M55302/169C321 Amphenol, M55302/169C321 Datasheet - Page 8

• Manufacturer Part Number: M55302/169C321
• Manufacturer: Amphenol

Specifications of M55302/169C321

• Lead Free Status / Rohs Status: Not Compliant

Low Mating Force
how to order (proprietary types)
MB, DB, IO, PC Connectors
Proprietary Part Number Ordering Procedure
Example part number MB2-120P- ( ) is shown as follows:
Body Type
MB designates Mother Board
DB designates Daughter Board
IO designates Input/Output
PC designates Printed Circuit
Number of Rows
2, 3 or 4 rows
Total Number of Contacts
See Contact Arrangements, pages 8 and 9
Standard Termination Style
(Stickout values below apply to “J” dimension referenced on
LEGEND:
Sn/Ni designates Tin over Nickel
Au/Ni designates Gold over Nickel
Au/Cu designates Gold over Copper
SnPb/Cu designates Tin-Lead over Copper
individual connector catalog pages.)
MBX-XXXP
MBX-XXXW
DBX-XXXP
IOX-XXXC
IOX-XXXP
PCX-XXXP
Body Type
Number of Rows
Total Number of Contacts
Termination Style
Variation Suffix
Straight PCB stud, .021 dia, .113 ±.025 stick-
out, Sn/Ni plate
Solderless wrap, .025 sq., .507 ±.025 stickout,
Sn/Ni plate
90° PCB stud, .021 dia, .085 ±.025 stickout,
Sn/Ni plate
Crimp, rear removable contact, size 22D wire
well, Sn/Ni plate
PCB stud, .021 dia, .145 ±.025 stickout, Sn/Ni
plate
90° PCB stud, .021 dia, .095
Sn/Ni plate
MB
2 -
120
+.035
–.025
P
stickout,
- ( )
6
Variation Suffix
(Stickout values below apply to “J” dimension referenced on
Variation Suffixes continued on next page.
individual connector catalog pages.)
(700)
(701)
(702)
(703)
(704)
(705)
(706)
(707)
(709)
(710)
(711)
(713)
(714)
(715)
(716)
(717)
(718)
(719)
(720)
(721)
(722)
(723)
(724)
(725)
(726)
(727)
(728)
(729)
(730)
(731)
Gold plate in accordance with MIL-G-45204, type
II, .000030 min. thick gold (.000050 for solderless wrap)
over .000050 min. thick nickel (standard
termination length)
Gold plate in accordance with MIL-G-45204, type
II, .000050 min. thick gold over .00015 min. thick
copper (standard termination length)
PCB stud stickout of .145, Sn/Ni plate, MB-P
Au/Ni [same as (700)], PCB stud stickout of .145, MB-P
Au/Cu [same as (701)], PCB stud stickout of .145, MB-P
90° PCB stud, .120 stickout. Sn/Ni plate, DB
Au/Ni [same as (700)], 90° PCB stud .120 stickout, DB
Au/Cu [same as (701)], 90° PCB .120 stickout, DB
PCB stud stickout of .300 DB (90°), .300 MB-P &
.335 IO-P, Sn/Ni plate
Solderless wrap, .025 sq., .665 stickout, Sn/Ni plate,
MB-W
Solderless wrap, .025 sq., .665 stickout, Au/Ni,
[same as (700)], MB-W
PCB stud stickout of .060, Sn/Ni plate, IO-P
90° PCB stud stickout of .150, Sn/Ni plate, PC & DB
Solderless wrap, .025 sq., .665 stickout, Au/Cu
[same as (701)], MB-W
90° PCB stud stickout of .085 matte tin, DB
90° PCB stud stickout of .095 matte tin, PC
90° PCB stud stickout of .120 matte tin, DB
PCB stud stickout of .300 MB-P & .335 IO-P, matte tin
PCB stud stickout of .060 matte tin, IO-P
PCB stud stickout of .500, Sn/Ni plate, IO-P
PCB stud stickout of .356 matte tin, MB-P
PCB stud stickout of .192, Sn/Ni plate, MB-P
90° PCB stud stickout of .095, RTV potted rear,
Sn/Ni plate, PC
90° PCB stud stickout of .120, RTV potted rear,
Sn/Ni plate, DB
90° PCB stud stickout of .150, RTV potted rear,
Sn/Ni plate, PC & DB
PCB stud stickout of .145, RTV potted rear,
Sn/Ni plate, MB-P
PCB stud stickout of .145, Au/Ni, [same as (700)],
RTV potted rear, MB-P
90° PCB stud stickout of .120, Au/Ni, [same as (700)],
RTV potted rear, DB
90° PCB stud stickout of .150, Au/Ni, [same as (700)
above], PC and DB
PCB stud stickout of .145, matte tin, MB-P