FM18L08-70-S Ramtron, FM18L08-70-S Datasheet

F-RAM 256K (32Kx8) 70ns 3V

FM18L08-70-S

Manufacturer Part Number
FM18L08-70-S
Description
F-RAM 256K (32Kx8) 70ns 3V
Manufacturer
Ramtron
Datasheet

Specifications of FM18L08-70-S

Memory Size
256 KB
Organization
32 K x 8
Interface
Parallel
Access Time
70 ns
Operating Supply Voltage
3 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
SOIC-28
Mounting Style
SMD/SMT
Lead Free Status / Rohs Status
No

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FM18L08
256Kb Bytewide FRAM Memory
Features
256K bit Ferroelectric Nonvolatile RAM
Superior to Battery-Backed SRAM
Description
The FM18L08 is a 256-kilobit nonvolatile memory
employing an advanced ferroelectric process. A
ferroelectric random access memory or FRAM is
nonvolatile and reads and writes like a RAM. It
provides data retention for 45 years while eliminating
the reliability concerns, functional disadvantages and
system design complexities of battery-backed SRAM
(BBSRAM). Fast write timing and high write
endurance make FRAM superior to other types of
nonvolatile memory.
In-system operation of the FM18L08 is very similar
to other RAM based devices. Read cycle and write
cycle times are equal. The FRAM memory, however,
is nonvolatile due to its unique ferroelectric memory
process. Unlike BBSRAM, the FM18L08 is a truly
monolithic nonvolatile memory. It provides the same
functional benefits of a fast write without the
disadvantages associated with modules and batteries
or hybrid memory solutions.
These capabilities make the FM18L08 ideal for
nonvolatile memory applications requiring frequent
or rapid writes in a bytewide environment. The
availability of a surface-mount package improves the
manufacturability of new designs, while the DIP
package facilitates simple design retrofits. Device
specifications are guaranteed over a temperature
range of -40°C to +85°C.
This product conforms to specifications per the terms of the Ramtron
standard warranty. The product has completed Ramtron’s internal
qualification testing and has reached production status.
Rev. 3.5
Sept. 2009
Organized as 32,768 x 8 bits
45 year Data Retention
Unlimited Read/Write Cycles
NoDelay™ Writes
Advanced High-Reliability Ferroelectric Process
No Battery Concerns
Monolithic Reliability
True Surface Mount Solution, No Rework Steps
Superior for Moisture, Shock, and Vibration
Resistant to Negative Voltage Undershoots
SRAM & EEPROM Compatible
Low Power Operation
Industry Standard Configuration
* End of life. Last time buy Nov. 2009.
FM18L08-70-TG *
FM18L08-70-S *
FM18L08-70-P *
FM18L08-70-SG *
FM18L08-70-PG *
Pin Configurations
VDD
A11
A13
A14
A12
WE
NC
OE
NC
A9
A8
A7
A6
A5
A4
A3
JEDEC 32Kx8 SRAM & EEPROM pinout
70 ns Access Time
140 ns Cycle Time
3.0V to 3.65V Operation
15 mA Active Current
15 A Standby Current
Industrial Temperature -40 C to +85 C
32-pin “Green” TSOP Package
28-pin SOIC or DIP Package
“Green” Packaging Options
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
1850 Ramtron Drive, Colorado Springs, CO 80921
Ordering Information
70 ns access, 32-pin “Green” TSOP
70 ns access, 28-pin SOIC
70 ns access, 28-pin DIP
70 ns access, 28-pin “Green” SOIC
70 ns access, 28-pin “Green” DIP
Ramtron International Corporation
TSOP-I
(800) 545-FRAM, (719) 481-7000
http://www.ramtron.com
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1 of 13
NC
A10
CE
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
NC

Related parts for FM18L08-70-S

FM18L08-70-S Summary of contents

Page 1

... FM18L08-70- access, 32-pin “Green” TSOP FM18L08-70 access, 28-pin SOIC FM18L08-70 access, 28-pin DIP FM18L08-70- access, 28-pin “Green” SOIC FM18L08-70- access, 28-pin “Green” DIP * End of life. Last time buy Nov. 2009. Ramtron International Corporation 1850 Ramtron Drive, Colorado Springs, CO 80921 (800) 545-FRAM, (719) 481-7000 http://www ...

Page 2

... Address changes that occur after /CE goes low will be ignored until the next falling edge occurs. /OE Input Output Enable: Asserting /OE low causes the FM18L08 to drive the data bus when valid data is available. Deasserting /OE high causes the DQ pins to be tri-stated. /WE Input Write Enable: Asserting /WE low causes the FM18L08 to write the contents of the data bus to the address location latched by the falling edge of /CE ...

Page 3

... All data written to the part is immediately nonvolatile with no delay. Functional operation of the FRAM memory is the same as SRAM type devices, except the FM18L08 requires a falling edge of /CE to start each memory cycle. Memory Operation Users access 32,768 memory locations each with 8 data bits through a parallel interface ...

Page 4

... Figure 2 below. Also shown is a common SRAM signal relationship that will not work for the FM18L08. The reason for /CE to strobe for each address is two- fold: it latches the new address and creates the necessary precharge period while /CE is high. ...

Page 5

... MCU/MPU pin tri-states during the reset condition. The pullup resistor value should be chosen to ensure the /CE pin tracks V a high enough value that the current drawn when /CE is low is not an issue. level. DD MCU/ MPU Figure 3. Use of Pullup Resistor on /CE DD FM18L08 yet FM18L08 A(14: ...

Page 6

... Sept. 2009 Description SS SS (JEDEC Std JESD22-A114-B) (JEDEC Std JESD22-A115-A) = 3.0V to 3.65V) DD Min Typ 3 2.0 -0.5 2.4 = -1.0 mA 3.2 mA) FM18L08 Ratings -1.0V to +5.0V -1.0V to +5.0V and V IN < V + +125 C 300 C 4kV 400V MSL-1 (SOIC/DIP) MSL-2 (TSOP) Max Units Notes 3. 400 ...

Page 7

... I/O C Input Capacitance IN Rev. 3.5 Sept. 2009 = 3.0V to 3.65V) DD Min 70 140 3.0V to 3.65V) DD Min 70 70 140 Min Units 45 Years = 3.0V to 3.65V) DD Min Units 1 S (min 3.3V) DD Max Units FM18L08 Max Units Notes 70 ns 2,000 Max Units Notes 2,000 Notes 1 Notes Notes ...

Page 8

... AC Test Conditions Input Pulse Levels Input rise and fall times Input and output timing levels Read Cycle Timing CE A0-14 OE DQ0-7 Write Cycle Timing - /CE Controlled Timing CE A0- DQ0-7 Rev. 3.5 Sept. 2009 Equivalent AC Load Circuit 0 0 1.5V Output FM18L08 1.3V 3300 OHZ ...

Page 9

... Write Cycle Timing - /WE Controlled Timing CE A0- DQ0-7 out DQ0-7 in Power Cycle Timing VDD CE Rev. 3.5 Sept. 2009 VDD min FM18L08 VDD min ...

Page 10

... XXXX= part number, S=speed (-70), P= package type (-SG) R=rev code, YY=year, WW=work week, LLLLLL= lot code B rev., Year 2006, Work Week 30, Lot code 50013G RAMTRON FM18L08-70-SG B063050013G FM18L08 0.25 0.75 0. 0.10 0.40 1 ...

Page 11

... BSC 0.005 min. DIP Package Marking Scheme Legend: RAMTRON XXXXXXX-S-P RYYWWLLLLLLL Example: FM18L08, 70ns speed, “Green” DIP package, Rev. 3.5 Sept. 2009 1.380 1.565 0.014 0.022 XXXX= part number, S=speed (-70), P= package type (-PG) R=rev code, YY=year, WW=work week, LLLLLL= lot code B rev ...

Page 12

... TSOP Package Marking Scheme Legend: XXXXXX= part number, SP= speed/package (-70TG) R=rev code, YY=year, WW=work week, LLLLLL= lot code RAMTRON XXXXXXX-SP YYWWLLLLLL Example: FM18L08-70-TG, “green” TSOP package, RAMTRON FM18L08-70TG B065160012T2 Rev. 3.5 Sept. 2009 B rev., Year 2006, Work Week 51, Lot 60012T2 ...

Page 13

... Added recommendation on CE pin during power cycles. Added TSOP packaging option. Updated TSOP MSL rating. Redraw package outlines, added marking scheme to SOIC/DIP. Extended data retention to 45 years based on recent test results. Not Recommended for New Designs. Last time buy Nov. 2009 alternative, use the FM28V020 device. FM18L08 ...

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