TDA8263HN/C1.118 NXP Semiconductors, TDA8263HN/C1.118 Datasheet

TDA8263HN/C1.118

Manufacturer Part Number
TDA8263HN/C1.118
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA8263HN/C1.118

Lead Free Status / Rohs Status
Compliant
1. General description
The direct conversion QPSK demodulator is the front-end receiver dedicated to digital TV
broadcasting, satisfying both DVB-S and DBS TV standards. The wide range oscillator
(from 950 MHz to 2175 MHz) covers the American, European and Asian satellite bands,
as well as the SMA-TV US standard.
The Zero-IF (ZIF) concept discards traditional IF filtering and intermediate conversion
techniques.
Gain-controlled amplifiers in the RF guarantee optimum signal level. The variable gain is
controlled by the signal returned from the Satellite Demodulator and Decoder (SDD) and
applied to pin AGC.
The integrated LNA allows the IC to be directly connected to the LNB output. The LNA can
be by-passed by an I
order to handle higher input signal levels of up to 0 dBm per channel.
Connected at the RF input, an RMS level detector provides through I
the full band input signal level.
The LO quadrature outputs are derived from a high performance integrated LC oscillator.
Its frequency is:
integrated LC oscillator which controls the LO frequency, the synthesizer offers a good
performance for phase noise in the satellite band. The step size of the LO output
frequency is equal to the comparison frequency.
Control data is entered via the I
compatibility with most of existing microcontrollers.
An 8-byte frame is required to address the device and to program the main divider ratio,
the reference divider ratio, the charge-pump current and the operating mode.
A flag is set when the loop is in-lock, readable during read operations, as well as the
Power-on reset flag and RF input level.
The device has four selectable I
selects an address. This feature gives the possibility to use up to four TDA8263HN ICs in
the same system.
TDA8263HN
Fully integrated satellite tuner
Rev. 01 — 14 December 2004
-------- -
f
N
LO
2
=
C-bus selectable attenuation, providing a 20 dB extra attenuation in
-------------- -
f
XTAL
R
. Thanks to the low phase noise performance of the
2
2
C-bus. The bus can be either 5.0 V or 3.3 V, allowing
C-bus addresses. Applying a specific voltage to pin AS
Product data sheet
2
C-bus read mode

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TDA8263HN/C1.118 Summary of contents

Page 1

TDA8263HN Fully integrated satellite tuner Rev. 01 — 14 December 2004 1. General description The direct conversion QPSK demodulator is the front-end receiver dedicated to digital TV broadcasting, satisfying both DVB-S and DBS TV standards. The wide range oscillator (from ...

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Philips Semiconductors 2. Features Direct conversion QPSK and 8PSK demodulation (ZIF) 3 supply voltage ( required) 950 MHz to 2175 MHz frequency range High range input level dBm (20 dB attenuation configuration). Low ...

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Philips Semiconductors Table 1: Symbol N osc SNF SB AGC T amb [1] The product is qualified with an output voltage of 550 mV (p-p) differential, however larger values can be used at baseband outputs that might have impact on ...

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Philips Semiconductors 7. Block diagram 4 V CC(LNA) 2 GND(LNA) LNA 3 RFIN ATT 7 V CC(RF) 5 GND(RF) 1 LEVEL 3 DETECTOR 1 GND(DIE I/Q outputs wide band integrated 3, 2 oscillator 6 n. ...

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Philips Semiconductors 8. Pinning information 8.1 Pinning Fig 2. Pin configuration 8.2 Pin description Table 3: Symbol GND(DIE) GND(LNA) RFIN V CC(LNA) GND(RF) n.c. V CC(RF) PORT0 AGC V CC(BB GND(BB CAPVCO 9397 750 ...

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Philips Semiconductors Table 3: Symbol V CC(VCO) VT GND(VCO CC(PLL) GND(PLL) XTOUT XT XTN V CC(DIG) SDA SCL GND(DIG) PORT1 9. Tuner configuration Fig 3. Tuner configuration 10. Functional description The TDA8263HN contains the core of the RF ...

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Philips Semiconductors The internal loop controls a fully integrated VCO, to cover the range from 950 MHz to 2175 MHz. This VCO provides both in phase and quadrature signals to drive the two mixers. The output of the 15-bit programmable ...

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Philips Semiconductors Pins used for the I • Pin SCL is the clock input • Pin SDA is the data input/output • Pin AS is for address selection. 11.2 Address selection Table 4: Voltage on pin ...

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Philips Semiconductors 2 11.6 I C-bus table in write mode (default at POR) Table 8: Subaddress (hex [1] X means don’t care. 11.7 Bit description I Table 9: Bit PDXTOUT ...

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Philips Semiconductors Table 11: These bits are also called Dword: It determines the ratio between LO frequency and VCO frequency. The bits are used for the calibration protocol of the internal VCO ...

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Philips Semiconductors Table 14: The register selects the cut-off frequency of the RX baseband filter. The cut-off frequency can be set from 5 MHz to 36 MHz in 32 steps of 1 MHz FC4 ...

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Philips Semiconductors Table 15: These bits control the additional gain of the baseband between 0 dB and 9dB BBGAIN3 [1] Typical values at nominal ...

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Philips Semiconductors Table 19: These bits force the inputs of the second loop charge pump. This test could be used to force the LO VCO at its maximum or minimum tuning voltage. CP2TST Table 20: Table 21: ...

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Philips Semiconductors Table 25: These bits control the voltage threshold for the ACDN comparator. The ACUP and ACDN comparators sense the LC VCO tuning voltage at pin VT. SELVTL1 [1] Typical values at nominal process and ...

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Philips Semiconductors Table 30: LOCK 0 1 Table 31: ACUP 0 1 Table 32: ACDN 0 1 Table 33: ERRORCAL Action 0 1 Table 34: This register gives the RF input level in dBm INLEVEL1 [1] ...

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Philips Semiconductors 12. Internal circuitry Table 36: Symbol RFIN PORT0 AGC 9397 750 13193 Product data sheet Internal circuitry Pin Equivalent circuit Rev. 01 — 14 December 2004 TDA8263HN Fully integrated ...

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Philips Semiconductors Table 36: Symbol CAPVCO VT CP 9397 750 13193 Product data sheet Internal circuitry …continued Pin Equivalent circuit Rev. 01 — 14 December 2004 TDA8263HN Fully integrated satellite tuner ...

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Philips Semiconductors Table 36: Symbol XTOUT XT XTN SDA SCL PORT1 9397 750 13193 Product data sheet Internal circuitry …continued Pin Equivalent circuit GND(DIG) Rev. 01 — 14 December 2004 TDA8263HN Fully integrated satellite ...

Page 19

Philips Semiconductors 13. Limiting values Table 37: In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol amb T stg esd [1] Maximum ratings cannot be exceeded, not even ...

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Philips Semiconductors Table 39: Characteristics …continued 3.3 V; output level on differential I/Q output is 550 mV (p-p); unless otherwise specified. amb CC Symbol Parameter RF and Baseband LO LO leakage through RF inputs ...

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Philips Semiconductors Table 39: Characteristics …continued 3.3 V; output level on differential I/Q output is 550 mV (p-p); unless otherwise specified. amb CC Symbol Parameter N oscillator phase noise in the osc satellite band ...

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Philips Semiconductors Unwanted signal: RF1 is 1040 MHz and P on the output pins is P2. IM3 ---------- - [3] IIP = 23 + [dBm], see Figure Wanted signal: RF1 MHz, P Unwanted ...

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Philips Semiconductors 17. Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 0.85 mm terminal 1 index area terminal 1 index area ...

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Philips Semiconductors 18. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However completely safe desirable to take normal precautions appropriate to handling integrated circuits. 19. Soldering 19.1 Introduction to soldering surface ...

Page 25

Philips Semiconductors • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to ...

Page 26

Philips Semiconductors [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may ...

Page 27

Philips Semiconductors 21. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

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Philips Semiconductors 26. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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