74HCT14D NXP Semiconductors, 74HCT14D Datasheet

Inverters HEX INV SCHMITT TRIG

74HCT14D

Manufacturer Part Number
74HCT14D
Description
Inverters HEX INV SCHMITT TRIG
Manufacturer
NXP Semiconductors
Datasheet

Specifications of 74HCT14D

Number Of Circuits
6
Logic Family
74HCT
Logic Type
CMOS
High Level Output Current
- 4 mA
Low Level Output Current
4 mA
Propagation Delay Time
17 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Package / Case
SOT-108
Mounting Style
SMD/SMT
Operating Supply Voltage
4.5 V to 5.5 V
Lead Free Status / Rohs Status
 Details
Other names
74HCT14D,652

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1. General description
2. Features and benefits
3. Applications
The 74HC14; 74HCT14 is a high-speed Si-gate CMOS device and is pin compatible with
Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard
No. 7A.
The 74HC14; 74HCT14 provides six inverting buffers with Schmitt-trigger action. They are
capable of transforming slowly changing input signals into sharply defined, jitter-free
output signals.
74HC14; 74HCT14
Hex inverting Schmitt trigger
Rev. 4 — 17 January 2011
Low-power dissipation
ESD protection:
Multiple package options
Specified from −40 °C to +85 °C and from −40 °C to +125 °C
Wave and pulse shapers
Astable multivibrators
Monostable multivibrators
HBM EIA/JESD22-A114F exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V
Product data sheet

Related parts for 74HCT14D

74HCT14D Summary of contents

Page 1

Hex inverting Schmitt trigger Rev. 4 — 17 January 2011 1. General description The 74HC14; 74HCT14 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL specified in compliance with JEDEC ...

Page 2

... Ordering information Table 1. Ordering information Type number Package Temperature range −40 °C to +125 °C 74HC14N 74HCT14N −40 °C to +125 °C 74HC14D 74HCT14D −40 °C to +125 °C 74HC14DB 74HCT14DB −40 °C to +125 °C 74HC14PW 74HCT14PW −40 °C to +125 °C 74HC14BQ 74HCT14BQ 5. Functional diagram ...

Page 3

... NXP Semiconductors 6. Pinning information 6.1 Pinning GND 7 Fig 4. Pin configuration DIP14, SO14 and (T)SSOP14 6.2 Pin description Table 2. Pin description Symbol Pin 11 10, 12 GND Functional description [1] Table 3. Function table Input [ HIGH voltage level LOW voltage level. 74HC_HCT14 Product data sheet 001aac498 Fig 5 ...

Page 4

... NXP Semiconductors 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK I output clamping current OK I output current O I supply current CC I ground current ...

Page 5

... NXP Semiconductors 10. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74HC14 V HIGH-level output voltage = −20 μ −20 μ −20 μ −4.0 mA −5.2 mA LOW-level output voltage = 20 μ μ μ 4.0 mA 5.2 mA input leakage ...

Page 6

... NXP Semiconductors 11. Dynamic characteristics Table 7. Dynamic characteristics GND = pF; for load circuit see L Symbol Parameter Conditions 74HC14 t propagation delay nA to nY; see transition time see power dissipation per package capacitance 74HCT14 t propagation delay nA to nY; see transition time power dissipation per package; PD capacitance V I [1] ...

Page 7

... NXP Semiconductors 12. Waveforms Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 6. Input to output propagation delays Table 8. Measurement points Type Input V M 74HC14 0.5V CC 74HCT14 1.3 V Test data is given in Table Definitions test circuit: ...

Page 8

... NXP Semiconductors Table 9. Test data Type Input V I 74HC14 V CC 74HCT14 3.0 V 13. Transfer characteristics Table 10. Transfer characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); see Symbol Parameter Conditions 74HC14 V positive-going threshold voltage negative-going V = 2.0 V T− ...

Page 9

... NXP Semiconductors (μ 0 Fig 10. Typical 74HC transfer characteristics 74HC_HCT14 Product data sheet mna846 1.2 1.6 2.0 V ( (mA) 0.8 0.6 0.4 0 1.2 2.4 3.6 All information provided in this document is subject to legal disclaimers. Rev. 4 — 17 January 2011 74HC14; 74HCT14 Hex inverting Schmitt trigger 1 ...

Page 10

... NXP Semiconductors 1 (mA) 1.2 0.9 0 Fig 11. Typical 74HCT transfer characteristics 15. Application information The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula add P = additional power dissipation (μW); add f = input frequency (MHz); ...

Page 11

... NXP Semiconductors (1) Positive-going edge. (2) Negative-going edge. Fig 12. Average additional supply current as a function (1) Positive-going edge. (2) Negative-going edge. Fig 13. Average additional supply current as a function 0. 74HC_HCT14 Product data sheet 400 I CC(AV) (μA) 300 200 positive - going edge 100 400 I CC(AV) (μ ...

Page 12

... NXP Semiconductors 1 ≈ --------------------- f = For 74HC14 ≈ ------------------------ f = For 74HCT14: T 0.67 RC Fig 14. Relaxation oscillator 74HC_HCT14 Product data sheet R C mna035 1 × 1 × All information provided in this document is subject to legal disclaimers. Rev. 4 — 17 January 2011 74HC14; 74HCT14 Hex inverting Schmitt trigger © NXP B.V. 2011. All rights reserved. ...

Page 13

... NXP Semiconductors 16. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...

Page 14

... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

Page 15

... NXP Semiconductors SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT337-1 Fig 17. Package outline SOT337-1 (SSOP14) ...

Page 16

... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

Page 17

... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...

Page 18

... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Minimum values propagation delay and transition time moved to maximum value column (errata) ...

Page 19

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 20

... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 20. Contact information For more information, please visit: For sales office addresses, please send an email to: 74HC_HCT14 Product data sheet 19 ...

Page 21

... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Transfer characteristics ...

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