BGB210S NXP Semiconductors, BGB210S Datasheet

BGB210S

Manufacturer Part Number

BGB210S

Description

Manufacturer

NXP Semiconductors

Datasheet

1.BGB210S.pdf (2 pages)

Specifications of BGB210S

Lead Free Status / Rohs Status

Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

BOSTOCK HK LIMITED

Part Number:

BGB210S

Manufacturer:

Company:

BOSTOCK HK LIMITED

Part Number:

BGB210S201UM

Manufacturer:

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

BGB210SB01UM

Quantity:

1 472

Company:

Meier Automation Equipment Co., Limited

Part Number:

BGB210SB01UM

Manufacturer:

Quantity:

20 000

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Download datasheet (124Kb)

Miniature, low-power Bluetooth 2.0 + EDR

This complete solution, designed for a range of mobile applications, provides faster

data transfer and offers the industry’s lowest power consumption in the smallest footprint.

It also supports coexistence with 802.11 WLAN.

Key features

Ñ Complete, fully tested Bluetooth Class 2-compliant solution

Ñ Ultra-small TFBGA44 package (3.0 x 5.0 x 1.15 mm)

Ñ Operating temperature range of -40 to 85 °C

Ñ Highly integrated, all-CMOS solution

Ñ Low power consumption

Ñ Small application PCB footprint (35 mm

Ñ Supports large range of system clocks

Ñ Built-in fractional clock divider supports CDMA, WCDMA,

Ñ ROM code patch facility to support software updates

Ñ Coexists with 802.11 WLAN

- Supports Bluetooth 2.0 + EDR

- Minimum number of external components required

- Low total cost of ownership

- Only external RF fi lter and a few non-RF-critical

- ARM7 processor with on-chip RAM and ROM

- System interfaces (UART, PCM, WLAN coexistence PTA)

- Advanced N-ZIF RF transceiver architecture

- Sensitivity -89 dBm (typical value, measured at IC)

- Output power +2 dBm (typical value, measured at IC)

- Single 1.8 V power supply

- HV3 mode:

- Sniff 1.28s (master): 127 μA

- System off

GSM, GPRS, etc.

components required

14 mA

5 μA

)

NXP Bluetooth

EDR solution BGB210S

Applications

Ñ Cell phones, smartphones, and other mobile devices

Ñ Cordless phones

The NXP BGB210S is a fourth-generation solution for

Bluetooth 2.0 + EDR (Enhanced Data Rate) wireless

connectivity. It provides complete, plug-and-play Bluetooth

2.0 + EDR operation in a low-cost package that measures

only 15 mm

Optimized for hosted and embedded applications,

the BGB210S reduces board space, lowers overall cost,

and speeds time-to-market for mobile applications including

cell phones, smartphones, cordless phones, and PDAs.

With its high level of system functionality, the BGB210S

delivers quicker design cycles, lower risk, simplifi ed

manufacturing, and a reduced bill of materials. The small,

single-package format also minimizes the total cost of

ownership by simplifying assembly and test and reducing

yield loss.

2.0 +

Related parts for BGB210S

BGB210S Summary of contents

Page 1

... BGB210S reduces board space, lowers overall cost, and speeds time-to-market for mobile applications including cell phones, smartphones, cordless phones, and PDAs. With its high level of system functionality, the BGB210S delivers quicker design cycles, lower risk, simplifi ed manufacturing, and a reduced bill of materials. The small, ...

Page 2

... Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Low power consumption For very low-power Bluetooth operation in mobile phones, the BGB210S uses a single 1.8 V supply. Power consumption in voice (HV3) mode is only 14 mA, in Sniff 1.28s mode is only 127μA, and during System Off mode is less than 5 μA. ...

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