K6R4016V1D-UI10 Samsung Semiconductor, K6R4016V1D-UI10 Datasheet

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K6R4016V1D-UI10

Manufacturer Part Number
K6R4016V1D-UI10
Description
Manufacturer
Samsung Semiconductor
Datasheet

Specifications of K6R4016V1D-UI10

Density
4Mb
Access Time (max)
10ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
3.3V
Address Bus
18b
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Number Of Ports
1
Supply Current
75mA
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Word Size
16b
Number Of Words
256K
Lead Free Status / Rohs Status
Compliant

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K6R4016V1D
Document Title
Revision History
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
Rev No.
Rev. 0.0
Rev. 0.1
Rev. 0.2
Rev. 0.3
Rev. 0.4
Rev. 1.0
Rev. 2.0
Rev. 2.1
Rev. 2.2
Rev. 2.3
Rev. 3.0
Rev. 4.0
256Kx16 Bit High Speed Static RAM(3.3V Operating).
Operated at Commercial and Industrial Temperature Ranges.
History
Initial release with Preliminary.
Add Low Ver.
Package dimensions modify on page 11.
Change ICC , ISB, ISB1
1. Correct AC parameters : Read & Write Cycle
2. Change Data Retention Current :
3. Limit L-Ver. to 48 TBGA Package
1. Delete 12ns,15ns speed bin.
2. Change Icc for Industrial mode.
1. Add tBA,tBLZ,tBHZ,tBW AC parematers.
1. Correct the Package dimensions(48-TBGA)
1. Add the tPU and tPD into the waveform.
1. Change the current parameters (Isb1 L-ver, Idr)
1. Add the Lead Free Package type.
1. Change the Idr parameters
Idr(2V)
Idr(3V)
I
CC(Commercial)
I
I
CC(Industrial)
CC(Industrial)
from 0.45mA to 1.1mA when Vcc=3.0V
from 0.35mA to 0.9mA when Vcc=2.0V
previous
I
1.2mA
1.8mA
SB1(L-ver.)
Item
Item
I
SB
10ns
12ns
15ns
10ns
12ns
15ns
10ns
8ns
8ns
8ns
Current
1.4mA
2.0mA
Previous
Previous
130mA
100mA
100mA
110mA
115mA
0.5mA
90mA
80mA
70mA
85mA
30mA
85mA
PRELIMPreliminaryPPPPPPPPPINARY
- 1 -
Current
Current
100mA
1.2mA
80mA
65mA
55mA
45mA
85mA
75mA
65mA
20mA
90mA
75mA
Aug. 20. 2001
Sep. 19. 2001
Sep. 28. 2001
Oct. 09. 2001
Nov.23. 2001
Dec.18. 2001
Feb. 14. 2002
Oct. 23. 2002
Mar. 10, 2003
June. 12, 2003
June. 20, 2003
Mar. 15, 2004
Draft Data
CMOS SRAM
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Final
Final
Final
Final
Final
Final
Final
Remark
Mar. 2004
Rev 4.0

Related parts for K6R4016V1D-UI10

K6R4016V1D-UI10 Summary of contents

Page 1

... K6R4016V1D Document Title 256Kx16 Bit High Speed Static RAM(3.3V Operating). Operated at Commercial and Industrial Temperature Ranges. Revision History Rev No. History Rev. 0.0 Initial release with Preliminary. Rev. 0.1 Add Low Ver. Rev. 0.2 Package dimensions modify on page 11. Rev. 0.3 Change ICC , ISB, ISB1 ...

Page 2

... K6R4016V1D 4Mb Async. Fast SRAM Ordering Information Org. Part Number K6R4004C1D-J(K)C( K6R4004V1D-J(K)C(I) 08/10 K6R4008C1D-J(K,T,U)C(I) 10 512K x8 K6R4008V1D-J(K,T,U)C(I) 08/10 K6R4016C1D-J(K,T,U,E)C(I) 10 256K x16 K6R4016V1D-J(K,T,U,E)C(I,L,P) 08/10 PRELIMPreliminaryPPPPPPPPPINARY VDD(V) Speed ( ns ) PKG 32-SOJ K : 32-SOJ(LF) 3.3 8/ 36-SOJ K : 36-SOJ(LF 44-TSOP2 3.3 8/ 44-TSOP2(LF 44-SOJ K : 44-SOJ(LF 44-TSOP2 3.3 8/ 44-TSOP2(LF 48-TBGA - 2 - CMOS SRAM Temp. & ...

Page 3

... The K6R4016V1D is a 4,194,304-bit high-speed Static Random Access Memory organized as 262,144 words by 16 bits. The K6R4016V1D uses 16 common input and output lines and has an output enable pin which operates faster than address access time at read cycle. Also it allows that lower and upper byte access by data byte control(UB, LB) ...

Page 4

... K6R4016V1D PIN CONFIGURATION (Top View SOJ/ I TSOP2 Vcc 11 Vss PIN FUNCTION Pin Name Pin Function Address Inputs Write Enable CS Chip Select OE Output Enable LB Lower-byte Control(I/O UB Upper-byte Control(I/O I/O ~ I/O Data Inputs/Outputs Power(+3.3V Ground SS N.C No Connection ABSOLUTE MAXIMUM RATINGS* ...

Page 5

... K6R4016V1D RECOMMENDED DC OPERATING CONDITIONS* Parameter Supply Voltage Ground Input High Voltage Input Low Voltage * The above parameters are also guaranteed at industrial temperature range (Min) = -2.0V a.c(Pulse Width 8ns) for I IL *** V (Max 2.0V a.c (Pulse Width AND OPERATING CHARACTERISTICS* Parameter Symbol Input Leakage Current ...

Page 6

... Output Loads(B) for 1.5V L 30pF* * Including Scope and Jig Capacitance K6R4016V1D-08 Symbol Min Max OLZ BLZ OHZ BHZ CMOS SRAM Value 3ns 1.5V See below , & t WHZ OW OLZ OHZ +3.3V 319 D OUT 353 5pF* K6R4016V1D-10 Min Max Unit Rev 4.0 Mar. 2004 ...

Page 7

... TIMING WAVEFORM OF READ CYCLE(2) Address CS UB Data out High Current SB PRELIMPreliminaryPPPPPPPPPINARY K6R4016V1D-08 Min Max WP1 WHZ (Address Controlled CS=OE (WE BLZ(4, OLZ t LZ(4, 50 CMOS SRAM K6R4016V1D-10 Min Max WE=V , UB, LB Valid Data t HZ(3,4,5) t BHZ(3,4,5) t OHZ t OH Valid Data t PD 50% Unit Rev 4.0 Mar. 2004 ...

Page 8

... K6R4016V1D NOTES(READ CYCLE high for read cycle. 2. All read cycle timing is referenced from the last valid address to the first transition address and t are defined as the time at which the outputs achieve the open circuit condition and are not referenced OHZ levels any given temperature and voltage condition, t device ...

Page 9

... K6R4016V1D TIMING WAVEFORM OF WRITE CYCLE(3) Address CS UB High-Z Data in High-Z Data out TIMING WAVEFORM OF WRITE CYCLE(4) Address CS UB High-Z Data in High-Z Data out NOTES(WRITE CYCLE) 1. All write cycle timing is referenced from the last valid address to the first transition address write occurs during the overlap of a low CS,WE,LB and UB. A write begins at the latest transition CS going low and WE going low ...

Page 10

... K6R4016V1D FUNCTIONAL DESCRIPTION means Don t Care. DATA RETENTION CHARACTERISTICS* Parameter V for Data Retention CC Data Retention Current Data Retention Set-Up Time Recovery Time * The above parameters are also guaranteed at industrial temperature range. Data Retention Characteristic is for L-ver only. DATA RETENTION WAVE FORM ...

Page 11

... K6R4016V1D PACKAGE DIMENSIONS 44-SOJ-400 #44 11.18 0.12 0.440 0.005 #1 +0.10 0.43 -0.05 +0.004 0.95 0.017 ( ) -0.002 0.0375 44-TSOP2-400BF #44 #1 18.81 0.741 18.41 0.725 0.10 0.30 0.05 0.805 ( ) 0.004 0.012 0.032 0.002 PRELIMPreliminaryPPPPPPPPPINARY 28.98 MAX 1.141 25.58 0.12 1.125 0.005 +0.10 0.71 -0.05 1 ...

Page 12

... K6R4016V1D PACKAGE DIMENSIONS Top View B #A1 Side View D Min 6. 8. 0. PRELIMPreliminaryPPPPPPPPPINARY Typ Max 0.75 - 7.00 7.10 3.75 - 9.00 9.10 5.25 - 0.45 0.50 0.90 1.00 0.55 - 0.35 0. CMOS SRAM Units : millimeter. Bottom View B 0. B/2 Detail Notes. 1. Bump counts: 48(8row x 6column) 2 ...

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