LPC2420FBD208-S NXP Semiconductors, LPC2420FBD208-S Datasheet - Page 51

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LPC2420FBD208-S

Manufacturer Part Number
LPC2420FBD208-S
Description
MCU 16-Bit/32-Bit LPC2000 ARM7TDMI-S RISC ROMLess 3.3V 208-Pin LQFP Tray
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC2420FBD208-S

Package
208LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Ram Size
82 KB
Operating Supply Voltage
3.3 V
Data Bus Width
16|32 Bit
Program Memory Type
ROMLess
Number Of Programmable I/os
160
Interface Type
I2C/I2S/SPI/SSP/UART/USB
On-chip Adc
8-chx10-bit
On-chip Dac
1-chx10-bit
Operating Temperature
-40 to 85 °C
Number Of Timers
4
NXP Semiconductors
LPC2420_60_5
Preliminary data sheet
9.1 Power-down mode
Fig 5.
Fig 6.
I
DD(IO)
(μA)
(μA)
I
BAT
−2
−4
40
30
20
10
V
I/O maximum supply current I
RTC battery maximum supply current I
mode
V
4
2
0
0
−40
i(VBAT)
−40
DD(3V3)
= V
= V
DD(DCDC)(3V3)
DD(DCDC)(3V3)
Rev. 05 — 24 February 2010
−15
−15
V
V
i(VBAT)
i(VBAT)
= 3.3 V; T
= 3.3 V; T
= 3.3 V
= 3.0 V
amb
10
10
DD(IO)
amb
= 25 °C.
= 25 °C.
versus temperature in Power-down mode
BAT
Flashless 16-bit/32-bit microcontroller
V
V
DD(3V3)
DD(3V3)
35
35
versus temperature in Power-down
= 3.3 V
= 3.0 V
LPC2420/2460
60
60
temperature (°C)
temperature (°C)
002aae049
002aae050
© NXP B.V. 2010. All rights reserved.
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