HY27US08281A-TPCB Hynix, HY27US08281A-TPCB Datasheet

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HY27US08281A-TPCB

Manufacturer Part Number
HY27US08281A-TPCB
Description
Flash Mem Parallel 3.3V 128M-Bit 16M x 8 10us 48-Pin TSOP-I
Manufacturer
Hynix
Datasheet

Specifications of HY27US08281A-TPCB

Package
48TSOP-I
Cell Type
NAND
Density
128 Mb
Architecture
Sectored
Block Organization
Symmetrical
Typical Operating Supply Voltage
3.3 V
Sector Size
16KByte x 1024
Support Of Page Mode
Yes
Timing Type
Asynchronous
Operating Temperature
0 to 70 °C
Interface Type
Parallel

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Document Title
128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Memory
Revision History
Rev 0.6 / Nov. 2005
Revision
No.
0.0
0.1
0.2
Initial Draft.
1) Correct Summary description & page.7
- The Cache feature is deleted in summary description.
- Note.3 is deleted. (page.7)
2) Correct table.5 & Table.12
3) Correct TSOp1, WSOP1 Pin description
- 38th pin has been changed Lockpre
4) Add Bad Block Management & System Interface using CE don’t care
5) Change TSOP1, WSOP1, FBGA package dimension & figures.
- Change TSOP1, WSOP1, FBGA package mechanical data
- Change TSOP1, WSOP1 package figures
1) LOCKPRE is changed to PRE.
- Texts, Tables and figures are changed.
2) Change Command Set
- READ A and B are changed to READ 1.
- READ C is changed to READ 2.
3) Change AC, DC characterics
- tRB, tCRY, tCEH and tOH are added.
4) Correct Program time (max)
- before : 700us
- after
5) Edit figures
- Address names are changed.
6) Change AC characterics
Before
After
: 500us
tRP
30
25
History
tREA
128Mbit (16Mx8bit / 8Mx16bit) NAND Flash
35
30
HY27US(08/16)281A Series
Nov. 29. 2004
Mar. 03. 2005
Draft Date
Sep. 2004
Preliminary
Preliminary
Preliminary
Remark
1

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HY27US08281A-TPCB Summary of contents

Page 1

Document Title 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Memory Revision History Revision No. 0.0 Initial Draft. 1) Correct Summary description & page.7 - The Cache feature is deleted in summary description. - Note.3 is deleted. (page.7) 2) Correct table.5 & ...

Page 2

Revision History Revision No. 1) Change AC Characteristics (1.8V device) tRC tRP Before 50 25 After Change AC Parameter Before 0.3 After 3) Add Read ID Table 4) Edit Automatic Read at Power On & Power On/Off ...

Page 3

... VCC = 2.7 to 3.6V Memory Cell Array = (512+16) Bytes x 32 Pages x 1,024 Blocks = (256+8) Words x 32 pages x 1,024 Blocks PAGE SIZE - x8 device : (512 + 16 spare) Bytes : HY27US08281A - x16 device: (256 + 8 spare) Words : HY27US16281A BLOCK SIZE - x8 device: (16K + 512 spare) Bytes - x16 device: (8K + 256 spare) Words PAGE READ / PROGRAM - Random access: 10us (max ...

Page 4

... This device includes also extra features like OTP/Unique ID area, Block Lock mechanism, Automatic Read at Power Up, Read ID2 extension. The Hynix HY27US(08/16)281A series is available TSOP1 mm USOP1 mm. 1.1 Product List PART NUMBER HY27US08281A HY27US16281A Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash ORIZATION ...

Page 5

IO15 - IO8 IO7 - IO0 CLE ALE CE# RE# WE# WP# RB# Vcc Vss NC PRE Rev 0.6 / Nov. 2005 HY27US(08/16)281A Series 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure1: Logic Diagram Data Input / Outputs (x16 Only) Data ...

Page 6

Figure 2. 48TSOP1 Contactions, x8 and x16 Device Figure 3. 48USOP1 Contactions, x8 and x16 Device Rev 0.6 / Nov. 2005 HY27US(08/16)281A Series 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash 6 ...

Page 7

PIN DESCRIPTION Pin Name DATA INPUTS/OUTPUTS IO0-IO7 The IO pins allow to input command, address and data and to output data during read / program IO8-IO15(1) operations. The inputs are latched on the rising edge of Write Enable (WE#). ...

Page 8

IO0 1st Cycle A0 2nd Cycle A9 3rd Cycle A17 NOTE must be set to Low set to LOW or High by the 00h or 01h Command. IO0 1st Cycle A0 2nd Cycle A9 3rd ...

Page 9

CLE ALE CE ( NOTE: 1. With ...

Page 10

BUS OPERATION There are six standard bus operations that control the device. These are Command Input, Address Input, Data Input, Data Output, Write Protect, and Standby. Typically glitches less than Chip Enable, Write Enable and Read ...

Page 11

DEVICE OPERATION 3.1 Page Read. Upon initial device power up, the device defaults to Read1 mode. This operation is also initiated by writing 00h to the command register along with followed by the three address input cycles. Once the ...

Page 12

Block Erase. The Erase operation is done on a block (16K Byte) basis. It consists of an Erase Setup command (60h), a Block address loading and an Erase Confirm Command (D0h). The Erase Confirm command (D0h) following the block ...

Page 13

Read Status Register. The device contains a Status Register which may be read to find out whether read, program or erase operation is com- pleted, and whether the program or erase operation is completed successfully. After writing 70h command ...

Page 14

OTHER FEATURES 4.1 Data Protection & Power On/Off Sequence The device is designed to offer protection from any involuntary program/erase during power-transitions. An internal voltage detector disables all functions whenever Vcc is below about 2.0V (3.3V device). WP# pin ...

Page 15

Unlock - Command Sequence: Unlock block Command (23h) + Start block address + Command (24h) + End block address. See Fig. 19. - Unlocked blocks can be programmed or erased unlocked block’s status can be changed to ...

Page 16

Parameter Symbol Valid Block Number Symbol Ambient Operating Temperature (Commercial Temperature Range) T Ambient Operating Temperature (Extended Temperature Range) A Ambient Operating Temperature (Industrial Temperature Range) T Temperature Under Bias BIAS T Storage Temperature STG (2) Input or Output Voltage ...

Page 17

Rev 0.6 / Nov. 2005 HY27US(08/16)281A Series 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 4: Block Diagram 17 ...

Page 18

Parameter Sequential Read Operating Current Program Erase Stand-by Current (TTL) Stand-by Current (CMOS) Input Leakage Current Output Leakage Current Input High Voltage Input Low Voltage Output High Voltage Level Output Low Voltage Level Output Low Current (RB#) Table 8: DC ...

Page 19

Item Input / Output Capacitance Input Capacitance Table 10: Pin Capacitance (TA=25C, F=1.0MHz) Parameter Program Time Dummy Busy Time for the Lock or Lock-tight Block Number of partial Program Cycles in the same page Block Erase Time Table 11: Program ...

Page 20

Parameter CLE Setup time CLE Hold time CE# setup time CE# hold time WE# pulse width ALE setup time ALE hold time Data setup time Data hold time Write Cycle time WE# High hold time Data Transfer from Cell to ...

Page 21

... Pagae IO Program 0 Pass / Fail Ready/Busy 6 Ready/Busy 7 Write Protect DEVICE IDENTIFIER BYTE 1st 2nd Part Number HY27US08281A HY27US16281A Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Block Read Erase Pass / Fail Ready/Busy Ready/Busy Ready/Busy Ready/Busy Write Protect Write Protect Table 13: Status Register Coding ...

Page 22

Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Table 16: Lock Status Code Figure 5: Command Latch Cycle HY27US(08/16)281A Series 22 ...

Page 23

Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 6: Address Latch Cycle HY27US(08/16)281A Series 23 ...

Page 24

CE RE I/Ox R/B Notes : Transition is measured ±200mV from steady state voltage with load. This parameter is sampled and not 100% tested. Figure 8: Sequential Out Cycle after Read (CLE=L, WE#=H, ALE=L) Rev 0.6 / Nov. 2005 128Mbit ...

Page 25

Figure 10: Read1 Operation (Read One Page) Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 9: Status Read Cycle HY27US(08/16)281A Series 25 ...

Page 26

Figure 11: Read1 Operation intercepted by CE# Figure 12: Read2 Operation (Read One Page) Rev 0.6 / Nov. 2005 HY27US(08/16)281A Series 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash 26 ...

Page 27

Figure 13: Sequential Row Read Operation Within a Block Rev 0.6 / Nov. 2005 HY27US(08/16)281A Series 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash 27 ...

Page 28

Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 14: Page Program Operation HY27US(08/16)281A Series 28 ...

Page 29

Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 15 : Copy Back Program HY27US(08/16)281A Series 29 ...

Page 30

Figure 16: Block Erase Operation (Erase One Block) Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 17: Read ID Operation HY27US(08/16)281A Series 30 ...

Page 31

Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 18: Lock Command Figure 19: Unlock Command Sequence HY27US(08/16)281A Series 31 ...

Page 32

Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 20: Lock Tight Command Figure 21: Lock Status Read Timing HY27US(08/16)281A Series 32 ...

Page 33

Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 22: Automatic Read at Power On Figure 23: Reset Operation HY27US(08/16)281A Series 33 ...

Page 34

Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 24: Power On/Off Timing V = 2.5 Volt for 3.3 Volt Supply devices TH HY27US(08/16)281A Series 34 ...

Page 35

Figure 25: Ready/Busy Pin electrical specifications Rev 0.6 / Nov. 2005 HY27US(08/16)281A Series 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash 35 ...

Page 36

Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 26: Lock/Unlock FSM Flow Cart Figure 27: Pointer operations HY27US(08/16)281A Series 36 ...

Page 37

Figure 28: Pointer Operations for porgramming Rev 0.6 / Nov. 2005 HY27US(08/16)281A Series 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash 37 ...

Page 38

System Interface Using CE don’t care To simplify system interface, CE may be deasserted during data loading or sequential data-reading as shown below. So possible to connect NAND Flash to a microprocessor. The only function that was removed ...

Page 39

Bad Block Management Devices with Bad Blocks have the same quality level and the same AC and DC characteristics as devices where all the blocks are valid. A Bad Block does not affect the performance of valid blocks because it ...

Page 40

Write Protect Operation The Erase and Program Operations are automatically reset when WP goes Low (tWW = 100ns, min). The operations are enabled and disabled as follows (Figure 32~35) Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash ...

Page 41

Rev 0.6 / Nov. 2005 HY27US(08/16)281A Series 128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Figure 34: Enable Erasing Figure 35: Disable Erasing 41 ...

Page 42

Figure 36: 48pin-TSOP1 20mm, Package Outline Symbol alpha Table 18: 48pin-TSOP1 20mm, Package Mechanical Data Rev 0.6 / Nov. 2005 128Mbit (16Mx8bit / 8Mx16bit) NAND ...

Page 43

Figure 37. 48pin-USOP1 17mm, Package Outline Symbol alpha Table 19: 48pin-USOP1 17mm, Package Mechanical Data Rev 0.6 / Nov. 2005 HY27US(08/16)281A Series 128Mbit (16Mx8bit / ...

Page 44

MARKING INFORMATION - ...

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