MC68HC11E0CFN3 Freescale Semiconductor, MC68HC11E0CFN3 Datasheet - Page 14

MC68HC11E0CFN3

Manufacturer Part Number
MC68HC11E0CFN3
Description
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC68HC11E0CFN3

Cpu Family
HC11
Device Core Size
8b
Frequency (max)
3MHz
Interface Type
SCI/SPI
Program Memory Type
ROMLess
Program Memory Size
Not Required
Total Internal Ram Size
512Byte
# I/os (max)
38
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
52
Package Type
PLCC
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC11E0CFN3
Manufacturer:
MOT
Quantity:
119
Part Number:
MC68HC11E0CFN3
0
Part Number:
MC68HC11E0CFN3R2
Manufacturer:
FREESCALE
Quantity:
1 831
General Description
1.3 Structure
See
the table accompanying
1.4 Pin Descriptions
M68HC11 E-series MCUs are available packaged in:
Most pins on these MCUs serve two or more functions, as described in the following paragraphs. Refer
to
assignments for the PLCC/CLCC, QFP, TQFP, SDIP, and DIP packages.
14
Figure
Figure 1-1
Computer operating properly (COP) watchdog system
38 general-purpose input/output (I/O) pins:
Several packaging options:
52-pin plastic-leaded chip carrier (PLCC)
52-pin windowed ceramic leaded chip carrier (CLCC)
52-pin plastic thin quad flat pack, 10 mm x 10 mm (TQFP)
64-pin quad flat pack (QFP)
48-pin plastic dual in-line package (DIP), MC68HC811E2 only
56-pin plastic shrink dual in-line package, .070-inch lead spacing (SDIP)
1-2,
16 bidirectional I/O pins
11 input-only pins
11 output-only pins
52-pin plastic-leaded chip carrier (PLCC)
52-pin windowed ceramic leaded chip carrier (CLCC)
52-pin plastic thin quad flat pack, 10 mm x 10 mm (TQFP)
64-pin quad flat pack (QFP)
48-pin plastic dual in-line package (DIP), MC68HC811E2 only
56-pin plastic shrink dual in-line package, .070-inch lead spacing (SDIP)
Figure
for a functional diagram of the E-series MCUs. Differences among devices are noted in
1-3,
Figure
Figure
1-1.
1-4,
M68HC11E Family Data Sheet, Rev. 5.1
Figure
1-5, and
Figure 1-6
which show the M68HC11 E-series pin
Freescale Semiconductor

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