.8V Option) Line Transient www.national.com Unless otherwise ...
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Timing Diagrams Note: Diagram indicates Open Drain IRQ tied to V *** = Internal signal 1. Keyboard de-bounce delay, 32 msec typ. 2. Delay between LDO1 reaching 95% of its output voltage and LDO2 enable, 125 µsec typical. 3. Both ...
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Timing Diagrams (Continued) Note: Diagram indicates Open Drain IRQ tied to V *** = Internal signal 1. Keyboard de-bounce delay, 32msec typ. 2. Delay between LDO1 reaching 95% of its output voltage and LDO2 enable. 3. Both LDO1 and LDO2 ...
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Timing Diagrams (Continued) Note: Diagram indicates Open Drain IRQ tied to V *** = Internal signal 1. VEXT goes active low. 2. VEXT 32 msec de-bounce period. 3. Delay between LDO1 and LDO2 enables. 4. Both LDO1 and LDO2 outputs ...
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Timing Diagrams (Continued) Note: Diagram indicates Open Drain IRQ tied to V *** = Internal signal 1. VEXT goes active low. 2. VEXT 32 msec de-bounce period. 3. Delay between LDO1 and LDO2 enable. 4. Both LDO1 and LDO2 outputs ...
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Application Hints LP3927 FUNCTION DESCRIPTION The LP3927 is designed for cellular/PCS handsets. The LDOs power the microprocessor, RF and digital sections of the phone. When a KYBD debounce of longer than detected by the LP3927, the IRQ ...
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Application Hints (Continued) surement, junction to ambient thermal resistance (θ be improved by as much as two times if a LLP is soldered on the board with thermal land and thermal vias than if not. Consider the following equation: Where ...
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... BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. ...