BGF1801-10 NXP Semiconductors, BGF1801-10 Datasheet
BGF1801-10
Specifications of BGF1801-10
Related parts for BGF1801-10
BGF1801-10 Summary of contents
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... DISCRETE SEMICONDUCTORS DATA SHEET M3D737 BGF1801-10 GSM1800 EDGE power module Product specification 2003 Dec 15 ...
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... BGF1801-10 2003 Dec 15 PINNING - SOT365C = (MHz) (V) ( 3.5 PACKAGE DESCRIPTION plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 3 in-line leads 2 Product specification BGF1801-10 PIN DESCRIPTION 1 RF input output Flange ground Top view MBL257 Fig.1 Simplified outline. G ACPR p (dB) (%) (dBc) 25.5 34 (1) 26 ...
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... S L CONDITIONS gain compression = small signal dBm < 1805 MHz, f > 1880 MHz 200 kHz 3.5 W; note 2 L 400 kHz 3.5 W; note Product specification BGF1801-10 MIN. MAX 100 +100 20 +85 unless otherwise specified. MIN. TYP. MAX. 220 255 280 ...
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... P (W) L(AV 1843 MHz. Fig.3 MLE337 6 handbook, halfpage EVM (%) (AV 1843 MHz. Fig.5 4 Product specification BGF1801- (AV) (W) GSM EDGE ACPR at 400 kHz as a function of load power; typical values (AV) (W) GSM EDGE peak EVM as function of average load power; typical values. MLE336 8 MLE338 8 ...
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... D D (%) 30 26 25 1843 MHz Fig.7 MLE341 handbook, halfpage (dB (AV) (W) Fig.9 s-parameters as a function of frequency. 5 Product specification BGF1801- (dB 1843.2 MHz. 2 Two tone gain power and efficiency as functions of load power; typical values 1.68 1.76 1.84 1.92 MLE340 40 D (%) ...
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... The RF input and output of the module are designed for 50 connections. Incoming inspection When incoming inspection is performed, use a properly designed test fixture to avoid excessive mechanical stress and to ensure optimal RF performance. Philips can deliver dedicated test fixtures on request. 6 Product specification BGF1801-10 ...
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... Ferroxcube bead R1 metal film resistor stripline; note Note 1. The striplines are on a double copper-clad printed-circuit board (RO5880) with 2003 Dec output DESCRIPTION 7 Product specification BGF1801-10 CATALOGUE VALUE NUMBER 100 nF 100 4330 030 36300 10 ; 0.4 W 2322 195 13109 50 = 2.2 and thickness = 0.79 mm. r ...
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... Philips Semiconductors GSM1800 EDGE power module handbook, full pagewidth output 50 Dimensions in mm. 2003 Dec DUT Fig.11 Printed-circuit board and component layout. 8 Product specification BGF1801-10 42 input MBL780 ...
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... 4.0 3.3 3.7 3.55 2.54 20.32 3.8 3.1 3.3 3.45 REFERENCES JEDEC JEITA 48.4 15.4 7.75 1.1 41.75 0.3 0.25 48.0 15.2 7.55 0.0 41.65 EUROPEAN PROJECTION Product specification BGF1801-10 SOT365C 12.8 0.1 12.6 ISSUE DATE 01-06-06 02-11-13 ...
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... Product specification BGF1801-10 DEFINITION These products are not Philips Semiconductors ...
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Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited ...