MC68HC11E0CFN3 Freescale Semiconductor, MC68HC11E0CFN3 Datasheet - Page 177

MC68HC11E0CFN3

Manufacturer Part Number
MC68HC11E0CFN3
Description
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC68HC11E0CFN3

Cpu Family
HC11
Device Core Size
8b
Frequency (max)
3MHz
Interface Type
SCI/SPI
Program Memory Type
ROMLess
Program Memory Size
Not Required
Total Internal Ram Size
512Byte
# I/os (max)
38
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
52
Package Type
PLCC
Lead Free Status / Rohs Status
Not Compliant

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Chapter 11
Ordering Information and Mechanical Specifications
11.1 Introduction
This section provides ordering information for the E-series devices grouped by:
In addition, mechanical specifications for the following packaging options:
11.2 Standard Device Ordering Information
Freescale Semiconductor
52-pin plastic leaded chip carrier (PLCC)
BUFFALO ROM
No ROM
No ROM, no EEPROM
Standard devices
Custom ROM devices
Extended voltage devices
52-pin plastic-leaded chip carrier (PLCC)
52-pin windowed ceramic-leaded chip carrier (CLCC)
64-pin quad flat pack (QFP)
52-pin thin quad flat pack (TQFP)
56-pin shrink dual in-line package with .070-inch lead spacing (SDIP)
48-pin plastic DIP (.100-inch lead spacing), MC68HC811E2 only
Description
CONFIG
$0D
$0C
$0F
M68HC11E Family Data Sheet, Rev. 5.1
–40°C to +105°C
–40°C to +125°C
–40°C to +105°C
–40°C to +125°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Temperature
Frequency
2 MHz
3 MHz
2 MHz
3 MHz
2 MHz
2 MHz
2 MHz
3 MHz
2 MHz
2 MHz
MC68HC11E9BCFN2
MC68HC11E9BCFN3
MC68HC11E1MFN2
MC68HC11E0MFN2
MC68HC11E1CFN2
MC68HC11E1CFN3
MC68HC11E0CFN2
MC68HC11E0CFN3
MC68HC11E1VFN2
MC68HC11E0VFN2
MC Order Number
177

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