MC68HC711K4CFN3 Freescale Semiconductor, MC68HC711K4CFN3 Datasheet - Page 279

MC68HC711K4CFN3

Manufacturer Part Number
MC68HC711K4CFN3
Description
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC68HC711K4CFN3

Cpu Family
HC11
Device Core Size
8b
Frequency (max)
4MHz
Interface Type
SCI/SPI
Program Memory Type
ROM
Program Memory Size
24KB
Total Internal Ram Size
768Byte
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
On-chip Adc
8-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
84
Package Type
PLCC
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC711K4CFN3
Manufacturer:
MOLEX
Quantity:
12 000
Part Number:
MC68HC711K4CFN3
Manufacturer:
FREESCALE
Quantity:
3 181
Part Number:
MC68HC711K4CFN3
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
13.7 68-Pin Plastic Leaded Chip Carrier (Case 779)
M68HC11K Family
MOTOROLA
-L-
C
Z
K1
K
VIEW S
0.010
68
G
S
F
H
G1
T
A
R
L-M
0.007
0.007
1
-N-
S
Freescale Semiconductor, Inc.
N
M
M
S
For More Information On This Product,
T
T
L-M
L-M
S
VIEW S
V
0.007
S
0.007
Y
J
N
Go to: www.freescale.com
E
-M-
N
BRK
W
S
S
M
M
D
D
Mechanical Data
T
-T-
T
L-M
0.004
L-M
SEATING
PLANE
S
S
N
N
DIM
G1 0.910
K1 0.040
W
A
B
C
G
H
K
R
U
E
F
J
V
X
Y
Z
S
S
0.985
0.985
0.165
0.090
0.013
0.026
0.020
0.025
0.950
0.950
0.042
0.042
0.042
MIN
0.050 BSC
2
---
INCHES
0.995
0.995
0.180
0.110
0.019
0.032
0.956
0.956
0.048
0.048
0.056
0.020
0.930
MAX
68-Pin Plastic Leaded Chip Carrier (Case 779)
10
---
---
---
B
Z
U
0.007
X
VIEW D-D
NOTES:
1.
2.
3.
4.
5.
6.
7.
0.007
M
DATUMS L, M, AND N DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM T, SEATING PLANE.
DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 PER
SIDE.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012.
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC
BODY EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD FLASH,
BUT INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037. THE
DAMBAR INTRUSION(S) SHALL NOT CAUSE THE
H DIMENSION TO BE SMALLER THAN 0.025.
T
M
L-M
T
L-M
S
0.010
G1
N
S
S
N
S
S
T
Mechanical Data
L-M
Technical Data
S
N
S
279

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