TE28F640J3D75

Manufacturer Part NumberTE28F640J3D75
ManufacturerIntel
TE28F640J3D75 datasheet
 


Specifications of TE28F640J3D75

Cell TypeNORDensity64Mb
Access Time (max)75nsInterface TypeParallel
Boot TypeNot RequiredAddress Bus23/22Bit
Operating Supply Voltage (typ)3/3.3VSync/asyncAsynchronous
Package TypeTSOPProgram/erase Volt (typ)2.7 to 3.6V
Operating Temp Range-40C to 85COperating Temperature ClassificationIndustrial
Operating Supply Voltage (min)2.7VOperating Supply Voltage (max)3.6V
Word Size8/16BitNumber Of Words8M/4Mword
MountingSurface MountPin Count56
Lead Free Status / Rohs StatusNot Compliant  
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Numonyx™ Embedded Flash Memory (J3 v. D)
Table 1:
56-Lead TSOP Dimension Table
Parameter
Symbol
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
3.2
Easy BGA Package (32, 64, 128 and 256 Mbit)
Figure 5:
Easy BGA Mechanical Specifications
Ball A1
Corner
D
1
2
3
4
A
B
C
D
E
F
G
H
Top View - Plastic Backside
Complete Ink Mark Not Shown
A1
A2
Table 2:
Easy BGA Package Dimensions Table (Sheet 1 of 2)
Parameter
Package Height (32, 64, 128- Mbit)
Package Height (256- Mbit)
Ball Height
Package Body Thickness (32, 64, 128- Mbit)
November 2007
308551-05
Millimeters
Min
Nom
N
56
q
Y
Z
0.150
0.250
5
6
7
8
8
7
6
A
B
C
D
E
E
F
G
H
b
Bottom View - Ball Side Up
A
Seating
Plane
Millimeters
Symb
ol
Min
Nom
A
A
A1
0.250
A2
0.780
Inches
Max
Min
Nom
56
0.100
0.004
0.350
0.006
0.010
0.014
Ball A1
Corner
S
1
5
4
3
2
1
S
2
e
Y
Inches
Note
Max
Min
Nom
s
1.200
1.300
0.0098
0.0307
Datasheet
Max
Max
0.0472
0.0512
13