HEF40193BP NXP Semiconductors, HEF40193BP Datasheet
HEF40193BP
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HEF40193BP Summary of contents
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HEF40193B 4-bit up/down binary counter Rev. 06 — 22 December 2009 1. General description The HEF40193B is a 4-bit synchronous up/down binary counter. The counter has a count-up clock input (CPU), a count-down clock input (CPD), an asynchronous parallel load ...
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... Table 1. Ordering information − ° All types operate from +85 Type number Package Name Description HEF40193BP DIP16 plastic dual in-line package; 16 leads (300 mil) HEF40193BT SO16 plastic small outline package; 16 leads; body width 3 Functional diagram Fig 1. Functional diagram HEF40193B_6 Product data sheet ° ...
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FF1 Fig 2. Logic diagram FF2 FF3 CPD ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 3. Pin configuration 6.2 Pin description Table 2. Pin description Symbol Pin 15, 1, 10, 9 CPU 5 CPD TCU 12 TCD HEF40193B_6 Product data sheet HEF40193B CPD TCD CPU 5 12 TCU 001aae581 Description parallel data input count-up clock pulse input (LOW-to-HIGH, edge-triggered) ...
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... NXP Semiconductors 7. Functional description [1] Table 3. Function table HIGH voltage level LOW voltage level don’t care; ↑ = positive-going transition. [ CPU CPD TCU TCD COUNT 0 Fig 4. Timing diagram HEF40193B_6 Product data sheet CPU CPD ↑ H ↑ Rev. 06 — 22 December 2009 HEF40193B 4-bit up/down binary counter ...
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... NXP Semiconductors Logic equations for terminal count: • • • TCU = • • • TCD = Fig 5. State diagram 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD I input clamping current IK V input voltage ...
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... NXP Semiconductors Table 5. Recommended operating conditions Symbol Parameter Δt/ΔV input transition rise and fall rate 10. Static characteristics Table 6. Static characteristics unless otherwise specified Symbol Parameter V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage OH V LOW-level output voltage ...
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... NXP Semiconductors 11. Dynamic characteristics Table 7. Dynamic characteristics ° for test circuit see SS amb Symbol Parameter Conditions t HIGH to LOW CPU to Qn; PHL propagation delay see CPD to Qn; see CPU to TCU; see CPD to TCD; see MR to Qn; see MR to TCD PL → Qn HEF40193B_6 Product data sheet Figure 7 ...
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... NXP Semiconductors Table 7. Dynamic characteristics ° for test circuit see SS amb Symbol Parameter Conditions t LOW to HIGH CPU to Qn; PLH propagation delay see CPD to Qn; see CPU to TCU; see CPD to TCD; see MR to TCU transition time see t f maximum frequency see max ...
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... NXP Semiconductors Table 7. Dynamic characteristics ° for test circuit see SS amb Symbol Parameter Conditions t set-up time Dn to PL; su see t hold time Dn to PL; h see [1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (C Table 8. ...
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... NXP Semiconductors 12. Waveforms input CPU or CPD V M input PHL V I TCU input TCD input PLH output Propagation delays and output transition times V I CPU or CPD input input input input and MR recovery times, CPU, CPD, PL and MR minimum pulse widths, and set-up and hold times ...
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... NXP Semiconductors negative positive a. Input waveforms b. Test circuit Test data is given in Table 9. Definitions for test circuit Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z T Fig 7. Test circuit for switching times Table 9. Measurement points and test data ...
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... NXP Semiconductors 13. Application information Some examples of applications for the HEF40193B are: • Up/down difference counting • Multistage ripple counting • Multistage synchronous counting D0 clock up CPU clock down CPD Fig 8. Example of cascaded HEF40193B ICs HEF40193B_6 Product data sheet TCU CPU HEF40193B HEF40193B ...
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... NXP Semiconductors 14. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. 1.73 mm 4.2 0.51 3.2 1.30 0.068 inches 0.17 0.02 0.13 0.051 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 15. Revision history Table 10. Revision history Document ID Release date HEF40193B_6 20091222 • Modifications: Section 2 “Features” • Section 9 “Recommended operating conditions” • Abbreviations section removed. HEF40193B_5 20090615 HEF40193B_4 20090505 HEF40193B_CNV_3 19950101 HEF40193B_CNV_2 19950101 HEF40193B_6 Product data sheet Data sheet status ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13 Application information Package outline ...