TE28F640J3D75 Intel, TE28F640J3D75 Datasheet - Page 12

• Manufacturer Part Number: TE28F640J3D75
• Manufacturer: Intel

Specifications of TE28F640J3D75

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 75ns
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 23/22Bit
• Operating Supply Voltage (typ): 3/3.3V
• Sync/async: Asynchronous
• Package Type: TSOP
• Program/erase Volt (typ): 2.7 to 3.6V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 8M/4Mword
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / Rohs Status: Not Compliant

3.0
3.1
Figure 4:
Notes:
1.
2.
3.
Table 1:
Datasheet
12
Package Height
Standoff
Package Body Thickness
Lead Width
Lead Thickness
Package Body Length
Package Body Width
Lead Pitch
Terminal Dimension
Lead Tip Length
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Parameter
56-Lead TSOP Package Mechanical
56-Lead TSOP Dimension Table
Package Information
56-Lead TSOP Package (32, 64, 128 Mbit)
Pin 1
Z
Detail A
Symbol
See Detail A
See Notes 1 and 3
A
A
D
D
A
b
E
e
L
c
1
2
1
L
D
D
1
C
18.200
13.800
19.800
0
0.050
0.965
0.100
0.100
0.500
Min
See Note 2
Millimeters
b
18.400
14.000
Detail B
0.995
0.500
0.150
0.150
20.00
0.600
Nom
A
E
Numonyx™ Embedded Flash Memory (J3 v. D)
18.600
14.200
20.200
A
1.200
1.025
0.200
0.200
0.700
Max
2
Seating
Plane
A
See Detail B
e
1
0.002
0.038
0.004
0.004
0.717
0.543
0.780
0.020
Min
Y
Inches
0.0197
0.039
0.006
0.006
0.724
0.551
0.787
0.024
Nom
November 2007
308551-05
0.047
0.040
0.008
0.008
0.732
0.559
0.795
0.028
Max